Bias circuit for virtual ground non-volatile memory array with bank selector

• US 5,517,448 A
• Filed: 09/09/1994
• Issued: 05/14/1996
• Est. Priority Date: 09/09/1994
• Status: Expired due to Term

• Current Assignee: Davicom Semiconductor, Inc.
• Original Assignee: United Microelectronics Corporation
• Inventors: Liu, Ding-Jen
• Primary Examiner(s): ZARABIAN, AMIR
• Application Number:
  US08/303,679
• Time in Patent Office: 613 Days
• Field of Search: 365/189.09, 365/230.03, 365/230.02, 365/189.11, 365/185.11, 365/185.16, 365/185.18, 327/538, 327/539
• US Class Current: 365/185.11
• CPC Class Codes: G11C 16/0491 Virtual ground arrays

Abstract

A bias circuit for virtual ground non-volatile memory array with bank selector, utilizes static pull-up transistors connected respectively to all bit lines of the memory array. The gates of the static pull-up transistors are connected to a predetermined reference voltage for supplying a global bias voltage to the bit lines. Another predetermined reference voltage, acting as a local bias voltage, is supplied to a deselected virtual ground bit line which is adjacent to the selected data sense bit line. By these two bias techniques, the leakage current of the adjacent deselected "ON" memory cells is minimized; as a result, the stability of the current detector is largely enhanced; the probability of erroneous data reading is reduced; the operating voltage margin of the memory devices is enlarged; and the data accessing is expedited.

Claims

1. A bias circuit for a virtual ground non-volatile memory array with bank selector, wherein said memory array includes a plurality of banks, each bank including a memory sub-array consisting of a plurality of columns and rows of memory cells, a plurality of bank selectors, and a plurality of alternately arranged data sense bit lines and virtual ground bit lines connected between said bank selectors, said bias circuit comprising:

a global bias circuitry connected to all of said data sense bit lines and said virtual ground bit lines for providing a first predetermined bias voltage to all said data sense bit lines and said virtual ground bit lines;

a local bias circuitry; and

a column multiplexer connected between said banks and said local bias circuitry, said column multiplexer, according to the memory cell selected to be accessed, selecting a corresponding data sense bit line as a selected data sense bit line, and selecting one of two of said virtual ground bit lines which are respectively adjacent to two sides of said selected data sense bit line as a selected virtual ground bit line, and the other as a selected local isolation bit line, and then said column multiplexer connecting said selected data sense bit line, said selected virtual ground bit line and said selected local isolation bit line to said local bias circuitry, and isolating the rest of said data sense bit lines and virtual ground bit lines from said local bias circuitry;

wherein said local bias circuitry provides a second predetermined bias voltage to said selected data sense bit line, a third predetermined bias voltage to said selected local isolation bit line, and a reference voltage to said selected virtual ground bit line.

2. The bias circuit as claimed in claim 1, wherein said local bias circuitry comprises:

a current detector connected to said selected data sense bit line via said column multiplexer for supplying said second predetermined bias voltage to said selected data sense bit line, and for detecting the current through said selected data sense bit line;

a local bias driver connected to said selected local isolation bit line via said column multiplexer for supplying said third predetermined bias voltage to said selected local isolation bit line; and

a virtual ground reference voltage node connected to said selected virtual ground bit line via said column multiplexer for supplying said reference voltage to said selected virtual ground bit line.

3. The bias circuit as claimed in claim 2, wherein said current detector comprises:

a load device used to convert a current signal on said data sense bit line into a voltage signal;

a comparator connected to said load device for converting said voltage signal into a logic signal representing said selected memory cell'"'"'s stored data;

a current switching device connected to said load device; and

an inverting amplifier connected to said current switching device, said inverting amplifier operating with said current switching device to switch said current signal on said selected data sense bit line and to bias said selected data sense bit line at said second predetermined bias voltage.

4. The bias circuit as claimed in claim 3, wherein said load device is a PMOS transistor;

said comparator is an inverter;

said current switching device is an NMOS transistor; and

said inverting amplifier is a NOR gate.

5. The bias circuit as claimed in claim 4, wherein said inverting amplifier has a gain of about 7˜

20, a trip voltage of about 1.3˜

1.7 Volt;

said selected memory cell has an "ON" state current about 40˜

100 μ

A if it is programmed as an "ON" cell; and

said current switching device has a width/length ratio of about 6˜

10.

6. The bias circuit as claimed in claim 5, wherein said inverting amplifier preferably has a gain of about 10, and a trip voltage of about 1.5 Volt.

7. The bias circuit as claimed in claim 2, wherein said local bias driver comprises a current switching device and an inverting amplifier connected to each other for switching the current on said selected local isolation bit line, and for biasing said selected local isolation bit line at said third predetermined bias voltage.

8. The bias circuit as claimed in claim 7, wherein said current switching device is an NMOS transistor and said inverting amplifier is a NOR gate.

9. The bias circuit as claimed in claim 7, wherein said third predetermined bias voltage is about several tens of millivolts lower than said second predetermined bias voltage.

10. The bias circuit as claimed in claim 7, wherein said local bias driver further comprises a bleed device connected to said local isolation bit line via said column multiplexer for providing a discharging path to electric charges trapped in said local isolation bit line due to power noise.

11. The bias circuit as claimed in claim 10, wherein said bleed device has a strength about 2˜

5 times of the strength of the memory cells.

12. The bias circuit as claimed in claim 8, wherein said current switching device has a width/length ratio of about 20˜

30.

13. The bias circuit as claimed in claim 2, wherein said virtual ground reference voltage node is a ground.

14. The bias circuit as claimed in claim 2, wherein said column multiplexer includes a first-stage column multiplexer and a second-stage column multiplexer formed by a plurality of transfer gates, and wherein said first-stage column multiplexer selects said selected data sense bit line to be connected to said current detector, while said second-stage column multiplexer selects said selected local isolation bit line to be connected to said local bias driver, and selects said selected virtual ground bit lines to be connected to said virtual ground reference voltage node.

15. The bias circuit as claimed in claim 1, wherein said global bias circuitry comprises:

a global bias voltage generator for generating a global bias voltage; and

a plurality of static pull-up transistors having gates connected to said global bias voltage, drains connected to a power source, and sources connected to all of said data sense bit lines and virtual ground bit lines, respectively.

16. The bias circuit as claimed in claim 15, wherein said first predetermined bias voltage approximately equals said third predetermined bias voltage.

17. The bias circuit as claimed in claim 16, wherein each of said static pull-up transistors is an NMOS transistor with a strength about 1/2˜

1/10 of the strength of said memory cells.

18. The bias circuit as claimed in claim 16, wherein each of said static pull-up transistors is an NMOS transistor, and said static pull-up transistors, which are connected to said data sense bit lines, have a strength about 1/9˜

1/10 of the strength of said memory cells, while said static pull-up transistors, which are connected to said virtual ground bit lines, have a strength about 1/2˜

1/3 of the strength of said memory cells.

19. The bias circuit as claimed in claim 16, wherein said first predetermined bias voltage is about 0.1˜

0.2 Volt lower than said third predetermined bias voltage.