Micropost waste heat removal system

• US 5,520,244 A
• Filed: 06/13/1994
• Issued: 05/28/1996
• Est. Priority Date: 12/16/1992
• Status: Expired due to Term

• Current Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Original Assignee: SDL PLC (RWS Holdings Plc)
• Inventors: Mundinger, David C., Scifres, Donald R.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Arroyo, T. M.
• Application Number:
  US08/258,955
• Time in Patent Office: 715 Days
• Field of Search: 257/714, 257/712, 165/104.33, 361/700
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28D 9/00 Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall F28F3/083, F28F3/086 take precedence
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01S 5/024 Arrangements for thermal management
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser

Abstract

A cooling device formed in a thermally conductive substrate having a microstructure, such as a plurality of thermally conductive posts spaced apart by dimensions that induce capillary action in a liquid coolant. The posts extend away from the heated region and a space between the posts is supplied with liquid coolant which is contained by a meniscus near the tips of the posts. The coolant vaporizes at the meniscus and absorbs heat but, due to increased pressure in the coolant contained by the meniscus, does not boil within the space between the posts, allowing more liquid coolant contact with the thermally conductive substrate and posts. The vaporized coolant may be discharged into the air or into a chamber adjoining the tips having a lower pressure for removal of additional heat by gaseous expansion. The discharge of gaseous coolant allows the capillary flow of the liquid coolant in the space to be unimpeded, and the flow of liquid coolant may be augmented by a fluid pump. The gaseous coolant may be in thermal contact with a condenser that liquefies the coolant for supply to the space, by an array of capillaries, in a self contained cooling device. An array of such devices is provided with holes and stacked to connect adjacent liquid and gaseous coolant flows to cool an array of heated objects, such as laser diode bars.

Claims

1. A thermal regulation device for cooling a heated region comprising:

a liquid coolant,

a heat conductive body disposed in heat transfer relation with said heated region, said body having a microstructure which includes a fluid conduit for a liquid coolant, a portion of which supports capillary action, said liquid coolant disposed in a space in the microstructure adjacent to said heated region, said liquid coolant having a meniscus distal to said heated region, said microstructure and said meniscus restraining said liquid coolant from boiling in said space but allowing a phase change of said liquid coolant to a gaseous coolant near said meniscus, and

a means for supplying said liquid coolant to said fluid conduit.

2. The device of claim 1 wherein said microstructure comprises a plurality of upright posts.

3. The device of claim 1 wherein said microstructure comprises a plurality of parallel bars in layers, each layer transverse of an adjoining layer.

4. The device of claim 1 wherein said microstructure comprises a bored block having at least one longitudinal bore at least a portion of which supports capillary action and a plurality of transverse bores intersecting the capillary to allow venting of fluid vapor from the longitudinal bore.

7. The device of claim 1 further comprising means for discharging gaseous coolant further includes a condenser in thermal communication with said chamber, said condenser having a temperature inducing condensation of said gaseous coolant at said gas pressure of said chamber.

13. The device of claim 1 wherein said liquid coolant has a low viscosity, a high surface tension and a high heat of vaporization.

14. The device of claim 1 further comprising a gas pump in gas flow communication with said chamber.

15. The device of claim 1 wherein said means for supplying said liquid coolant to said space includes a fluid pump having an outlet in fluid communication with said space.

5. A thermal regulation device for cooling a heated region comprising:

a liquid coolant,

a heat conductive body disposed in heat transfer relation with said heated region, said body having a plurality of heat conductive posts extending generally away from said heated region, said liquid coolant disposed in a space between said posts adjacent to said heated region, said posts arranged to induce capillary flow of said liquid coolant in said space with said liquid coolant having a meniscus distal to said heated region, said posts and said meniscus restraining said liquid coolant from boiling in said space but allowing a phase change of said liquid coolant to a gaseous coolant near said meniscus, and

a means for supplying said liquid coolant to said space.

6. The device of claim 5 wherein said posts terminate distal to said heated region at a chamber, said chamber having a gas pressure lower than that near said meniscus, whereby additional heat is removed from said space due to expansion of said gaseous coolant.

8. The device of claim 5 wherein most of said posts are substantially parallel with each other.

9. The device of claim 5 wherein said posts are tapered.

10. The device of claim 5 wherein said posts are pyramidal.

11. The device of claim 5 further comprising a plurality of lateral connections between said posts.

12. The device of claim 5 wherein said posts are defined along connections between transversely oriented bars.

16. A thermal regulation device for cooling a heated region comprising,

a liquid coolant,

a heat conductive body disposed in heat transfer relation with said heated region, said body at least partially formed by a plurality of heat conductive bars connected in a lattice structure, said liquid coolant disposed in a space between said bars adjacent to said heated region, said bars arranged such that said space induces capillary flow of said liquid coolant between said bars and said liquid coolant has a meniscus distal to said heated region, said bars and said meniscus restraining said liquid coolant from boiling in said space but allowing a phase change of said liquid coolant to a gaseous coolant near said meniscus, and

a means for supplying said liquid coolant to said space.

17. The device of claim 16 wherein said bars are connected substantially along a line extending away from said heated region, such that a thermally conductive path extends from said heated region through said connected bars along said line.

18. The device of claim 16 wherein said bars are arranged in a plurality of layers, most of said layers having a plurality of mostly parallel bars, adjacent layers having bars aligned along different directions so that bars in adjacent layers intersect each other.

19. The device of claim 18 wherein said bars are connected substantially along a plurality of lines extending away from said heated region, such that heat conductive paths extend from said heated region through said connected bars along said lines.

20. The device of claim 16 wherein some of said bars extend away from said heated region.

21. The device of claim 16 wherein said body has a thermally conductive end wall disposed between said bars and said heated region.

22. Apparatus for cooling a heated body comprising,

a heat conductive block, in thermal contact with the heated body, having a plurality of upright posts extending away from the heated body and terminating at open ends, the posts arranged in parallel rows with dimensions and spacing simulating microchannels which create capillary action in a cooling fluid and a meniscus at the open end,

means for supplying a cooling fluid between the posts, the fluid matched to the simulated microchannels in a manner to resist boiling, the heated body and the heat conductive block having a temperature wherein the cooling fluid vaporizes without boiling thereby removing heat from the heated body.

23. Apparatus for cooling a heated body comprising,

a heat conductive block, in thermal contact with the heated body, having a plurality of layers of generally parallel bars, the bars of adjacent layers intersecting to form upright posts extending away from the heated body and terminating at open ends, the bars having dimensions and spacing simulating portions of microchannels which create capillary action in a cooling fluid and a meniscus at the open end,

means for supplying a cooling fluid between the bars, the fluid matched to the simulated microchannels in a manner to resist boiling, the heated body and the heat conductive block having a temperature wherein the cooling fluid vaporizes without boiling, thereby removing heat from the heated body.