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Method for protecting gallium arsenide mmic air bridge structures

  • US 5,524,339 A
  • Filed: 09/19/1994
  • Issued: 06/11/1996
  • Est. Priority Date: 09/19/1994
  • Status: Expired due to Term
First Claim
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1. A method for making an electronics module, comprising the steps of:

  • (1) disposing a plurality of electronic chips on a substrate surface, at least some of the chips including contact pads, and at least one of the chips including a sensitive structure;

    (2) encasing the sensitive structure within a protective layer which does not impede the performance of the sensitive structure and encases the sensitive structure from a top and sides, thereby protecting the sensitive structure from damage and processing contamination; and

    (3) applying at least one stratum of a high density interconnect structure, comprising the steps of;

    (a) applying a dielectric film layer over the chips and the substrate surface;

    (b) providing a plurality of via openings in the dielectric film, the openings being disposed over at least some of the contact pads; and

    (c) providing a pattern of electrical conductors on the film so that the conductors extend between the via openings so as to electrically connect selected contact pads.

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