Drop-in heat sink

• US 5,530,295 A
• Filed: 05/26/1995
• Issued: 06/25/1996
• Est. Priority Date: 12/29/1993
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Mehr, Behrooz
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US08/451,478
• Time in Patent Office: 396 Days
• Field of Search: 257/712, 257/796, 257/675, 257/722, 361/714, 361/718, 361/723, 165/80.3
• US Class Current: 257/796
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

Claims

1. An electronic package, comprising:

a housing;

an integrated circuit within said housing;

a lead frame coupled to said integrated circuit;

a heat sink embedded within said housing, said heat sink having a top surface, a first outwardly tapered surface that extends to a first edge, a first step surface that extends inward from said first edge essentially parallel with said top surface, a second outwardly tapered surface that extends from said first step surface to a second edge, a second step surface that extends inward from said second edge essentially parallel with said top surface, and a third outwardly tapered surface that extends from said second step surface to a third edge.

2. The heat sink as recited in claim 1, wherein said heat sink is attached to said lead frame.

3. The package as recited in claim 1, further comprising a heat fin that is attached to said heat sink.