Substrate cooling apparatus

• US 5,522,215 A
• Filed: 10/13/1994
• Issued: 06/04/1996
• Est. Priority Date: 10/18/1993
• Status: Expired due to Fees

• Current Assignee: SCREEN Holdings Co., Ltd.
• Original Assignee: SCREEN Holdings Co., Ltd.
• Inventors: Tsuji, Masao, Matsunaga, Minobu
• Primary Examiner(s): Bennett, Henry A.
• Assistant Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US08/322,792
• Time in Patent Office: 600 Days
• Field of Search: 62/3.2, 62/3.7, 62/161, 62/378, 62/383, 165/32, 165/96
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A substrate cooling apparatus is provided with a cooling plate disposed in a treating chamber and Peltier elements for supporting and cooling a substrate. A target temperature setter is operable to set a target temperature to which the substrate is to be cooled and a drive device drives the Peltier elements to cool the cooling plate below the target temperature. When the substrate is found to have reached the target temperature, the substrate is raised to a position free from the thermal influence of the cooling plate, to complete a cooling treatment. Consequently, the substrate is cooled at high speed to achieve a reduced cooling time. Where predetermined process modules are used, processing efficiency is improved with a reduced number of substrate cooling elements.

Claims

1. A substrate cooling apparatus comprising:

a treating chamber for receiving a substrate, a cooling plate for supporting said substrate in said treating chamber, and cooling means for cooling said substrate supported on said cooling plate;

target temperature setting means for setting a target temperature to which said substrate is to be cooled;

drive means for driving said cooling means to cool said cooling plate below said target temperature; and

control means, operative when said substrate is found to have reached said target temperature, for switching said substrate to a condition free from thermal influence of said cooling plate;

initial drive means for controlling said cooling means to cool said cooling plate to an initial temperature no higher than said target temperature; and

substrate detecting means for detecting said substrate placed on said cooling plate to actuate said drive means; and

said control means being operable to actuate said initial drive means when said substrate is found to have reached said target temperature.

2. A substrate cooling apparatus as defined in claim 1, further comprising:

substrate raising and lowering means for raising and lowering said substrate relative to said cooling plate; and

said substrate raising and lowering means being controlled by said control means to separate said substrate and said cooling plate from each other when said substrate is found to have reached said target temperature, to free said substrate from thermal influence of said cooling plate.

3. A substrate cooling apparatus as defined in claim 1, wherein said cooling means includes Peltier elements.

4. A substrate cooling apparatus as defined in claim 1, wherein said cooling plate is constructed to support said substrate with a slight gap maintained therebetween.

5. A substrate cooling apparatus as defined in claim 1, wherein said cooling plate is constructed to support said substrate in tight contact therewith.

6. A substrate cooling apparatus as defined in claim 2, wherein said cooling means includes Peltier elements.

7. A substrate cooling apparatus as defined in claim 2, wherein said cooling plate is constructed to support said substrate with a slight gap maintained therebetween.

8. A substrate cooling apparatus as defined in claim 6, wherein said cooling plate is constructed to support said substrate with a slight gap maintained therebetween.