Multilayered inductor

• US 5,515,022 A
• Filed: 08/03/1994
• Issued: 05/07/1996
• Est. Priority Date: 05/13/1991
• Status: Expired due to Term

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Kaneko, Akira, Tashiro, Kouji
• Primary Examiner(s): Kincaid, Kristine L.
• Assistant Examiner(s): TSO, LAURA K
• Application Number:
  US08/285,766
• Time in Patent Office: 643 Days
• Field of Search: 336/200, 336/232, 174/262
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0013 with stacked layers

Abstract

A multilayer inductor 1 is fabricated, for example, by sandwiching a first magnetic material sheet (21) between a second magnetic material sheet (22) and a third magnetic material sheet (23) and integrating the three layers. The first magnetic material sheet (21) is preferably at least 0.2 mm thick and has a first spiral conductor pattern (31) having an extreme lead-out portion (310) formed on its upper major surface. The first sheet (21) is provided with a through-hole (4) extending between the opposed major surfaces and having a larger diameter on the conductor pattern bearing surface. The through-hole (4) is filled with a conductor (35) contiguous to the first conductor pattern (31). The second magnetic material sheet (22) has a second spiral conductor pattern (32) having an extreme lead-out portion (320) formed on its upper major surface and connected to the conductor (35) in the through-hole (4). The magnetic material sheets (21, 22) on their major surfaces having the first and second conductor patterns (31, 32) formed thereon are provided with dummy conductor patterns (61, 65) which are spaced from and opposed to the extreme lead-out portions (310, 320), respectively, and external electrodes are connected. Benefits include easy fabrication, safe connection, least property variation, improved manufacturing yield and reliability.

Claims

1. A multilayer inductor comprising:

a plurality of integrally stacked magnetic material sheets, each one of said plurality of integrally stacked magnetic material sheets having a conductor pattern with an extreme lead-out portion and a dummy conductor pattern spaced apart from said conductor pattern and disposed in substantial registry with said extreme lead-out portion formed on an upper surface thereof;

a through-hole formed completely through each one of said plurality of integrally stacked magnetic material sheets except a bottom one of said plurality of integrally stacked magnetic material sheets, said through-hole being formed at a position where said conductor patterns formed on surfaces of each one of said integrally stacked magnetic material sheets are vertically aligned and being filled with a conductive material that contacts said conductor patterns formed on surfaces of each one of said plurality of integrally stacked magnetic material sheets; and

external electrodes connected to said extreme lead-out portion of each one of said conductor patterns.

2. A multilayer inductor according to claim 1 wherein said through-hole has a diameter r₀ at an upper surface of a top one of said plurality of integrally stacked magnetic material sheets and a diameter of r₁ at an upper surface of said bottom one of said plurality of integrally stacked magnetic material sheets, r₀ being greater than r₁.

3. A multilayer inductor according to claim 2, wherein the ratio r₀ /r₁ is in the range of 1.2 to 1.7.

4. A multilayer inductor according to claim 1, wherein each of one said plurality of integrally stacked magnetic material sheets has a thickness of at least 0.2 millimeters.

5. A multilayer inductor according to claim 4, comprising exactly three integrally stacked magnetic material sheets of approximately equal thickness, a metal thickness of said multilayer inductor being in the range of 0.5 millimeters to 2 millimeters.

6. A multilayer inductor according to claim 5, wherein each one of said conductive patterns is formed in a rectangular spiral shape and interconnected via said conductive material filling said through-hole so as to form a continuous rectangular spiral of at least 21/4 total turns.

7. A multilayer inductor according to claim 2, further comprising pads located at points of connection between each one of said conductor patterns and said conductive material filling said through-hole, said pads being wider than a pattern width of each one of said conductor patterns.

8. A multilayer inductor comprising:

a plurality of integrally stacked magnetic material sheets, each one of said plurality of integrally stacked magnetic material sheets having a conductor pattern with an extreme lead-out portion formed on an upper surface thereof and having a thickness of at least 0.2 millimeters;

a through-hole formed completely through each of said plurality of integrally stacked magnetic material sheets except a bottom one of said plurality of integrally stacked magnetic material sheets, said through-hole being formed at a position where said conductor patterns formed on surfaces of each one of said integrally stacked magnetic material sheets are vertically aligned and being filled with a conductive material that contacts said conductor patterns formed on surfaces of each one of said plurality of integrally stacked magnetic material sheets;

external electrodes connected to said extreme lead-out portion of each one of said conductor patterns; and

pads located at points of connection between each one of said conductor patterns and said conductive material filling said through-hole, said pads being wider than a pattern width of each one of said conductor patterns.

9. A multilayer inductor according to claim 8, wherein said through-hole has a diameter r₀ at an upper surface of a top one of said plurality of integrally stacked magnetic material sheets and a diameter of r₁ at an upper surface of said bottom one of said plurality of integrally stacked magnetic material sheets, r₀ being greater than r₁.

10. A multilayer inductor according to claim 9, wherein the ratio r₀ /r₁ is in the range of 1.2 to 1.7.

11. A multilayer,inductor according to claim 8, comprising exactly three integrally stacked magnetic material sheets of approximately equal thickness, a total thickness of said multilayer inductor being in the range of 0.5 millimeters to 2 millimeters.

12. A multilayer inductor according to claim 11, wherein each one of said conductor patterns is formed in a rectangular spiral shape and interconnected via said conductive material filling said through-hole so as to form a continuous rectangular spiral of at least 21/4 total turns.

13. A multilayer inductor according to claim 11, wherein said through-hole is formed through a central area of each of said plurality of integrally stacked magnetic material sheets, and wherein said conductor patterns form a continuous rectangular spiral of at least one turn.

14. A multilayer inductor according to claim 10, wherein said diameter r₁ is in the range of 50-200 micrometers, said pads have a width in the range of 150-400 micrometers, and said conductor patterns have a width in the range of 50-300 micrometers.