Mounting structure for electronic component
First Claim
1. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
- said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;
said electronic component comprising a plurality of external terminals;
said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; and
said electronic component having opposite upper and lower surfaces and a plurality of side surfaces connecting said upper and lower surfaces with each other, said external terminals comprising external electrodes being formed on said side surfaces.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic component which is employed in the frequency range in the microwave band or above is mounted on a circuit board. The circuit board comprises two linear transmission line members, a ground electrode, and an electric insulating substrate provided with the transmission line members and the ground electrode on its major surface. The electronic component comprises external electrodes which are formed on its side surfaces. Holding patches which are formed on the lower surface of the electronic component are bonded to the ground electrode by solder members, thereby fixing the electronic component to the circuit board. At this time, small clearances are defined between the electronic component and the circuit board through the solder members, whereby the external electrodes are electromagnetically coupled with the transmission line members and the ground electrode through the clearances respectively. Thus, it is possible to obtain a mounting structure for an electronic component, which can suppress development of unnecessary inductance components.
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Citations
28 Claims
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1. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; and said electronic component having opposite upper and lower surfaces and a plurality of side surfaces connecting said upper and lower surfaces with each other, said external terminals comprising external electrodes being formed on said side surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and wherein said transmission line member and said ground electrode are formed on said major surface of said substrate and said electronic component is fixed to said circuit board with said lower surface being directed to said transmission line member and said ground electrode and with small clearances being defined between said external electrodes and said transmission line member and said ground electrode, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively. - View Dependent Claims (13, 14, 15)
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16. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and wherein said transmission line member and said ground electrode are formed on said major surface of said substrate, said circuit board further comprises a resin layer being formed to cover said transmission line member and said ground electrode, and said electronic component is fixed to said circuit board with said lower surface being in contact with said resin layer, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said resin layer respectively. - View Dependent Claims (17)
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18. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and wherein said transmission line member is formed within said substrate to extend in parallel with said major surface, said ground electrode is formed on said major surface of said substrate and has a coupling window comprised of a gap in said ground electrode in a position being opposed to said transmission line member, said external electrodes comprise an input/output external electrode and a ground external electrode, and said electronic component is fixed to said circuit board with said lower surface being directed to said ground electrode and with a small clearance being defined between said ground external electrode and said ground electrode so that said input/output external electrode is opposed to said transmission line member through said coupling window, said ground external electrode and said ground electrode being capacitively coupled with each other through said clearance, said input/output external electrode and said transmission line member being capacitively coupled with each other through said coupling window.
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19. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and wherein said external electrodes include a slot line external electrode being opposed to said transmission line member.
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20. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said around electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and wherein said transmission line member includes a slot line transmission line member.
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21. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;
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said circuit board comprising a transmission line member, a around electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode; said electronic component comprising a plurality of external terminals; said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; and wherein said external terminals comprise pin lead terminals, said circuit board having through holes for receiving said lead terminals respectively. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
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Specification