Method for producing thin, uniform powder phosphor for display screens

• US 5,531,880 A
• Filed: 09/13/1994
• Issued: 07/02/1996
• Est. Priority Date: 09/13/1994
• Status: Expired due to Fees

• Current Assignee: SI Diamond Technology, Inc. (Nano Magic, Inc.)
• Original Assignee: Microelectronics and Computer Technology Corporation, SI Diamond Technology, Inc. (Nano Magic, Inc.)
• Inventors: Patterson, Donald E., Xie, Chenggang, Kumar, Nalin
• Primary Examiner(s): Phasge, Arun S.
• Application Number:
  US08/304,918
• Time in Patent Office: 658 Days
• Field of Search: 204/180.2, 204/180.9, 204/181.5, 204/478, 204/507, 204/509, 204/491
• US Class Current: 204/478
• CPC Class Codes: C25D 13/02 with inorganic material

Abstract

A system and method for producing thin, uniform powder phosphors for field emission display screens wherein a planarization of the phosphor powder layer is accomplished by placing the deposited phosphor layer in an anode plate between two optical flats, which are then mounted within a mechanical press.

Claims

1. A process comprising the steps of:

depositing a phosphor on a support;

planarizing said deposited phosphor with a mechanical press;

curing said planarized deposited phosphor; and

repeating said planarizing step after said curing step.

2. The process as recited in claim 1 wherein said depositing step employs an electrophoretic process.

3. The process as recited in claim 1 wherein said support is comprised of a glass substrate.

4. The process as recited in claim 1 wherein said planarizing step further comprises the steps of:

placing an optical flat on said deposited phosphor; and

pressing said optical flat towards said support with said mechanical press.

5. The process as recited in claim 4 wherein said pressing step employs a force up to 2000 psi.

6. The process as recited in claim 1, further comprising the step of:

curing said planarized deposited phosphor.

7. The process as recited in claim 6 wherein said curing step comprises a ramped baking of said phosphor.

8. The process as recited in claim 1, further comprising the step of:

immersing said planarized deposited phosphor in a silicate solution.

9. The process as recited in claim 1 wherein said phosphor is a phosphor powder comprised of ZnO.

10. The process as recited in claim 1, further comprising the step of:

masking said support prior to said depositing step.

11. The method as recited in claim 1, wherein said planarizing step forces said deposited phosphor into a layer wherein a thickness of said phosphor remains substantially uniform throughout said layer.

12. The method as recited in claim 1, wherein said planarization step results in said deposited phosphor to have a substantially planar top surface.

13. The method as recited in claim 1, wherein said optical flat has a flat, hard, smooth surface for contacting said deposited phosphor.

14. The method as recited in claim 1, wherein said optical flat physically contacts said phosphor during said planarization step.

15. A method of providing a phosphor on a substrate, comprising the following steps in the sequence set forth:

depositing said phosphor on said substrate;

placing an optical flat on said deposited phosphor;

planarizing said deposited phosphor by pressing said optical flat towards said substrate with a mechanical press;

curing said planarized deposited phosphor; and

repeating said planarizing and curing steps.

16. The method as recited in claim 15 wherein said depositing step employs an electrophoretic process.

17. The method as recited in claim 15 wherein said substrate is comprised of a glass substrate and an ITO layer.

18. The method as recited in claim 15 wherein said curing step comprises a ramped baking of said phosphor.

19. The method as recited in claim 15 further comprising the step of:

immersing said planarized deposited phosphor in a silicate solution prior to said curing step.

20. The method as recited in claim 15 wherein said planarizing step forces said deposited phosphor into a layer wherein a thickness of said phosphor remains substantially uniform throughout said layer.

21. A method of providing a phosphor layer on a substrate, wherein said phosphor layer has less than a 3% variation in its thickness, said method comprising the steps of:

depositing said phosphor layer on said substrate;

planarizing said deposited phosphor, wherein said planarizing step is performed with a mechanical press;

curing said planarized deposited phosphor layer; and

repeating said planarizing step after said curing step.

22. The method as recited in claim 21 wherein said planarizing step further comprises the steps of:

placing an optical flat on said deposited phosphor layer; and

pressing said optical flat towards said substrate with said mechanical press with sufficient pressure to force said phosphor layer into a geometry of substantially uniform thickness throughout said phosphor layer.