Solderless flexible circuit carrier to printed circuit board interconnection

• US 5,529,502 A
• Filed: 06/01/1994
• Issued: 06/25/1996
• Est. Priority Date: 06/01/1994
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Heilsberg, Stuart A., Peltier, Mark R., Castaneda, Julio C.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US08/252,466
• Time in Patent Office: 755 Days
• Field of Search: 439/67, 439/77, 439/493
• US Class Current: 439/67
• CPC Class Codes: H01R 12/774 Retainers
• CPC Class Codes: H01R 12/79 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process

Abstract

An assembly for electrically interconnecting a printed circuit board (106) to a flexible circuit carrier (104) includes a retention clip (102) for mechanically pressing the printed circuit board (106) against the flexible circuit carrier (104). The printed circuit board (106) includes a set of locating features (110) which match with locating features (116) located on the flexible circuit (104). A set of retention features (114) match up with side locks (122) located on the retention clip) and maintain the clip (102) engaged to the printed circuit board (106) in a mechanically biased state. The clip (102) also includes alignment apertures (118) for receiving the locating features (110) on the printed circuit board to aid in alignment of the assembly.

Claims

1. An interconnection clip for interconnecting a flexible circuit carrier to a printed circuit board, comprising:

a main section having top and bottom and first and second side margins;

first and second rows of spring finger contacts, the first row of spring finger contacts extending from the top margin and the second row of spring finger contacts extending from bottom margin of the main section;

first and second cantilevered end sections, the first cantilevered end section extending from the first side margin and the second cantilevered end section extending from the second side margin of the main section; and

at least one alignment aperture located on the main section for permitting alignment of the clip to the printed circuit board.

2. An interconnection clip as defined in claim 1, wherein the first and second rows of spring finger contacts are curved towards each other.

3. An interconnection clip as defined in claim 2, further comprising:

an aperture on each of the first and second cantilevered end sections.

4. An interconnection clip as defined in claim 3, wherein the each of the spring fingers on the first and second rows have bumped end members.

5. An interconnection clip as defined in claim 4, wherein each of the first and second cantilevered end sections have curved end portions.

6. An interconnection clip as defined in claim 1, wherein the clip is formed from stainless steel.

7. An interconnection clip as defined in claim 1, wherein the clip is formed from beryllium copper.

8. An interconnection assembly for interconnecting a flexible circuit carrier to a printed circuit board using a retention clip, comprising:

the printed circuit board including;

first and second major surfaces and an edge surface; and

a plurality of interconnection pads located on at least one major surface;

the flexible circuit carrier including;

first and second major surfaces; and

a plurality of pads located on at least one major surface; and

the retention clip including;

a main section having top and bottom and first and second side margins; and

first and second rows of spring finger contacts, the first row of spring finger contacts extending from the top margin and the second row of spring finger contacts extending from the bottom margin of the main section at least one alignment aperture located on the main section permitting alignment of the printed circuit board and the flexible circuit carrier, such that the plurality of pads on the flexible circuit carrier are electrically coupled one each to the plurality of interconnection pads located on the printed circuit board by the first and second rows of spring finger contacts which mechanically bias the plurality of pads on the flexible circuit board against the plurality of interconnection pads located on the printed circuit board during interconnection via the retention clip.

9. An interconnection assembly as defined in claim 8, further comprising:

at the printed circuit board;

a locating feature and first and second retention

features located on the edge surface; and

at the flexible circuit carrier;

at least one alignment aperture through said first and second major surfaces, such that the alignment apertures on the flexible circuit carrier and the main section of the retention clip are received by the printed circuit board locating feature in order to align the flexible circuit to the printed circuit such that the plurality of pads on the flexible circuit carrier and the plurality of interconnection pads on the printed circuit board are in substantial registration with each other.

10. An interconnection assembly as defined in claim 9, wherein the flexible circuit carrier is folded about the edge surface of the printed circuit board.

11. An interconnection assembly as defined in claim 9, wherein the retention clip further comprises:

first and second cantilevered end sections, the first cantilevered end section extending from the first side margin and the second cantilevered end section extending from the second side margin of the main section.

12. An interconnection assembly as defined in claim 11,

wherein the first and second cantilevered end sections each include an aperture;

and

wherein the printed circuit board includes first and second retention features permitting the apertures on the first and second cantilevered end sections to latch onto the first and second retention features during interconnection.

13. An interconnection assembly for interconnecting a flexible circuit carrier to a printed circuit board using a retention clip, comprising:

the printed circuit board including;

first and second major surfaces and an edge surface;

a plurality of interconnection pads located on the first major surface; and

an alignment protrusion located on the edge surface; and

the flexible circuit carrier including;

first and second major surfaces;

an alignment aperture located through said first and second major surfaces; and

a plurality of pads located on the second major surface; and

the retention clip including;

a main section having top and bottom and first and second side margins;

an alignment aperture through said main section; and

first and second rows of spring finger contacts, the first row of spring finger contacts extending from the top margin and the second row of spring finger contacts extending from bottom margin of the main section, such that

the alignment aperture on the flexible circuit is received by the alignment protrusion located on the printed circuit board, the flexible circuit is folded about the edge surface of the printed circuit board and the plurality of pads on the flexible circuit carrier are electrically coupled one each to the plurality of interconnection pads located on the printed circuit board by the first and second rows of spring finger contacts when said alignment aperture located on the retention clip is received by the alignment protrusion located on the printed circuit board.

14. An interconnection assembly as defined in claim 13, wherein the printed circuit board further includes a retention feature located at the edge surface and the retention clip includes a retention aperture which is received by the retention feature for mechanically securing the retention clip to the printed circuit board.

15. An interconnection assembly as defined in claim 13, wherein the locking aperture of the retention clip is located on a cantilevered end member which extends from the main section of the retention clip.