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Wafer method for breaking a semiconductor

  • US 5,527,744 A
  • Filed: 11/21/1994
  • Issued: 06/18/1996
  • Est. Priority Date: 01/07/1993
  • Status: Expired due to Term
First Claim
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1. A method for processing and handling semiconductor wafers comprising the steps of:

  • a. partially sawing streets in a wafer upon which are partially processed micromechanical devices including structures supported above said wafer by a sacrificial layer;

    b. covering said streets with a protective coating such that said protective coating does not interfere with said micromechanical devices or said sacrificial layer;

    c. processing said wafer such that said sacrificial layer is removed thereby allowing said micromechanical devices to move freely and exposing surfaces underneath said micromechanical devices;

    d. positioning a wedge piece with a plurality of wedges adjacent said wafer such that said wedges are aligned along said partially sawn streets without any of said wedges being in contact with said wafer;

    e. applying pressure to force said wafer against said wedges causing said wafer to break into chips along said partially sawn streets, wherein said protective coating prevents any debris from said breaking from coming into contact with any of said surfaces underneath said micromechanical devices; and

    f. removing said chips.

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