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Semiconductor integrated device having parallel signal lines

  • US 5,523,622 A
  • Filed: 09/25/1995
  • Issued: 06/04/1996
  • Est. Priority Date: 11/24/1992
  • Status: Expired due to Fees
First Claim
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1. A mounting structure for a semiconductor integrated device comprising:

  • a first substrate having;

    a first substantially flat surface and a second substantially flat surface opposite said first substantially flat surface;

    a central cavity formed in said first substantially flat surface toward said second substantially flat surface;

    first signal transmission lines formed on said first substantially flat surface, each of said first signal transmission lines having a first end portion which is adjacent to said cavity;

    an electronic package having;

    a second substrate having a third substantially flat surface;

    second signal transmission lines formed on said third substantially flat surface, each of said second signal transmission lines having a first end portion and a second end portion;

    a semiconductor chip having a main surface, said semiconductor chip including electrode pads on said main surface thereof, said semiconductor chip being mounted on said second substrate with said main surface of said semiconductor chip opposed to said third substantially flat surface of said second substrate, said first end portions of said second signal transmission lines being electrically connected to said electrode pads through bump electrodes; and

    leads bonded to a peripheral portion of said second substrate and protruding from said second substrate, said leads being electrically connected to said second end portions of said second signal transmission lines and extending substantially parallel to said second signal transmission lines;

    wherein at least one of said first end portions of said second signal transmission lines extends under said electrode pads located in a central area of said semiconductor chip and is electrically connected to one of said electrode pads, wherein said electronic package is mounted in said cavity of said first substrate, and wherein each of said leads of said electronic package is electrically connected to said first end portion of each of said first transmission lines and extends substantially parallel to said first transmission lines.

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