Backside contact of sensor microstructures

• US 5,511,428 A
• Filed: 06/10/1994
• Issued: 04/30/1996
• Est. Priority Date: 06/10/1994
• Status: Expired due to Fees

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Massachusetts Institute of Technology
• Inventors: Goldberg, Howard D., Schmidt, Martin A.
• Primary Examiner(s): Chilcot, Richard
• Assistant Examiner(s): MCCALL, ERIC SCOTT
• Application Number:
  US08/257,716
• Time in Patent Office: 690 Days
• Field of Search: 73/754, 73/774, 73/777, 73/862.629, 73/862.632, 338/2, 338/5, 338/6, 338/47
• US Class Current: 73/777
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01B 2210/64 Interconnection or interfacing through or under capping or via rear of substrate in microsensors
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures

Abstract

A sensor microstructure contact scheme is provided for making backside electrical, mechanical, fluidic, or other contact to mechanical microstructures. The contact scheme is applicable to pressure sensors, shear stress sensors, flow rate sensors, temperature sensors, resonant microactuators, and other microsensors and microactuators. The contact scheme provides a microelectromechanical sensor body and support structure for backside contact of the sensor body, and features a support wafer substrate having one or more through-wafer vias each with a lateral span on the dimension of microns and a span that is more narrow at the wafer front surface than at the wafer back surface. An insulating film covers a portion of the support wafer substrate and sidewalls of the vias--with the lateral via span at the front surface being open. The front surface of the support wafer substrate is bonded to the front surface of a sensor body wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through the support wafer substrate vias from the back surface of the support wafer substrate. The sensor body wafer substrate is adapted to define a mechanical sensor microstructure, and comprises a plurality of isolated substrate regions, each region corresponding to one of the support wafer substrate through-wafer vias. Each such region is circumscribed by an edge of the mechanical sensor microstructure and an isolating border region. Contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated and thereby prevented from making contact to any other sensor body substrate region.

Claims

1. A microelectromechanical sensor body and support structure for backside contact of the sensor body, comprising:

a support wafer substrate having at least one through-wafer via with a lateral span on an order of microns and vertically extending from a front surface to a back surface of the support wafer substrate, the lateral via span at the front surface being more narrow than the lateral via span at the back surface, an insulating film covering at least a portion of the support wafer substrate and covering sidewalls of the vias with the lateral via span at the front surface being open, and

a sensor body wafer substrate adapted to define a mechanical sensor microstructure, the sensor body wafer substrate comprising a plurality of substrate regions, each of the support wafer substrate through-wafer vias corresponding to a substrate region and at least one of the substrate regions being circumscribed by an edge of the mechanical sensor microstructure and an isolating border region, the sensor body wafer substrate having a front surface bonded to the front surface of the support wafer substrate, such that contact of the front surface of the sensor body wafer substrate may be made through a support wafer substrate via from the back surface of the support wafer substrate, contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions being isolated and thereby prevented from making contact to any other sensor body substrate region except through the sensor microstructure.

2. The sensor body and support structure of claim 1 wherein the isolating border regions circumscribing isolated sensor body wafer substrate regions each comprise a trench in the sensor body wafer substrate, the trench exposing the support wafer substrate, such that contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions is isolated by the trenches and thereby prevented from making contact to any other sensor body substrate region except through the sensor microstructure.

3. The sensor body and support structure of claim 2 wherein each of the sensor body substrate regions comprises a conducting region that is electrically isolated from the other conducting regions by the trench circumscribing the region, whereby electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate conducting regions is prevented from making electrical contact to any other sensor body substrate region except through the sensor microstructure.

4. The sensor body and support structure of claim 1 wherein the support wafer substrate through-wafer vias are formed by a fabrication process in which the vias are first formed and then the sensor body wafer substrate is bonded to the support wafer substrate.

5. The sensor body and support structure of claim 4 wherein the mechanical sensor microstructure is formed by a fabrication process in which the microstructure is formed after the sensor body wafer substrate is bonded to the support wafer substrate.

6. The sensor body and support structure of claim 1 wherein mechanical contact is made to the sensor body wafer substrate through the support wafer vias.

7. The sensor body and support structure of claim 1 wherein fluid contact is made to the sensor body wafer substrate through the support wafer vias.

8. The sensor body and support structure of claim 1 wherein electrical contact is made to the sensor body wafer substrate through the support wafer vias.

9. The sensor body and support structure of claim 8 wherein a conducting film covers the insulating film on the sidewalls of the through-wafer vias.

10. The sensor body and support structure of claim 1 wherein the support wafer substrate and the sensor body wafer substrate each comprises a silicon substrate and the insulating film covering at least a portion of the support wafer substrate comprises an oxide film, and further comprising a polycrystalline conducting film covering the oxide film on the sidewalls of the through-wafer vias.

11. The sensor body and support structure of claim 10 further comprising a high-temperature conducting film covering the polycrystalline conducting film on the sidewalls of the through-wafer vias.

12. The sensor body and support structure of claim 10 wherein the oxide film covering the support wafer substrate includes an opening in the oxide film on the front surface of the support wafer substrate, the opening exposing the front surface of the support wafer substrate and resulting in a trench, defined by the opening, over which the mechanical sensor body microstructure is suspended.

13. The sensor body and support structure of claim 12 wherein the front surface of the support wafer substrate exposed by the opening in the oxide film is grooved to extend the trench over which the mechanical sensor body microstructure is suspended to a depth below the front surface of the support wafer substrate.

14. The sensor body and support structure of claim 10 wherein the front surface of the sensor body wafer substrate is doped to provide an etch stop layer, such that etching of the back surface of the sensor body wafer substrate terminates at the doped etch stop layer.

15. The sensor body and support structure of claim 10 wherein the front surface of the sensor body wafer substrate comprises an insulating dielectric etch stop layer, such that etching of the back surface of the sensor body wafer substrate terminates at the dielectric etch stop layer.

16. The sensor body and support structure of claim 14 wherein the oxide film covering the support wafer substrate includes an opening in the oxide film on the back surface of the support wafer substrate, the opening exposing the back surface such that electrical contact may be made to the support wafer substrate through the opening.

17. The sensor body and support structure of claim 12 wherein the mechanical sensor body microstructure comprises a plate having a thickness on an order of microns suspended over the trench in the oxide film on the support wafer substrate front surface.

18. The sensor body and support structure of claim 17 wherein the plate comprises a floating element, first selected peripheral portions of which are released from surrounding areas of the sensor body wafer substrate and second selected portions of which are each tethered by an arm to a corresponding one of the isolated sensor body substrate regions, such that electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions and tether arms is isolated and thereby prevented from making contact to any other sensor body substrate region and tether arm except through the floating element, the floating element being free to move laterally in response to an applied force in a direction parallel to the front surface of the sensor body wafer substrate.

19. The sensor body and support structure of claim 18 wherein the floating element comprises a shear stress sensor tethered by a plurality of arms, at least two of the arms being electrically doped to define piezoresistive elements on the arms, each piezoresistive element exhibiting a characteristic resistance that changes resistivity in response to lateral movements of the floating element when a voltage is applied across the tether arms by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding isolated sensor body substrate regions and tether arms.

20. The sensor body and support structure of claim 17 wherein the plate comprises a plurality of distinct floating elements forming a shear stress sensor, first selected peripheral portions of each of the floating elements being released from surrounding areas of the sensor body wafer substrate and second selected portions each of which are tethered by an arm to a corresponding one of the isolated sensor body substrate regions, such that electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions and tether arms is isolated and thereby prevented from making contact to any other sensor body substrate region and tether arm except through a floating element, each floating element being free to move laterally in response to force in a direction parallel to the front surface of the sensor body wafer substrate, at least two of the arms of each of the floating elements being electrically doped to define piezoresistive elements on the arms, each piezoresistive element exhibiting a characteristic resistance that changes resistivity in response to lateral movements of the corresponding floating element when a voltage is applied across the tether arms by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding isolated sensor body substrate regions and tether arms.

21. The sensor body and support structure of claim 18 wherein the trench in the oxide film on the front surface of the support wafer substrate comprises at least one conducting region positioned such that isolated electrical contact may be made to the conducting region, and further wherein the floating element comprises a shear stress sensor defining a capacitor between the floating element and each of the conducting regions, each capacitor changing its capacitance in response to lateral movements of the floating element when a voltage is applied across the tether arms of the floating element by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding isolated substrate regions and tether arms, and contact to the conducting regions.

22. The sensor body and support structure of claim 21 wherein the conducting regions each comprise a dielectrically isolated conducting pad positioned with respect to a corresponding through-wafer via such that isolated electrical contact may be made to the conducting pad through the corresponding through-wafer via.

23. The sensor body and support structure of claim 22 wherein each conducting pad is coated with a dielectric layer.

24. The sensor body and support structure of claim 17 wherein the plate comprises a thermal flow rate sensor microbridge, first selected peripheral portions of which are released from surrounding areas of the sensor body wafer substrate and second selected portions of which are each clamped to a corresponding one of the isolated sensor body substrate regions, such that electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions and microbridge clamps is isolated and thereby prevented from making contact to any other sensor body substrate region and microbridge clamp except through the microbridge, a selected area of the microbridge being electrically doped to define a suspended resistive element which exhibits a characteristic resistance, the resistance changing in response to changes in temperature of the resistive element resulting from flow of a fluid stream across the microbridge while a current source is connected across the element by electrical contact from the back surface of the support wafer substrate through the support wafer vias to corresponding isolated sensor body regions and microbridge clamps.

25. The sensor body and support structure of claim 17 wherein the plate comprises a temperature transducer microbridge, first selected peripheral portions of which are released from surrounding areas of the sensor body wafer substrate and second selected portions of which are each clamped to a corresponding one of the isolated sensor body substrate regions, such that electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions and microbridge clamps is isolated and thereby prevented from making contact to any other sensor body substrate region and microbridge clamp except through the microbridge, a selected area of the microbridge being electrically doped to define a suspended resistive element which exhibits a characteristic resistance, the resistance changing in response to changes in temperature of the microbridge resulting from changes in ambient temperature while a current source is connected across the element, and the temperature of the microbridge changing in response to changes in resistance of the resistive element resulting from changes in applied level of the current source, connection of the current source made by electrical contact from the back surface of the support wafer substrate through the support wafer vias to corresponding isolated sensor body regions and microbridge clamps.

26. The sensor body and support structure of claim 24 wherein the front surface of the support wafer substrate exposed by the opening in the oxide film is grooved to extend the trench over which the sensor body microbridge is suspended to a depth below the front surface of the support wafer substrate.

27. The sensor body and support structure of claim 17 wherein the plate comprises a pressure sensor diaphragm free to move in a vertical direction perpendicular to the front surface of the sensor body wafer substrate, selected portions of peripheral edges of which are electrically doped to define piezoresistive elements, each piezoresistive element positioned with respect to a corresponding through-wafer via such that isolated electrical contact to the element may be made through the corresponding via, each piezoresistive element exhibiting a characteristic resistance that changes in response to vertical movement of the diaphragm when a voltage is applied across the piezoresistive elements by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the resistive elements.

28. The sensor body and support structure of claim 17 wherein the trench in the oxide film on the front surface of the support wafer comprises at least one conducting region positioned such that isolated electrical contact may be made to the conducting region, and further wherein the plate comprises a pressure sensor diaphragm free to move in a vertical direction perpendicular to the front surface of the sensor body wafer substrate and defining a capacitor between the diaphragm and each conducting region having a characteristic capacitance, the capacitance changing in response to vertical movements of the diaphragm when a voltage is applied across the capacitor by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding substrate and conducting regions.

29. The sensor body and support structure of claim 28 wherein the conducting regions each comprise a dielectrically isolated conducting pad positioned with respect to a corresponding through-wafer via such that isolated electrical contact may be made to the conducting pad through the corresponding through-wafer via.

30. The sensor body and support structure of claim 29 wherein each conducting pad is coated with a dielectric layer.

31. The sensor body and support structure of claim 18 wherein the floating element comprises a resonant element tethered by a plurality of arms, the resonant element laterally resonating in response to application of an AC voltage between the floating element and an area of the front surface of the sensor body wafer substrate not suspended over the trench in the oxide film on the front surface of the support wafer substrate by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding isolated sensor body substrate regions.

32. The sensor body and support structure of claim 31 wherein the trench in the oxide film on the front surface of the support wafer substrate comprises at least one conducting region positioned such that isolated electrical contact may be made to the conducting region, the resonant element defining a capacitor between the element and each conducting region, each capacitor exhibiting a characteristic capacitance that changes in response to lateral movement of the resonant element when a voltage is applied across the capacitor by electrical contact from the back surface of the support wafer substrate through the support wafer vias to the corresponding isolated substrate region and the conducting regions, the capacitors providing means for control of the movement of the resonant element by application of a voltage which changes the capacitance of the capacitors.

33. The sensor body and support structure of claim 32 wherein the conducting regions each comprise a dielectrically isolated conducting pad positioned with respect to a corresponding through-wafer via such that isolated electrical contact may be made to the conducting pad through the corresponding through-wafer via.

34. The sensor body and support structure of claim 33 wherein each conducting pad is coated with a dielectric layer.

35. The sensor body and support structure of claim 10, fabricated by a process comprising the steps of:

forming an oxide layer on surfaces of the support wafer substrate, including the front surface and the back surface of the support wafer substrate,

forming a layer of nitride on the oxide layer,

photolithographically patterning and etching the oxide and nitride layers on the back surface of the support wafer to define locations of the vias on the back surface of the support wafer,

anisotropically etching the support wafer until the vias extend completely through the support wafer from the back surface to the oxide layer covering the front surface of the support wafer,

etching the oxide layer covering the front surface of the support wafer at locations of the vias on the front surface so that the lateral extent of each of the vias at the front surface is open,

forming an oxide layer on sidewalls of the etched vias, and

etching the nitride layer to remove the nitride from the oxide layer.

36. The sensor body and support structure of claim 35 fabricated by a process further comprising the process step of encapsulating the support wafer substrate in a nitride film after removing the nitride layer from the oxide layer.

37. The sensor body and support structure of claim 35 fabricated by a process further comprising the process step of high-temperature wafer bonding the front surface of the sensor body wafer substrate to the front surface of the support wafer substrate.

38. The sensor body and support structure of claim 37 fabricated by a process further comprising the process step of photolithographically patterning and etching the oxide layer on the front surface of the support wafer substrate to define an opening in the oxide layer before forming the layer of nitride on the oxide layer, the opening exposing the front surface of the support wafer substrate and resulting in a trench, defined by the opening, over which the mechanical sensor body microstructure is suspended once the sensor body wafer substrate is high-temperature wafer bonded to the support wafer substrate.

39. The sensor body and support structure of claim 38 fabricated by a process further comprising the process steps of:

etching the sensor body wafer substrate from a back surface opposite the front surface of the sensor body wafer substrate to remove a substantial thickness of the sensor body wafer substrate and leave a plate, having a thickness on a dimension of microns, suspended over the trench on the front surface of the support wafer substrate,

patterning and etching the sensor body wafer substrate to produce isolating border trenches circumscribing isolated sensor body substrate regions, and

patterning and etching the plate to produce a floating element having first selected peripheral portions released from surrounding areas of the sensor body wafer substrate and second selected portions each tethered by an arm to a corresponding one of the isolated sensor body substrate regions, such that electrical contact made through one of the support wafer substrate through-wafer vias to the corresponding one of the sensor body substrate regions and tether arms is isolated and thereby prevented from making contact to any other sensor body substrate region and tether arm, the floating element being free to move laterally in response to an applied force in a direction parallel to the front surface of the sensor body wafer substrate.

40. The sensor body and support structure of claim 39 fabricated by a process further comprising the process step of photolithographically patterning and etching the oxide layer on the back surface of the support wafer substrate to define an opening in the oxide layer before forming the layer of nitride on the oxide layer, the opening exposing the back surface of the support wafer substrate for contact to the substrate during process steps and sensor operation,

and wherein the step of etching the sensor body wafer substrate to remove a substantial thickness of the sensor body wafer substrate comprises electrochemical etching, during which electrical contact is made to the support wafer substrate through the opening in the oxide layer on the back surface of the support wafer substrate and electrical contact is made to the sensor body wafer substrate through a support wafer substrate through-wafer via.

41. The sensor body and support structure of claim 39 fabricated by a process further comprising the process step of forming a high-temperature conducting film on the sidewalls of the through-wafer vias.

42. The sensor body and support structure of claim 39 fabricated by a process further comprising the process step of forming at least one conducting pad in the trench in the oxide layer on the front surface of the support wafer substrate.

43. The sensor body and support structure of claim 39 fabricated by a process further comprising the process step of electrically doping the isolated sensor body substrate regions.