Mounting structure for electronic component

• US 5,532,658 A
• Filed: 12/22/1994
• Issued: 07/02/1996
• Est. Priority Date: 12/22/1993
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Furutani, Koji, Katou, Mitsuhide, Tonegawa, Ken, Tsuru, Teruhisa, Mandai, Harufumi
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US08/362,805
• Time in Patent Office: 558 Days
• Field of Search: 333/24 C, 333/246, 333/247, 257/664, 257/691-693, 257/696, 257/697, 257/728
• US Class Current: 333/246
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09336 Signal conductors in same plane as power plane
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/1006 Non-printed filter
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electronic component which is employed in the frequency range in the microwave band or above is mounted on a circuit board. The circuit board comprises two linear transmission line members, a ground electrode, and an electric insulating substrate provided with the transmission line members and the ground electrode on its major surface. The electronic component comprises external electrodes which are formed on its side surfaces. Holding patches which are formed on the lower surface of the electronic component are bonded to the ground electrode by solder members, thereby fixing the electronic component to the circuit board. At this time, small clearances are defined between the electronic component and the circuit board through the solder members, whereby the external electrodes are electromagnetically coupled with the transmission line members and the ground electrode through the clearances respectively. Thus, it is possible to obtain a mounting structure for an electronic component, which can suppress development of unnecessary inductance components.

Claims

1. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; and

said electronic component having opposite upper and lower surfaces and a plurality of side surfaces connecting said upper and lower surfaces with each other, said external terminals comprising external electrodes being formed on said side surfaces.

2. A mounting structure in accordance with claim 1, wherein said transmission line member and said ground electrode are formed on said major surface of said substrate, and said electronic component is fixed to said circuit board with said lower surface being directed to said transmission line member and said ground electrode and with small clearances being defined between said external electrodes and said transmission line member and said ground electrode, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively.

3. A mounting structure in accordance with claim 2, further comprising a member for bonding said lower surface of said electronic component with said ground electrode while defining a clearance therebetween.

4. A mounting structure in accordance with claim 3, wherein said bonding member includes solder.

5. A mounting structure in accordance with claim 3, wherein said bonding member includes a resin-based adhesive.

6. A mounting structure in accordance with claim 1, wherein said transmission line member and said ground electrode are formed on said major surface of said substrate, said circuit board further comprises a resin layer being formed to cover said transmission line member and said ground electrode, and said electronic component is fixed to said circuit board with said lower surface in contact with said resin layer, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said resin layer respectively.

7. A mounting structure in accordance with claim 6, wherein said resin layer bonds said electronic component to said circuit board.

8. A mounting structure in accordance with claim 1, wherein said transmission line member is formed within said substrate to extend in parallel with said major surface, said ground electrode is formed on said major surface of said substrate and has a coupling window comprised of a gap in said ground electrode in a position being opposed to said transmission line member, said external electrodes comprise an input/output external electrode and a ground external electrode, and said electronic component is fixed to said circuit board with said lower surface being directed to said ground electrode and with a small clearance being defined between said ground external electrode and said ground electrode and with said input/output external electrode being opposed to said transmission line member through said coupling window, said ground external electrode and said ground electrode being capacitively coupled with each other through said clearance, said input/output external electrode and said transmission line member being capacitively coupled with each other through said coupling window.

9. A mounting structure in accordance with claim 1, wherein a concave portion having a bottom surface and an inner side surface is formed in said major surface of said substrate, said electronic component being at least partially received in said concave portion with said lower surface being directed to said bottom surface of said concave portion, with said external electrodes being directed to said inner side surface of said concave portion, and with small clearances being defined between said external electrodes and said inner side surface of said concave portion.

10. A mounting structure in accordance with claim 9, wherein said transmission line member and said ground electrode are formed to be exposed on an edge defining an opening of said concave portion on said major surface of said substrate, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively.

11. A mounting structure in accordance with claim 9, wherein said ground electrode is formed to be exposed on an edge defining an opening of said concave portion on said major surface of said substrate and said transmission line member is formed in said substrate to be exposed on said inner side surface of said concave portion, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively.

12. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively;

wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and

wherein said transmission line member and said ground electrode are formed on said major surface of said substrate and said electronic component is fixed to said circuit board with said lower surface being directed to said transmission line member and said ground electrode and with small clearances being defined between said external electrodes and said transmission line member and said ground electrode, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively.

13. A mounting structure in accordance with claim 12, further comprising a member for bonding said lower surface of said electronic component and said ground electrode with each other while defining a clearance therebetween.

14. A mounting structure in accordance with claim 13, wherein said bonding member includes solder.

15. A mounting structure in accordance with claim 13, wherein said bonding member includes a resin-based adhesive.

16. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively;

wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and

wherein said transmission line member and said ground electrode are formed on said major surface of said substrate, said circuit board further comprises a resin layer being formed to cover said transmission line member and said ground electrode, and said electronic component is fixed to said circuit board with said lower surface being in contact with said resin layer, said external electrodes being capacitively coupled with said transmission line member and said ground electrode through said resin layer respectively.

17. A mounting structure in accordance with claim 16, wherein said resin layer bonds said electronic component to said circuit board.

18. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively;

wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and

wherein said transmission line member is formed within said substrate to extend in parallel with said major surface, said ground electrode is formed on said major surface of said substrate and has a coupling window comprised of a gap in said ground electrode in a position being opposed to said transmission line member, said external electrodes comprise an input/output external electrode and a ground external electrode, and said electronic component is fixed to said circuit board with said lower surface being directed to said ground electrode and with a small clearance being defined between said ground external electrode and said ground electrode so that said input/output external electrode is opposed to said transmission line member through said coupling window, said ground external electrode and said ground electrode being capacitively coupled with each other through said clearance, said input/output external electrode and said transmission line member being capacitively coupled with each other through said coupling window.

19. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively;

wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and

wherein said external electrodes include a slot line external electrode being opposed to said transmission line member.

20. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a ground electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said around electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively;

wherein said electronic component has opposite upper and lower surfaces, said external terminals comprising external electrodes being formed on said lower surface; and

wherein said transmission line member includes a slot line transmission line member.

21. A mounting structure for mounting an electronic component, for being employed in the frequency range in the microwave band or above, on a circuit board;

said circuit board comprising a transmission line member, a around electrode being electrically insulated from said transmission line member, and an electric insulating substrate having a major surface and holding said transmission line member and said ground electrode;

said electronic component comprising a plurality of external terminals;

said electronic component being fixed to said circuit board with said external terminals being capacitively coupled with said transmission line member and said ground electrode respectively; and

wherein said external terminals comprise pin lead terminals, said circuit board having through holes for receiving said lead terminals respectively.

22. A mounting structure in accordance with claim 21, wherein through-hole electrodes are formed on inner peripheral surfaces of said through holes respectively, said through-hole electrodes comprising an electrode being electrically connected with said transmission line member and an electrode being electrically connected with said ground electrode, said lead terminals are inserted in said through holes with small clearances being defined between said lead terminals and said through-hole electrodes respectively, said lead terminals being capacitively coupled with said transmission line member and said ground electrode through said clearances respectively.

23. A mounting structure in accordance with claim 22, wherein said clearances are filled up with resin.

24. A mounting structure in accordance with claim 21, wherein conductive members are arranged in the vicinity of said through holes respectively, said conductive members comprising a conductive member being electrically connected with said transmission line member and a conductive member being electrically connected with said ground electrode, said lead terminals being capacitively coupled with said transmission line member and said ground electrode through portions of said substrate between said through holes and said conductive members respectively.

25. A mounting structure in accordance with claim 24, wherein said substrate has cavities in the vicinity of said through holes, said conductive members being provided by conductive materials filling up said cavities.

26. A mounting structure in accordance with claim 24, wherein said conductive members are provided by ring electrodes enclosing said through holes, said ring electrodes having inner diameters being larger than diameters of said through holes.

27. A mounting structure in accordance with claim 21, wherein said transmission line member and said ground electrode are formed on said major surface of said substrate.

28. A mounting structure in accordance with claim 21, wherein said transmission line member is formed within said substrate, said ground electrode being formed on said major surface of said substrate.