Method for manufacturing a probe

• US 5,513,430 A
• Filed: 08/19/1994
• Issued: 05/07/1996
• Est. Priority Date: 08/19/1994
• Status: Expired due to Fees

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Yanof, Arnold W., Dauksher, William
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/293,365
• Time in Patent Office: 627 Days
• Field of Search: 174/260, 29/846, 29/407, 437/8
• US Class Current: 29/846
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09836 Oblique hole, via or bump
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2203/0542 Continuous temporary metal layer over metal pattern reinforcing the conductive pattern characterised by the electroplating method H05K3/241
• CPC Class Codes: H05K 2203/0577 Double layer of resist having the same pattern
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A probe card (40, 55) having probe card probes (36, 56) and a method for fabricating the probe card probes (36, 56). A layer of resist (23) is formed on a plating base (21). The layer of resist (23) is exposed to radiation (32) and developed to provide angled, tapered openings (33) exposing portions of the plating base (22). An electrically conductive material is electroplated on the exposed portions of the plating base (22) and fills the angled, tapered openings (33). The layer of resist (23) and portions of the plating base (22) between the electroplated conductive material are removed. The electrically conductive material forms the probe card probes (36) which are angled and tapered. In addition, the compliant probe card probes (56) may be stair-step shaped.

Claims

1. A method for manufacturing a probe, comprising the steps of:

providing a support structure having a first surface and at least one contact pad;

forming a first layer of resist over the first surface and the at least one contact pad;

forming at least one opening through the first layer of resist, the at least one opening having a longitudinal axis that makes an acute angle with the first surface;

filling the at least one opening with a conductive material; and

removing at least a portion of the first layer of resist adjacent the conductive material, wherein the conductive material serves as the probe.

2. The method of claim 1, wherein the step of forming a first layer of resist over the first surface comprises the steps of:

forming a plating base on the first surface and on the at least one contact pad; and

forming the first layer of resist on the plating base.

3. The method of claim 2, wherein the step of removing at least a portion of the first layer of resist includes removing the plating base adjacent the at least one contact pad, wherein the first surface is uncovered.

4. The method of claim 1, wherein the step of forming at least one opening through the first layer of resist includes exposing a portion of the first layer of resist to radiation, wherein the radiation arriving at the first layer of resist forms an acute angle with a major surface of the first layer of resist and removing the exposed portion of the first layer of resist.

5. The method of claim 1, wherein the step of exposing a portion of the first layer of resist to radiation includes exposing the first layer of resist to X rays.

6. The method of claim 1, wherein the step of removing at least a portion of the first layer of resist includes removing substantially all of the first layer of resist over the first surface.

7. The method of claim 1, wherein the step of forming at least one opening includes forming the at least one opening having a tapered shape.

8. The method of claim 1, wherein the step of filling the at least one opening includes electroplating a metal selected from the group of gold, nickel, palladium, copper, and tin.

9. The method of claim 1, wherein the step of filling the at least one opening includes partially filling the at least one opening with nickel and partially filling the at least one opening with one of gold or palladium, wherein the one of gold or palladium covers the nickel.

10. The method of claim 1, wherein the steps of forming at least one opening through the first layer of resist and filling the at least one opening with a conductive material comprise the steps of:

exposing a portion of the first layer of resist with radiation;

removing the exposed portion of the first layer of resist to form a first opening;

filling the first opening with a first conductive material;

forming a second layer of resist on the first layer of resist and the conductive material;

exposing a portion of the second layer of resist, wherein the portion of the second layer of resist overlaps an edge of the conductive material;

removing the exposed portion of the second layer of resist to form a second opening; and

filling the second opening with a second conductive material.

11. The method of claim 10, wherein the steps of exposing the portion of the first layer of resist and the portion of the second layer of resist include exposing the portion of the first layer of resist and the portion of the second layer of resist to ultraviolet radiation.

12. The method of claim 10, wherein the steps of filling the first opening and filling the second opening include using the same conductive material for the first conductive material and the second conductive material.

13. A method for manufacturing a probe for mating with an integrated device, comprising the steps of:

providing a support structure having a first surface and a contact pad formed thereon;

covering the first surface and the contact pad with a plating base;

covering the plating base with a layer of resist;

forming an opening through a portion of the layer of resist to uncover at least a portion of the contact pad, wherein the opening has a non-normal longitudinal axis to the contact pad;

filling the opening with at least one conductive material, the at least one conductive material serving as the probe; and

removing a portion of the plating base adjacent the probe.

14. The method of claim 13, wherein the step of covering the plating base includes covering the plating base with a material selected from the group polymethylmethacrylate, fluorinated polybutylmethacrylate, polymethacrylimide, polyoxymethylene, and polyalkensulfone.

15. The method of claim 13, wherein the step of forming an opening through a portion of the layer of resist comprises exposing a portion of the layer of resist to X rays.

16. The method of claim 13, wherein the step of filling the opening includes electroplating a metal onto the at least a portion of the contact pad that is uncovered.

17. The method of claim 13, wherein the step of forming an opening through a portion of the layer of resist includes forming an opening having a tapered shape.