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Test device and method for signalling metal failure of semiconductor wafer

  • US 5,514,974 A
  • Filed: 10/12/1994
  • Issued: 05/07/1996
  • Est. Priority Date: 10/12/1994
  • Status: Expired due to Fees
First Claim
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1. A test device for signalling possible metal failure of a semiconductor wafer, said test device comprising:

  • a metal monitor structure prone to metal failure;

    a metal control structure resistant to metal failure such that said metal control structure is less prone to metal failure than said metal monitor structure; and

    wherein said metal monitor structure and said metal control structure have substantially identical resistances without metal failure of said metal monitor structure and a resistance difference upon metal failure of said metal monitor structure, said resistance difference signalling possible metal failure of said semiconductor wafer.

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