Semiconductor sensor manufactured through anodic-bonding process
First Claim
1. A semiconductor sensor comprising:
- a semiconductor substrate including;
a support member having an opening centrally defined therein;
a diaphragm positioned in the opening of the support member;
a flexible supporting means for supporting and coupling the diaphragm with the support member, wherein said flexible supporting means is more flexible than said diaphragm;
a glass substrate having a portion facing said diaphragm and said flexible supporting means and at least one recess defined in said portion in such a manner that said at least one recess faces the entirety of said flexible supporting means, the glass substrate having a through hole and including;
a metal layer deposited on a surface of the glass substrate;
a dielectric layer deposited on the metal layer, the dielectric layer facing the diaphragm, wherein said recess and said dielectric layer prevent said diaphragm and said flexible supporting means from bonding to said glass substrate during an anodic-bonding process.
0 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor sensor comprising a semiconductor substrate and a glass substrate. The semiconductor substrate includes a support member having an opening centrally defined therein, a diaphragm positioned in the opening of the support member, and a flexible supporting means for supporting and coupling the diaphragm and the support member. The glass substrate includes a portion facing the diaphragm and the supporting means and at least one recess defined in this portion which faces the entirety of the supporting means. The glass substrate also includes a metal layer deposited on a surface of the glass substrate and a dielectric layer deposited on the metal layer such that the dielectric layer faces the diaphragm.
-
Citations
5 Claims
-
1. A semiconductor sensor comprising:
-
a semiconductor substrate including; a support member having an opening centrally defined therein; a diaphragm positioned in the opening of the support member; a flexible supporting means for supporting and coupling the diaphragm with the support member, wherein said flexible supporting means is more flexible than said diaphragm; a glass substrate having a portion facing said diaphragm and said flexible supporting means and at least one recess defined in said portion in such a manner that said at least one recess faces the entirety of said flexible supporting means, the glass substrate having a through hole and including; a metal layer deposited on a surface of the glass substrate; a dielectric layer deposited on the metal layer, the dielectric layer facing the diaphragm, wherein said recess and said dielectric layer prevent said diaphragm and said flexible supporting means from bonding to said glass substrate during an anodic-bonding process. - View Dependent Claims (2, 3, 4, 5)
-
Specification