Infrared ray cutoff material and infrared cutoff powder use for same

• US 5,518,810 A
• Filed: 06/30/1994
• Issued: 05/21/1996
• Est. Priority Date: 06/30/1993
• Status: Expired due to Term

• Current Assignee: Mitsubishi Materials Corporation
• Original Assignee: Mitsubishi Materials Corporation
• Inventors: Sekiguchi, Masahiro, Hayashi, Toshiharu, Nishihara, Akira
• Primary Examiner(s): NAKARANI, DHIRAJLAL S
• Application Number:
  US08/268,912
• Time in Patent Office: 691 Days
• Field of Search: 427/162, 427/163, 427/165, 427/168, 428/323, 428/328, 428/329, 428/426, 428/689, 428/702, 428/331, 252/518, 252/587
• US Class Current: 428/328
• CPC Class Codes: G02B 5/208 for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/257 Iron oxide or aluminum oxide
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/3192 Next to vinyl or vinylidene chloride polymer

Abstract

An infrared-ray cutoff material having a structure in which tin-doped indium oxide powder (ITO) powder is dispersed in an inorganic or organic matrix. The material can be in the form of a coating on a substrate available by applying a composition comprising ITO powder, a binder (an organic resin and/or a metal alkoxide) and a solvent (an organic solvent, water and/or alcohol) onto the substrate and drying the same. It may also be in the form of a film, a sheet, a fiber or other shape available by forming a composition made by dispersing ITO powder in an organic polymer. The ITO powder should preferably have an x-value of from 0.220 to 0.295 and a y-value of from 0.235 to 0.352 on the xy chromaticity scale, a lattice constant of from 10.110 to 10.160 Å, and a minimum cutoff wavelength of up to 1,000 nm. The infrared-ray cutoff material of the present invention is transparent within the visible region and can totally cut off infrared rays of wavelengths ranging from relatively shorter ones.

Claims

1. An infrared-ray cutoff material which comprises a tin-doped indium oxide powder dispersed in an organic or inorganic matrix, said powder having a color tone on the xy chromaticity scale represented by an x-value of from 0.220 to 0.295 and a y-value of from 0.235 to 0.325, and said powder having a crystal lattice constant within a range of from 10.110 to 10.160 Å

.

2. An infrared-ray cutoff material as claimed in claim 1, wherein said matrix is transparent.

3. An infrared-ray cutoff material as claimed in claim 1, wherein;

said material is in the form of a coating formed on a substrate.

4. An infrared-ray cutoff material as claimed in claim 3, wherein:

said substrate is made of glass or plastics.

5. An infrared-ray cutoff material as claimed in claim 3, wherein the material of said matrix is selected from the group consisting of transparent organic resins, and inorganic metal oxides made by hydrolysis and calcination of a metal alkoxide.

6. An infrared-ray cutoff material as claimed in claim 1, wherein said material is in a form selected from the group consisting of a film, a sheet, a fiber, a panel, a bar, a tube and three-dimensional shapes.

7. An infrared-ray cutoff material as claimed in claim 6, wherein:

said matrix is an organic polymer.

8. An infrared-ray cutoff material as claimed in claim 6, wherein said material is in the form of a film which is adhered to the surface of a substrate.

9. An infrared-ray cutoff material as claimed in claim 1, wherein said tin-doped indium oxide powder can totally cut off more than 90% of infrared rays on the longer wavelength side from a wavelength of about 700 nm.

10. An infrared-ray cutoff material as claimed in claim 1, wherein said tin-doped indium oxide powder has an average primary particle size of up to 0.2 μ

m.

11. An infrared-ray cutoff material as claimed in claim 10, wherein said tin-doped indium oxide powder has an average primary particle size of up to 0.1 μ

m.

12. A method of manufacturing an infrared-ray cutoff material as claimed in claim 3, which comprises the steps of:

applying a composition comprising one or more kinds of binder, a tin-doped indium oxide powder, and a solvent onto a substrate, and drying the thus applied coating.

13. A method as claimed in claim 12, wherein said solvent is an organic solvent, and said binder is an organic resin.

14. A method as claimed in claim 12, wherein said solvent is selected from the group consisting of water and alcohol, and said binder is selected from the group consisting of (a) alkoxides of silicon, aluminium, zirconium and titanium and partial hydrolyzates thereof, and (b) organic resins soluble in, or dispersible in, said solvent.

15. A method as claimed in claim 12, wherein said composition contains, relative to 100 parts by weight of ITO powder, 1 to 2,000 parts by weight of said binder and 5 to 5,000 parts by weight of said solvent.

16. A method of manufacturing the infrared-ray cutoff material as claimed in claim 6, wherein a composition comprising said organic polymer and ITO powder dispersed therein is formed into a desired shape.

17. A method as claimed in claim 16, wherein said composition contains, relative to 100 parts by weight of ITO powder, 25 to 50,000 parts by weight of said polymer.

18. A tin-doped indium oxide powder having an infrared-ray cutoff function, which has a color tone as represented on the xy chromaticity scale of an x-value within a range of from 0.220 to 0.295 and a y-value within a range of from 0.235 to 0.325, a lattice constant within a range of from 10.110 to 10.160 Å

, and a minimum cutoff wavelength of up to 1,000 nm in or near the infrared region.

19. A tin-doped indium oxide powder as claimed in claim 18, wherein said powder has an average primary particle size of up to 0.2 μ

m.

20. A tin-doped indium oxide powder as claimed in claim 19, wherein said powder has an average primary particle size of up to 0.1 μ

m.