Epoxy group-containing silicone resin and compositions based thereon

• US 5,516,858 A
• Filed: 04/10/1995
• Issued: 05/14/1996
• Est. Priority Date: 04/15/1993
• Status: Expired due to Term

• Current Assignee: Dow Corning Toray Silicone Company Limited (Dow, Inc.)
• Original Assignee: Dow Corning Toray Silicone Company Limited (Dow, Inc.)
• Inventors: Morita, Yoshitsugu, Tanaka, Ken, Saruyama, Toshio, Nakanishi, Junji
• Primary Examiner(s): Marquis, Melvyn I.
• Assistant Examiner(s): Gulakowski, Randy
• Application Number:
  US08/419,685
• Time in Patent Office: 400 Days
• Field of Search: 528/10, 528/31, 528/33, 528/43, 525/476, 525/477, 525/478, 525/523
• US Class Current: 525/478
• CPC Class Codes: C08G 59/3254 containing atoms other than carbon, hydrogen, oxygen or nitrogen
• CPC Class Codes: C08G 77/14 containing silicon bound to oxygen-containing groups C08G77/045 takes precedence
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 61/06 of aldehydes with phenols
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/06 containing silicon bound to oxygen-containing groups C08L83/12 takes precedence

Abstract

There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising

(A) 100 weight parts of a curable resin; and

(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula

(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b

(SiO_4/2)_c

wherein R¹, R² and R³ each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.3 and said silicone resin (B) has a glass-transition temperature of -90° C. to 150° C.

Claims

1. An epoxy group-containing silicone resin prepared by

(A) reacting, in the presence of water and a basic catalyst,

(I) at least one organopolysiloxane selected from the group consisting of

(i) an organopolysiloxane consisting essentially of siloxane units with the general formula

View Dependent Claims (2, 3, 4, 5, 6)

2. The silicone resin according to claim 1, wherein R⁹ is methyl.

3. The silicone resin according to claim 2, wherein said epoxy-containing organic group is selected from the group consisting of 2,3-epoxypropyl, 3,4-epoxybutyl, 4,5-epoxypentyl, 2-glycidoxyethyl, 3-glycidoxypropyl, 4-glycidoxybutyl, 2-(3,4-epoxycyclohexyl)ethyl, and 3-(3,4-epoxycyclohexyl)propyl.

4. The epoxy group-containing silicone resin according to claim 1, wherein at least 30 mole percent of the R⁴ groups are phenyl radicals.

5. The epoxy group-containing silicone resin according to claim 2, wherein at least 30 mole percent of the R⁴ groups are phenyl radicals.

6. The epoxy group-containing silicone resin according to claim 3, wherein at least 30 mole percent of the R⁴ groups are phenyl radicals.