Process of joining metal members
First Claim
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1. A process of joining metal members, comprising the steps of:
- providing a first group of a plurality of metal members, each metal member having a solder bead formed thereon;
providing a second group of a plurality of metal members, each metal member of said second group having a solder bead formed thereon;
abutting said first group of metal members against said second group of metal members by direct contact between said solder beads;
applying ultrasonic vibration through said solder beads of said first and second groups of metal members;
terminating said application of ultrasonic vibration; and
thereafter,heating and thereby fusing said solder beads to join said first and second groups of metal members.
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Abstract
A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.
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Citations
5 Claims
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1. A process of joining metal members, comprising the steps of:
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providing a first group of a plurality of metal members, each metal member having a solder bead formed thereon; providing a second group of a plurality of metal members, each metal member of said second group having a solder bead formed thereon; abutting said first group of metal members against said second group of metal members by direct contact between said solder beads; applying ultrasonic vibration through said solder beads of said first and second groups of metal members; terminating said application of ultrasonic vibration; and
thereafter,heating and thereby fusing said solder beads to join said first and second groups of metal members. - View Dependent Claims (2)
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3. A process of joining a first group of metal members forming part of a circuit pattern of a first, generally flexible circuit board to a second group of metal members forming part of a circuit pattern of a second, generally rigid circuit board, the process comprising the steps of:
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abutting said first group of metal members against said second group of metal members; applying a buffer material to a surface of said first circuit board; applying ultrasonic vibration through said buffer material to said metal members of said first group and said second group in a zone in which said metal members are abutted; terminating said application of ultrasonic vibration; and
thereafter,heating and thereby fusing said metal members to join said first and second groups of metal members. - View Dependent Claims (4, 5)
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Specification