Method of etching a lens for a semiconductor solid state image sensor

• US 5,529,936 A
• Filed: 10/21/1994
• Issued: 06/25/1996
• Est. Priority Date: 09/30/1992
• Status: Expired due to Term

• Current Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Rostoker, Michael D.
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): Picardat, Kevin M.
• Application Number:
  US08/291,776
• Time in Patent Office: 613 Days
• Field of Search: 437/2, 437/3, 437/4, 437/905, 437/5, 437/23, 148/DIG. 99
• US Class Current: 438/65
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: Y10S 148/099 LED, multicolor

Abstract

Methods of etching optical elements in association with photosensitive elements are described. In some of the arrangements, the optical elements are formed integrally with a substrate containing the photosensitive elements. In other arrangements, an optical element is mounted to a package, or the like, containing the substrate and photosensitive elements. In other arrangements, two or more optical elements are employed, including conventional refractive elements, refractive focusing elements, and refractive beam splitting elements. Utility as solid state image sensors is discussed. Utility for monochromatic and color imaging is discussed.

Claims

1. A method of making a solid state image sensor, comprising:

providing a semiconductor substrate;

forming an array of photosensitive elements over a surface of the substrate;

providing an optically-transmissive layer over the substrate, on the same side of the substrate as the photosensitive elements, the optically-transmissive layer overlying the photosensitive elements;

shaping the optically-transmissive layer so that is has an optical property of focussing light impinging onto the substrate onto the underlying photosensitive elements;

wherein the optically-transmissive layer is formed to have a plurality of lenslets;

each lenslet covers, and is associated with, three of the photosensitive elements; and

each lenslet is formed to diffract light of a first wavelength impinging on the substrate to a first of the three photosensitive elements associated therewith, to diffract light of a second wavelength impinging on the substrate to a second of the three photosensitive elements associated therewith, and to diffract light of a third wavelength impinging on the substrate to a third of the three photosensitive elements associated therewith.

2. The method of claim 1, further comprising:

disposing an additional optically-transmissive layer between the shaped optically-transmissive layer and the photosensitive elements.

3. The method of claim 1, further comprising:

placing a discrete lens element at a fixed distance away from said optically-transmissive layer, so that light impinging on the substrate must first pass through the lens element.

4. The method of claim 3, wherein:

said discrete lens element is a binary lens.

5. The method of claim 1, further comprising:

disposing an optically-opaque layer between the optically-transmissive layer and the photosensitive elements; and

forming openings in the optically-opaque layer in registration with the photosensitive elements.