Integrated circuit package
First Claim
1. An integrated circuit package for housing an integrated circuit chip and for providing electrical connectivity of data signals and voltage signals between the integrated circuit chip and an electronic component, the package comprising:
- a carrier substrate having a first surface including a die attach region and a signal layer region;
an integrated circuit chip affixed to the die attach region, the integrated circuit chip including a plurality of bonding pads;
at least three conductive layers on the signal layer region of the substrate for conducting electrical signals, the conductive layers comprising a single signal layer, at least a first voltage layer for providing a first reference voltage signal to the integrated circuit chip and a second voltage layer for providing a second reference voltage signal to the integrated circuit chip, the first voltage layer comprising a reference ground layer adjacent to the substrate for providing a ground signal to the integrated circuit chip and the second voltage layer comprising a reference voltage layer closely coupled to the reference ground layer thereby providing a predetermined significant level of decoupling capacitance therebetween;
a plurality of bond wires having a predetermined length, each bond wire electrically connecting a single bonding pad of the integrated circuit chip to a single bonding pad of the signal layer each bond wire being disposed parallel one to each other to route all of the data signals on the single signal layer to minimize the length of the bond wires;
at least first and second dielectric layers, each dielectric layer having a predetermined dielectric constant, the at least first dielectric layer being disposed between the first and second voltage layers, and the at least second dielectric layer being disposed between the second voltage layer and the signal layer, the dielectric constant of the at least second dielectric layer being less than the dielectric constant of the first layer; and
a plurality of electrical connections for interconnecting the chip bonding pads with the electronic component by way of at least one of the conductive layers for conducting electrical signals therebetween.
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Accused Products
Abstract
An integrated circuit package for housing an integrated circuit (IC) chip and providing electrical connectivity of data signals and voltage signals between the IC chip and an electronic component includes a substrate, an IC chip affixed to the substrate and at least three conductive layers on the substrate. The three conductive layers include at least a first voltage layer adjacent to the substrate for providing a first reference voltage signal (i.e., ground) to the IC chip, a second voltage layer for providing a second reference voltage signal (i.e., power) to the IC chip, and a signal layer. To maximize speed and minimize complexing, all of the data signals to the IC chip are routed on the signal layer. The power and ground layers are closely coupled and separated by a dielectric layer having a relatively high dielectric constant for providing significant decoupling capacitance. A low dielectric layer is provided for separating the power layer from the signal layer. A plurality of electrical connections interconnect bonding pads on the IC chip with the electronic component (e.g., a PCB) by way of at least one of the conductive layers.
78 Citations
26 Claims
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1. An integrated circuit package for housing an integrated circuit chip and for providing electrical connectivity of data signals and voltage signals between the integrated circuit chip and an electronic component, the package comprising:
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a carrier substrate having a first surface including a die attach region and a signal layer region; an integrated circuit chip affixed to the die attach region, the integrated circuit chip including a plurality of bonding pads; at least three conductive layers on the signal layer region of the substrate for conducting electrical signals, the conductive layers comprising a single signal layer, at least a first voltage layer for providing a first reference voltage signal to the integrated circuit chip and a second voltage layer for providing a second reference voltage signal to the integrated circuit chip, the first voltage layer comprising a reference ground layer adjacent to the substrate for providing a ground signal to the integrated circuit chip and the second voltage layer comprising a reference voltage layer closely coupled to the reference ground layer thereby providing a predetermined significant level of decoupling capacitance therebetween; a plurality of bond wires having a predetermined length, each bond wire electrically connecting a single bonding pad of the integrated circuit chip to a single bonding pad of the signal layer each bond wire being disposed parallel one to each other to route all of the data signals on the single signal layer to minimize the length of the bond wires; at least first and second dielectric layers, each dielectric layer having a predetermined dielectric constant, the at least first dielectric layer being disposed between the first and second voltage layers, and the at least second dielectric layer being disposed between the second voltage layer and the signal layer, the dielectric constant of the at least second dielectric layer being less than the dielectric constant of the first layer; and a plurality of electrical connections for interconnecting the chip bonding pads with the electronic component by way of at least one of the conductive layers for conducting electrical signals therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. An integrated circuit package for housing an integrated circuit chip and providing electrical connectivity of data signals and voltage signals between the integrated circuit chip and an electronic component, the package comprising:
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a carrier substrate having a first surface including a die attach region, a signal layer region and an outer perimeter; an integrated circuit chip affixed to the die attach region, the integrated circuit chip including a plurality of bonding pads; at least three conductive layers on the signal layer region of the substrate for conducting electrical signals, the conductive layers comprising a single signal layer, at least a first voltage layer for providing a first reference voltage signal to the integrated circuit chip and a second voltage layer for providing a second reference voltage signal to the integrated circuit chip, the first voltage layer comprising a reference ground layer adjacent to the substrate for providing a ground to signal to the integrated circuit chip and the second voltage layer comprising a reference voltage layer closely coupled to the reference ground layer thereby providing a predetermined significant level of decoupling capacitance therebetween, and the first and second voltage layers comprise power and ground layers, the power and ground layers being closely coupled to provide low power to ground inductance; at least first and second dielectric layers, each dielectric layer having a predetermined dielectric constant, the at least first dielectric layer being disposed between the first and second voltage layers, and the at least second dielectric layer being disposed between the second voltage layer and the signal layer, the dielectric constant of the at least second dielectric layer being less than the dielectric constant of the first layer; and a plurality of wire bonds having a predetermined length, each bond wire electrically connecting a single bonding pad of the integrated circuit chip to a single bonding pad of the signal layer, each bond wire being disposed parallel one to each other to route all of the data signals on the single signal layer to minimize the length of the bond wires; an encapsulant formed around the integrated circuit chip and the wire bonds to encapsulate the integrated circuit chip and the wire bonds; a first plurality of interconnect vias between the signal layer and the voltage layers for providing electrical connectivity between the voltage layers and the signal layer located adjacent to the integrated circuit chip; a plurality of package leads electrically connected to the signal layer for providing electrical connectivity between the electronic component and the package; and a second plurality of interconnect vias between the signal layer and the voltage layers for providing electrical connectivity between the package leads and the first and second voltage layers, the second plurality of vias being located proximate to the outer perimeter of the substrate.
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26. An integrated circuit package for housing an integrated circuit chip and providing electrical connectivity of data signals and voltage signals between the integrated-circuit chip and an electronic component, the package comprising:
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a carrier substrate having a first surface including a die attach region and a signal layer region; an integrated circuit chip affixed to the die attach region, the integrated circuit chip including a plurality of bonding pads; at least three conductive layers on the signal layer region of the substrate for conducting electrical signals, the conductive layers comprising at least a first voltage layer adjacent to the substrate for providing a first reference voltage signal to the integrated circuit chip, a second voltage layer for providing a second reference voltage signal to the integrated circuit chip, and a single signal layer, the first voltage layer comprising a reference ground layer adjacent to the substrate for providing a ground signal to the integrated circuit chip and the second voltage layer comprising a reference voltage layer closely coupled to the reference ground layer thereby providing a predetermined significant level of decoupling capacitance therebetween; a plurality of bond wires having a predetermined length, each bond wire electrically connecting a single bonding pad of the integrated circuit chip to a single bonding pad of the signal layer, each bond wire being disposed parallel one to each other to route all of the data signals on the single signal layer to minimize the length of the bond wires; at least first and second dielectric layers each dielectric layer having a predetermined dielectric constant the at least first dielectric layer being disposed between the first and second voltage layers, and the at least second dielectric layer being disposed between the second voltage layer and the signal layer, the dielectric constant of the at least second dielectric layer being less than the dielectric constant of the first layer, wherein the second dielectric layer comprises cyanate ester impregnated expanded polytetrafluoroethylene; and a plurality of electrical connections for interconnecting the chip bonding pads with the electronic component by way of at least one of the conductive layers for conducting electrical signals therebetween.
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Specification