Passive interposer including at least one passive electronic component

• US 5,530,288 A
• Filed: 10/12/1994
• Issued: 06/25/1996
• Est. Priority Date: 10/12/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Stone, David B.
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US08/321,677
• Time in Patent Office: 622 Days
• Field of Search: 257/678, 257/685, 257/686, 257/700, 257/737, 257/738, 257/774, 257/777, 257/778, 257/780, 257/904, 257/924
• US Class Current: 257/700
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/647 Resistive arrangements H01L23/66, H01L23/62 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2203/0361 Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Abstract

An interposer including a first face and second face opposite the first face and at least one electrically conductive plane. The at least one electrically conductive plane functions as a power, ground, or signal plane. At least one electrically insulating plane is positioned on opposite sides of the at least one electrically conductive plane. A plurality of plated through holes are formed through the at least one electrically conductive planes and the at least two electrically insulating planes. The through holes are selectively electrically joined to the at least one electrically conductive plane. At least one passive electronic structure is positioned within the interposer structure.

Claims

1. An interposer, comprising:

a first face and a second face opposite said first face;

at least one electrically conductive plane functioning as a power, ground, or signal plane;

an electrically insulating plane positioned on opposite sides of said at least one electrically conductive plane;

a plurality of plated through holes formed through the at least one electrically conductive plane and the at least one electrically insulating plane, said through holes being selectively joined to said at least one electrically conductive plane; and

at least one passive electronic component positioned within the interposer.

2. An interposer according to claim 1, wherein said at least one passive electronic component is selected from the group consisting of an inductor a resistor, a capacitor, and a conductor.

3. An electronic package, comprising:

an interposer, comprising;

a first face and a second face opposite said first face;

at least one electrically conductive plane functioning as a power, ground, or signal plane;

an electrically insulating plane positioned on each side of said at least one electrically conductive plane;

a plurality of plated through holes formed through the at least one electrically conductive plane and the electrically insulating planes, said through holes being selectively joined to said at least one electrically conductive plane; and

at least one passive electronic component positioned within the interposer;

at least one first component mounted to said first face of said interposer, said at least one first component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer; and

at least one second component mounted to said second face of said interposer, said at least one second component including a plurality of ground, power, and signal sites electrically connected to said plated through holes of said interposer;

wherein said interposer provides selective connections between said ground, power, and signal sites of said at least one first component and said at least one second component.

4. An electronic package according to claim 3, wherein said at least one first component and said at least one second component are selected from the group consisting of a chip carrier, an interposer, a circuit board, a circuit card, and a chip.

5. An electronic package according to claim 3, wherein said at least one first component and said at least one second component are any surface mountable components.

6. An electronic package according to claim 3, wherein said at least one first component and said at least one second component are attached to said interposer with a surface mount process.

7. An electronic package according to claim 3, wherein said at least one first component and said at least one second component are mounted on said interposer with a surface mount process selected from the group consisting of solder joints, BGA, conductive adhesive, conductive film, thermal compression bonding.

8. An electronic package according to claim 3, wherein said at least one passive electronic component is selected from the group consisting of an inductor a resistor, a capacitor, and a conductor.

9. An interposer, comprising:

alternating electrically conducting and insulating planes;

a plurality of plated through holes formed through the electrically conductive and electrically insulating planes; and

a plane including at least one passive electronic component selected from the group consisting of a resistor, a capacitor, and an inductor.