Process for preparing schottky diode contacts with predetermined barrier heights

• US 5,516,725 A
• Filed: 06/30/1993
• Issued: 05/14/1996
• Est. Priority Date: 03/17/1992
• Status: Expired due to Term

• Current Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Original Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Inventors: Chang, Y. Austin, Chen, Chia-Ping, Jan, Chia-Hong
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): GURLEY, LYNNE ANN
• Application Number:
  US08/085,622
• Time in Patent Office: 1,049 Days
• Field of Search: 437/176, 437/179
• US Class Current: 438/572
• CPC Class Codes: C22C 19/00 Alloys based on nickel or cobalt
• CPC Class Codes: C22C 5/04 Alloys based on a platinum group metal
• CPC Class Codes: C23C 14/185 by cathodic sputtering
• CPC Class Codes: H01L 29/475 on AIII-BV compounds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A process is provided for producing a Schottky diode having a preselected barrier height φ_Bn. The substrate is preferably n-GaAs, the metallic contact is derived from a starting alloy of the Formula [ΣM.sub.δ ](Al_x Ga_1-x) wherein: ΣM is a moiety which consists of at least one M, and when more than one M is present, each M is different, M is a Group VIII metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, indium and platinum, δ is a stoichiometric coefficient whose total value in any given ΣM moiety is 1, and x is a positive number between 0 and 1 (that is, x ranges from greater than 0 to less than 1). Also, the starting alloy is capable of forming with the substrate a two phase equilibrium reciprocal system of the binary alloy mixture [ΣM.sub.δ ]Ga-[ΣM.sub.δ ]Al-AlAs-GaAs. When members of an alloy subclass within this Formula are each preliminarily correlated with the barrier height φ_Bn of a contact producable therewith, then Schottky diodes of predetermined barrier heights are producable by sputtering and annealing. Further provided are the product Schottky diodes that are produced according to this process.

Claims

1. A process for producing a Schottky metal contact for a Schottky diode upon one surface of a monocrystalline semiconductive substrate wherein the interrelationship between the resulting combination comprised of said metal contact and said substrate is such that said combination has a Schottky barrier height φ

_Bn that is in the range of about 0.6 to about 1 eV, said method comprising the steps of;

(a) sputtering a contact upon a localized surface area of a monocrystalline semiconductive substrate which is comprised of a compound of the formula;

space="preserve" listing-type="equation">Al.sub.y Ga.sub.1-v As

where v is a positive number ranging from and including 0 through 1 inclusive.

said contact being comprised of an alloy of the formula;

space="preserve" listing-type="equation">{Σ

M.sub.δ

}(Al.sub.x Ga.sub.1-x)

where;

Σ

M.sub.δ

is a moiety which consists of at least one M, and when more than one M is present, each M is different,

M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rbodium, iridium and platinum,

δ

is a stoichiometric coefficient whose total value in any given Σ

M.sub.δ

moiety is 1, and

x is a positive number that ranges from greater than 0 to less than 1;

said alloy having the capacity when in combination with a substrate compound as defined above to exist as a two phase binary equilibrium reciprocal system having the formula;

space="preserve" listing-type="equation">{Σ

M.sub.δ

}Ga-{Σ

M.sub.δ

}Al-AlAs-GaAs

where;

Σ

M.sub.δ

, M and δ

are as defined above,

said sputtering being continued until a layer of said alloy is coated on said area; and

(b) annealing said substrate at a temperature in the range of about 300°

C. to about 850°

C. for a selected time, the relationship between said alloy and said substrate and said sputtering and said annealing being such that after said annealing;

a metallic semiconductive interlayer is defined in a region located between said substrate and said alloy,

said interlayer has a thickness in the range of about 80 to about 105 Å

, and

said interlayer contains aluminum, gallium and arsenic;

thereby to produce said contact upon said substrate, wherein, after said contact is produced, said contact has a Schottky barrier height φ

_Bn that is in said range of about 0.6 to about 1 eV, and wherein prior to said sputtering, the following steps are carried out;

(1) correlating for each one of a series of alloys of one subclass of said alloy formula whose members differ from one another in composition the respective barrier height φ

_Bn of each said contact produced therefrom on said substrate under controlled conditions of said sputtering and said annealing, and then

(2) selecting a prechosen Schottky barrier height and comparing said prechosen Schottky barrier height φ

_Bn to said correlation so that one alloy of said one alloy subclass which produces said prechosen barrier height is identified, and then

(3) using said identified one alloy of said one alloy subclass to produce said contact upon said selected substrate.

2. The process of claim 1 wherein said localized area has a size in the range of about 0.01 to about 20 mm² and said alloy is coated during said sputtering on said area to a thickness in the range of about 0.05 to about 0.3 micron.

3. The process of claim 1 wherein said localized area has a size which is in the range of about 10^-7 to about 10^-2 mm² and said layer of said alloy has a thickness which is not more than about 0.05 micron.

4. The process of claim 1 wherein said annealing is carried out in a rapid thermal annealing furnace within a time of not more than about 2 minutes.

5. The process of claim 1 wherein said annealing is carried out in an annealing oven using a time of at least about 2 minutes.

6. The process of claim 1 wherein said series of alloys of said subclass is characterized by having the subclass series formula:

space="preserve" listing-type="equation">Ni(Al.sub.x Ga.sub.1-x)

where x is as defined above, said substrate comprises n-GaAs, and the relationship between product barrier height φ

_Bn and said subclass series formula is represented by the empirical approximate equation;

space="preserve" listing-type="equation">I-V φ

.sub.Bn.sup.1-V =0.3247x/(0.1538+x)+0.68.

7. The process of claim 1 wherein said series of alloys of said subclass is characterized by having the subclass series formula:

space="preserve" listing-type="equation">Ni.sub.y Co.sub.1-y Al.sub.x Ga.sub.1-x

where y is a positive number in the range from greater than 0 to less than 1 and x is as defined above, said substrate comprises n-GaAs, and the relationship between product barrier height φ

_Bn and said subclass series formula is represented by the empirical equation;

space="preserve" listing-type="equation">φ

.sub.Bn.sup.I-V =0.325x/(0.1538+x)+0.72.

8. A process for producing a Schottky diode having a desired barrier height φ

_Bn upon a monocrystalline semiconductive substrate that is comprised of a compound of the formula;

space="preserve" listing-type="equation">Al.sub.v Ga.sub.l-v As

where v is a positive number ranging from and including 0 through 1 inclusive, said process comprising the steps of;

(a) selecting an alloy subclass from the following class of alloys;

space="preserve" listing-type="equation">{Σ

M.sub.δ

}(Al.sub.x Ga.sub.1-lx)

where;

Σ

M.sub.δ

is a moiety which consists of at least one M, and when more than one M is present, each M is different,

M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,

δ

is a stoichiometric coefficient whose total value in any given Σ

M.sub.δ

moiety is 1, and

x is a positive number between 0 and 1 and which said alloy subclass has the capacity in combination with said substrate to exist as a two phase binary equilibrium reciprocal system of the formula;

space="preserve" listing-type="equation">{Σ

M.sub.δ

}Ga-{Σ

M.sub.δ

}Al-AlAs-GaAs

where;

Σ

M.sub.δ

, M and δ

are as defined above,

(b) determining the correlation between representative member alloys of said subclass and the respective barrier heights φ

_Bn that are associated with contacts produced therefrom upon a substrate of the formula Al_v Ga_1-v As, and then

(c) selecting a barrier height φ

_Bn for a Schottky diode;

(d) comparing said selected barrier height φ

_Bn to said correlation and selecting with said correlation one alloy composition which is within said alloy subclass and which will produce a contact having said selected barrier height φ

_Bn upon said substrate; and

(e) producing with said one alloy composition said contact upon said substrate by a process step sequence of sputtering followed by annealing.

9. The process of claim 8 wherein said steps (d) and (e) are carried out automatically after said step (c) is completed.

10. The process of claim 8 wherein said determining is carried out by the steps of:

(a) preparing members of a series of alloys which are members of said subclass and wherein said member alloys have compositions which differ from one another systematically;

(b) producing a contact comprised of each one of said member alloys of said series on said substrate by said process step sequence;

(c) measuring the barrier height φ

_Bn of each produced said contact; and

(d) comparing each said measured barrier height φ

_Bn to said member composition employed in forming same, thereby to establish said correlation.

11. The process of claim 8 wherein said determining is carried out by making phase equilibrium determinations and bulk diffusion measurements for said representative member alloys and then estimating from said determinations and said measurements the barrier height φ

_Bn of a contact formed from each said representative member alloy on said substrate, thereby to establish said correlation.

12. A process for producing a Schottky metal contact for a Schottky diode upon one surface of a monocrystalline semiconductive substrate wherein the interrelationship between the resulting combination comprised of said metal contact and said substrate is such that said combination has a Schottky barrier height φ

_Bn that is in the range of about 0.6 to about 1 eV, said method comprising the steps of;

(a) sputtering a contact upon a localized surface area of a monocrystalline semiconductive substrate which is comprised of a compound of the formula;

space="preserve" listing-type="equation">Al.sub.v Ga.sub.1-v As

where v is a positive number ranging from and including 0 through 1 inclusive,

said contact being comprised of an alloy of the formula;

space="preserve" listing-type="equation">{Σ

M.sub.γ

}(Al.sub.x Ga.sub.1-x)

where;

Σ

M.sub.δ

is a moiety which consists of at least one M, and when more than one M is present, each M is different,

M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,

δ

is a stoichiometric coefficient whose total value in any given Σ

M.sub.δ

moiety is 1, and

x is a positive number that ranges from greater than 0 to less than 1;

said alloy having the capacity when in combination with a substrate compound as defined above to exist as a two phase binary equilibrium reciprocal system having the formula;

{Σ

M.sub.δ

}Ga-{Σ

M.sub.δ

}Al-AlAs-GaAs

where;

Σ

M.sub.δ

, M and δ

are as defined above,

said sputtering being continued until a layer of said alloy is coated on said area; and

(b) annealing said substrate at a temperature in the range of about 300°

C. to about 850°

C. for a selected time, the relationship between said alloy and said substrate and said sputtering and said annealing being such that after said annealing;

a metallic semiconductive interlayer is defined in a region located between said substrate and said alloy,

said interlayer has a thickness in the range of about 80 to about 105 Å

, and

said interlayer contains aluminum, gallium and arsenic;

thereby to produce said contact upon said substrate, wherein said so produced Schottky metal contact displays in combination with said substrate a Schottky barrier height φ

_Bn that is in said range of about 0.6 to about 1 eV, said process comprising;

(1) carrying out each of said step (a) and said step (b) sequentially with each one of the alloy members of a series of alloys of one subclass of said alloy formula, said members differing from one another in composition, thereby to produce a metal contact on said substrate for each said alloy member;

(2) measuring said Schottky barrier height φ

_Bn of each resulting combination comprised of said substrate and each said so produced metal contact, thereby to identify said Schottky barrier height that is so produced with each said alloy member;

(3) selecting a prechosen Schottky barrier height and comparing said prechosen Schottky barrier height φ

_Bn to said so identified Schottky barrier heights, thereby to identify that one corresponding alloy member within said one subclass which produces said prechosen Schottky barrier height φ

_Bn ; and

(4) sequentially repeating under said controlled conditions each of said step (a) and said step (b) using said one corresponding alloy member, thereby to produce that Schottky metal contact that displays in combination with said substrate said prechosen Schottky barrier height φ

_Bn.

13. The process of claim 12 wherein said series of alloys of said subclass is characterized by having the subgeneric alloy formula:

space="preserve" listing-type="equation">Ni(Al.sub.x Ga.sub.1-x)

where x is as defined above, wherein said substrate comprises n-GaAs, and wherein the relationship between product Schottky barrier height φ

_Bn and said series of alloys of said subclass is represented by the empirical equation;

space="preserve" listing-type="equation">φ

.sub.Bn.sup.I-V =0.3247x/(0.1538+x)+0.68.

14. The process of claim 12 wherein said series of alloys of said subclass is characterized by having the subgeneric alloy formula:

space="preserve" listing-type="equation">Ni.sub.y Co.sub.1-y Al.sub.x Ga.sub.1-x

where y is a positive number in the range from greater than 0 to less than 1 and x is as defined above, wherein said substrate comprises n-GaAs, and wherein the relationship between product barrier height φ

_Bn and said series of alloys of said subclass is represented by the empirical equation;

space="preserve" listing-type="equation">φ

.sub.Bn.sup.I-V =0.325x/(0.1538+x)+0.72.

15. A process for producing a Schottky metal contact for a Schottky diode upon one surface of a monocystalline semiconductive substrate wherein the interrelationship between the resulting combination comprised of said Schottky metal contact and said substrate is such that said combination has a Schottky barrier height φ

_Bn that is a value in the range of about 0.6 to about 1 eV, said method comprising the steps of;

(a) sequentially repeating each of the following steps (i) and (ii) for each of the member alloys of a series of alloys of one subclass of an alloy of the formula;

{Σ

M.sub.δ

}(Al_x Ga_1-lx)

where;

Σ

M.sub.δ

is a moiety which consists of at least one M, and when more than one M is present, each M is different,

M is a metal selected from the group consisting of nickel, cobalt, ruthenium, rhodium, iridium and platinum,

δ

is a stoichiometric coefficient whose total value in any given Σ

M.sub.δ

moiety is 1, and

x is a positive number between 0 and 1 (that is, x ranges from greater than 0 to less than

     1);

said alloy having the capacity when in combination with a monocrystalline semiconductive substrate compound of the formula;

space="preserve" listing-type="equation">Al.sub.v Ga.sub.1-v As

where v is a positive number ranging from and including 0 through 1 inclusive, to exist as a two phase binary equilibrium reciprocal system having the formula;

space="preserve" listing-type="equation">{Σ

M.sub.δ

}Ga-{Σ

M.sub.δ

}Al-AlAs-GaAs

where;

Σ

M.sub.δ

, M and δ

are defined above, said steps (i) and (ii) comprising;

(i) sputtering a contact upon a localized surface area of one said monocrystalline semiconductive substrate compound, said contact being comprised on an alloy of said alloy formula, said sputtering being continued until said contact comprises a layer of said alloy that is coated on said area; and

(ii) annealing said substrate and said coated contact at a temperature in the range of about 300°

to about 850°

C. for a selected time the relationship in the resulting combination of each said member alloy and said substrate after said sputtering and said annealing being such that;

a metallic semiconductive interlayer is defined in a region located between said substrate and said alloy,

said interlayer has a thickness in the range of about 80 to about 105 Å

,

said interlayer contains aluminum, gallium and arsenic, and

when interlayer contains aluminum, gallium and arsenic, and

when a negative bias voltage in the range of about -10 to about 0 volts is applied between an exterior surface of said annealed contact and a portion of said substrate that is in adjacent but spaced relationship to said so annealed contact, no current flows, but when a positive bias voltage in the range of about 0.1 to about 0.7 volts is so applied, a current in the range of about 10^-7 to about 0.5 milliamperes flows through said interlayer thereby to produce a metal contact on said substrate for each said member alloy;

(b) measuring said Schottky barrier height φ

_Bn of each resulting said combination comprised of said substrate and each said annealed metal contact, thereby to identify said Schottky barrier height φ

_Bn that is produced with each said member alloy;

(c) selecting a prechosen Schottky barrier height and comparing said prechosen Schottky barrier height φ

_Bn value to said so identified Schottky barrier heights, thereby to identify that one corresponding alloy member within said one subclass which produces said prechosen Schottky barrier height φ

_Bn value; and

(d) sequentially repeating each of said steps (i) and (ii) using said one corresponding alloy member, thereby to produce that Schottky metal contact that displays in combination with said substrate said prechosen Schottky barrier height φ

_Bn value.

16. The process of claim 15 wherein said series of alloys of said subclass is characterized by having the subgeneric alloy formula:

space="preserve" listing-type="equation">Ni(Al.sub.x Ga.sub.1-x)

where x is as defined above, wherein said substrate comprises n-GaAs, and wherein the relationship between product Schottky barrier height φ

_Bn and said series of alloys of said subclass is represented by the empirical equation;

space="preserve" listing-type="equation">φ

.sub.Bn.sup.I-V =0.3247x/(0.1538+X)+0.68.

17. The process of claim 15 wherein said series of alloys of said subclass is characterized by having the subgeneric alloy formula:

space="preserve" listing-type="equation">Ni.sub.y Co.sub.1-y Al.sub.x Ga.sub.1-x

where y is a positive number in the range from greater than 0 to less than 1 and x is as defined above, wherein said substrate comprises n-GaAs, and wherein the relationship between product barrier height φ

_Bn and said series of alloys of said subclass is represented by the empirical equation;

space="preserve" listing-type="equation">φ

.sub.Bn.sup.I-V =0.325x/(0.1538+x)+0.72.