Preconditioner for a polishing pad and method for using the same
First Claim
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1. A preconditioner for a mechanical polishing pad on a polishing system comprising:
- a plate having at least three intersecting ridges on a surface of the plate, wherein the at least three intersecting ridges extend radially outward from a center of the plate, the plate being composed of a rigid and chemically neutral polymer.
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Abstract
A preconditioning plate (10) prepares the surface of a polishing pad (24) to prepare the pad'"'"'s surface for subsequent metal polishing of semiconductor wafers (27). The preconditioning plate has at least three intersecting radial ridges (14) on its surface and is made from a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to actual polishing to provide a uniform and stable polishing surface. The preconditioning plate does not abrade or wear away the polishing pad, nor does it form grooves in the polishing pad. Additionally, the preconditioning plate is reusable.
118 Citations
20 Claims
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1. A preconditioner for a mechanical polishing pad on a polishing system comprising:
a plate having at least three intersecting ridges on a surface of the plate, wherein the at least three intersecting ridges extend radially outward from a center of the plate, the plate being composed of a rigid and chemically neutral polymer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for polishing a semiconductor wafer, comprising the steps of:
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providing a preconditioner having at least three intersecting ridges on a face of the preconditioner, wherein the at least three intersecting ridges extend radially outward from a center of the preconditioner, the preconditioner being composed of a rigid and chemically neutral polymer; aligning the preconditioner, face down, over a polishing pad; rotating the preconditioner, relative to the polishing pad, over a surface of the polishing pad to form a preconditioned polishing pad; positioning a semiconductor wafer having a metal layer on its face, face down, overlying the preconditioned polishing pad; and rotating the semiconductor wafer, relative to the preconditioned polishing pad to planarize the face of the semiconductor wafer. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method for polishing a semiconductor wafer, comprising the steps of:
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providing a preconditioner having at least three intersecting radial ridges on a face of the preconditioner, wherein the at least three intersecting radial ridges symmetrically divide the face of the preconditioner into a plurality of sectors, the preconditioner being composed of a rigid and chemically neutral polymer; aligning the preconditioner, face down, over a polishing pad; rotating the preconditioner, relative to the polishing pad, over a surface of the polishing pad to form a preconditioned polishing pad; positioning a semiconductor wafer having a metal layer on its face, face down, overlying the preconditioned polishing pad; and rotating the semiconductor ,safer, relative to the preconditioned polishing pad to planarize the face of the semiconductor wafer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification