Megasonic cleaning system

• US 5,534,076 A
• Filed: 10/03/1994
• Issued: 07/09/1996
• Est. Priority Date: 10/03/1994
• Status: Expired due to Fees

• Current Assignee: Akrion Technologies Incorporated (Akrion Incorporated)
• Original Assignee: Verteg Incorporated
• Inventors: Bran, Mario E.
• Primary Examiner(s): KASTLER, SCOTT R
• Application Number:
  US08/316,940
• Time in Patent Office: 645 Days
• Field of Search: 134/1, 134/105, 134/184, 134/902
• US Class Current: 134/1
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels

Abstract

A transducer is bonded to a metal carrier that is mounted on an elastomeric frame-like diaphragm. The outer periphery of the diaphragm is mounted on a frame bonded to the bottom of a quartz tank. A vacuum applied to a chamber surrounding the lower portion of the carrier draws the carrier against the tank bottom with a compliant interface between the tank and the carrier. A cover clamps the diaphragm to the support and creates a coolant chamber with the diaphragm and the carrier for cooling the transducer. In other arrangements, resilient material or springs are employed to produce a force to compress the interface against the tank. Also the weight of the tank can produce compressive force on the interface.

Claims

1. An apparatus for processing semiconductor wafers comprising:

a tank having a wall including a portion forming a transmitter of sonic energy;

a frame mounted to an exterior surface of said tank wall;

a flexible diaphragm extending across and supported by said frame;

a transducer carrier supported on the diaphragm with the carrier having a surface held by said diaphragm adjacent to the transmitter; and

a transducer mounted to an opposite surface of said carrier.

2. The apparatus of claim 1, wherein said carrier includes a peripheral flange attached to the diaphragm.

3. The apparatus of claim 1, comprising an interface sandwiched between said carrier and said transmitter which conforms to the adjacent carrier and transmitter surfaces and conducts energy from the carrier to the transmitter.

4. The apparatus of claim 1, further comprising a cover mounted to said diaphragm and forming a carrier coolant reservoir with the diaphragm.

5. The apparatus of claim 1, wherein said diaphragm, said shell, said tank wall, and said carrier form a chamber to which a vacuum may be applied to draw said carrier to said transmitter.

6. The apparatus of claim 1, wherein the diaphragm is made of an elastomeric material, the tank is made of quartz, and the carrier is made of aluminum.

8. The apparatus of claim 1, including a cover secured to the support frame to clamp the diaphragm between the frame and the cover, and to define a coolant chamber in combination with the carrier and the diaphragm.

9. The apparatus of claim 1, including a coolant inlet and a coolant outlet in the cover and opening to the coolant chamber.

10. The apparatus of claim 9, including a partition extending between sidewalls of the carrier to form a gas chamber between the partition and a portion of the carrier, and a conduit extending through the partition for conducting purge gas into the gas chamber.

7. Apparatus for processing semiconductor wafers comprising:

a quartz tank having a bottom wall including a shell having a convex surface forming an interior surface of the tank and having a concave surface forming an exterior surface of the tank;

a carrier positioned beneath said shell and having a convex exterior surface positioned in close proximity to the concave surface of the shell, the carrier having a concave downwardly facing surface opposite the carrier convex surface;

an arcuate transducer having a convex exterior surface which conforms to the concave surface of the carrier and is coupled to the concave surface of the carrier so that sonic energy from the transducer is transmitted to the carrier;

an interface between the carrier and the shell to conform to the adjacent shell and carrier surfaces and adapted to transmit sonic energy from the carrier to the shell;

a support frame bonded to an exterior surface of the tank and surrounding and spaced outwardly from portions of the carrier depending below the tank bottom wall; and

an elastomeric frame-shaped diaphragm attached to a lower surface of the support frame and attached to the depending portions of the carrier to flexibly support the carrier, a chamber being formed that is bounded by an interior wall of the support frame, lower portions of the carrier and the diaphragm, the chamber being pneumatically sealed so that a vacuum may be applied to the chamber to a degree sufficient to draw the carrier upwardly to compress the interface into intimate contact between the carrier and the tank, with said diaphragm being sufficiently flexible to accommodate the upward movement of the carrier.

11. Apparatus for processing semiconductor wafers comprising:

a flexible diaphragm for mounting to a support, adjacent a processing tank;

a transducer carrier supported on said diaphragm for flexible movement; and

a transducer adapted to convert electrical energy into sonic energy, the transducer being coupled to the carrier so that the sonic energy is transmitted to the carrier.

12. The apparatus of claim 11, comprising a support frame, said diaphragm extending across and being mounted to the frame.

13. The apparatus of claim 12, wherein said diaphragm has a central opening, and the carrier extends across the opening.

14. The apparatus of claim 13, comprising a partition mounted on said transducer carrier and creating a chamber enclosing said transducer.

15. The apparatus of claim 11, wherein said carrier has a portion in the shape of a half cylinder.

16. The apparatus of claim 11, wherein said carrier is substantially flat over a portion of its surface.

17. An apparatus for processing semiconductor wafers, comprising:

a tank having a wall including a portion forming a transmitter of sonic energy;

a flexibly mounted transducer carrier having a surface which conforms to and mates with said tank wall portion;

a transducer coupled to a surface of said carrier opposite from said mating surface in a manner to propagate sonic energy into the carrier when the transducer is electrically energized; and

an interface layer between the tank wall portion and the carrier mating surface, the interface being conformable to the tank and carrier surfaces which it engages and being capable of transmitting sonic energy from the carrier to the tank wall portion when the interface layer is compressed between the carrier and the tank wall portion, wherein said interface layer is such that the carrier can be readily withdrawn from the tank when the force compressing the interface layer is withdrawn.

18. The apparatus of claim 17, including means for producing the force which compresses the interface layer between the tank and the carrier.

21. The apparatus of claim 18, wherein said force producing means includes resilient structures arranged to press the carrier against the interface layer.

22. The apparatus of claim 21, wherein the carrier is positioned to receive a portion of the weight of the tank, and the resilient structure is situated to receive the load applied to the carrier;

and said apparatus further includes a support positioned to receive load from the tank and to limit the tank load which is transmitted through the carrier and said resilient structure.

23. The apparatus of claim 17, including one or more springs positioned to press the carrier against the interface layer.

24. The apparatus of claim 17, wherein said carrier includes a tube, and including resilient means compressing the tube against the tank wall portion.

19. An apparatus for processing semiconductor wafers comprising:

a tank having a wall including a portion forming a transmitter of sonic energy;

a transducer carrier having a surface which conforms to and mates with said tank wall portion;

a transducer coupled to a surface of said carrier opposite from said mating surface in a manner to propagate sonic energy into the carrier when the transducer is electrically energized;

an interface layer between the tank wall portion and the carrier mating surface, the interface being conformable to the tank and carrier surfaces which it engages and being capable of transmitting sonic energy from the carrier to the tank wall portion when the interface layer is compressed between the carrier and the tank wall portion, wherein said interface layer is such that the carrier can be readily withdrawn from the tank when the force compressing the interface layer is withdrawn; and

means for producing the force which compresses the interface layer between the tank and the carrier, said means including a support for the carrier that enables the carrier to be pressed against the interface layer, or a vacuum applied to a chamber formed by the support, the carrier, and portions of said tank adjacent said carrier, with said chamber being open to the interface layer, and with the chamber being constructed such that when a vacuum is applied to the chamber the vacuum produces a force drawing the carrier towards the tank portion so as to compress the interface layer.

20. The apparatus of claim 19, wherein the carrier is a tube.

25. A method of transmitting sonic energy into a tank which has a wall portion adapted to efficiently transmit sonic energy comprising:

providing a transducer carrier having a surface which mates with and conforms to an exterior of said tank wall portion;

flexibly mounting the carrier adjacent said wall portion;

coupling a transducer to a surface of the carrier opposite said mating surface in a manner that enables the transducer to propagate megasonic energy into the carrier when the transducer is electrically energized;

positioning an interface layer between the carrier and the tank wall portion, the interface layer being adapted to conform to the mating surfaces of the tank wall portion and the carrier; and

compressing the interface layer between the carrier and the tank wall portion, said interface layer being formed of material which will efficiently transmit sonic energy from the carrier to the tank wall portion when the layer is compressed between the carrier and the tank wall portion.

28. The method of claim 25, wherein said compressing step is accomplished by positioning the carrier and the tank so that the carrier receives a portion of the weight of the tank.

29. The method of claim 28, including limiting the tank load applied to the carrier by means of compressible structure connected to the carrier which compresses to shift tank load to other support structure beyond said weight portion.

26. A method of transmitting sonic energy into a tank which has a wall portion adapted to efficiently transmit sonic energy comprising:

providing a transducer carrier having a surface which mates with and conforms to an exterior of said tank wall portion;

coupling a transducer to a surface of the carrier opposite said mating surface in a manner that enables the transducer to propagate megasonic energy into the carrier when the transducer is electrically energized;

positioning an interface layer between the carrier and the tank wall portion, the interface layer being adapted to conform to the mating surfaces of the tank wall portion and the carrier; and

compressing the interface layer between the carrier and the tank wall portion with a vacuum which produces a force urging the carrier and the tank wall portion towards each other, said interface layer being formed of material which will efficiently transmit sonic energy from the carrier to the tank wall portion when the layer is compressed between the carrier and the tank wall portion.

27. A method of transmitting sonic energy into a tank which has a wall portion adapted to efficiently transmit sonic energy comprising:

providing a transducer carrier having a surface which mates with and conforms to an exterior of said tank wall portion;

coupling a transducer to a surface of the carrier opposite said mating surface in a manner that enables the transducer to propagate megasonic energy into the carrier when the transducer is electrically energized;

positioning an interface layer between the carrier and the tank wall portion, the interface layer being adapted to conform to the mating surfaces of the tank wall portion and the carrier; and

compressing said interface layer between the carrier and the tank wall portion with a resilient structure, said interface layer being formed of material which will efficiently transmit sonic energy from the carrier to the tank wall portion when the layer is compressed between the carrier and the tank wall portion.

30. A method of transmitting sonic energy through a wall of a tank into liquid in the tank to assist in the processing of components submerged in the liquid, comprising:

applying a vacuum to a chamber surrounding a portion of a carrier which has a portion positioned adjacent to a wall of the tank, which is a good transmitter of megasonic energy, the chamber also being formed by the tank wall surrounding the transmitter, a support frame surrounding a portion of the carrier and being attached to said tank wall, and a flexible diaphragm attached to the support frame and having a portion connected to and resiliently supporting the carrier;

applying electrical energy to a transducer sonically coupled to a surface of the carrier to transmit sonic energy through the carrier to the transmitter; and

maintaining the vacuum on the chamber when the sonic energy is being applied to the carrier so that the carrier continues to be drawn against the transmitter.

31. The method of claim 30, comprising the step of applying an interface between the carrier and the shell to facilitate the transmission of sonic energy between the transducer, the carrier, and the transmitter.

32. The method of claim 31, comprising the steps of:

securing a cover to said support frame to form a coolant chamber with the frame, the diaphragm, and the carrier; and

circulating coolant through said coolant chamber to dissipate heat produced during the operation of said transducer.

33. A method of making an apparatus for applying megasonic energy into a tank containing liquid for processing semiconductor substrates, the method comprising:

providing a tank with a wall including an integral portion forming a good transmitter of sonic energy;

providing a carrier having a surface conforming generally to an exterior surface of said transmitter;

coupling a transducer to a surface of the carrier opposite from said conforming surface to transmit sonic energy from the transducer to the carrier;

mounting the carrier to a flexible diaphragm;

attaching a support frame to an exterior surface of said tank wall surrounding the area in which said transmitter is positioned, with the support frame being spaced from said transmitter;

positioning the carrier adjacent the tank transmitter;

attaching the diaphragm to the support frame so that the carrier is held adjacent the tank transmitter; and

drawing the carrier into sonically coupled relation with the transmitter to allow sonic energy to be efficiently transmitted from the transducer through the carrier and through the transmitter into the tank.

34. The method of claim 33, wherein a chamber is formed which surrounds a portion of the carrier that extends out from the tank wall, with the chamber being further bounded by the portion of the tank wall surrounding said transmitter, by the support frame, and by the diaphragm, and including the step of applying a vacuum to the chamber which will draw the carrier toward said transmitter, compressing the interface between the carrier and the transmitter with sufficient force to cause sonic energy to be efficiently transmitted from the transducer, through the carrier, through the interface and through the transmitter.

35. The method of claim 34, including compressing between the carrier and the transmitter a compliant interface that is a good transmitter of sonic energy.

36. An apparatus for processing semiconductor wafers comprising:

a tank having a wall including a portion forming a transmitter of sonic energy;

a transducer carrier removably mounted to said tank adjacent said tank wall portion and having a surface which conforms to and mates with said portion, wherein said carrier can be readily withdrawn from the tank when a force pressing together the carrier and the tank is withdrawn; and

a piezoelectric transducer coupled to a surface of said carrier opposite from said mating surface in a manner to propagate sonic energy into the carrier when the transducer is electrically energized.

37. The apparatus of claim 36, including a support for the carrier that enables the carrier to be pressed against the tank.

38. The apparatus of claim 37, including a chamber formed by the support, the carrier, and portions of said tank adjacent said carrier, said chamber being constructed such that when a vacuum is applied to the chamber, the vacuum produces a force drawing the carrier towards the tank portion so as to press them together.

39. A method of transmitting sonic energy into a tank which has a wall portion adapted to efficiently transmit sonic energy comprising:

providing a transducer carrier having a surface which mates with and conforms to an exterior of the tank wall portion;

flexibly and removably mounting the carrier to the tank;

pressing together the carrier and the tank wall portion; and

coupling a piezoelectric transducer to a surface of the carrier opposite said mating surface in a manner that enables the transducer to propagate megasonic energy into the carrier when the transducer is electrically energized.

40. The method of claim 39, wherein said pressing includes producing a vacuum force urging the carrier and the tank wall portion towards each other.

41. The method of claim 39, wherein said pressing is produced by a resilient structure.

42. The method of claim 39, wherein said pressing is accomplished by positioning the carrier and the tank so that the carrier receives a portion of the weight of the tank.

43. The method of claim 42, including limiting the tank load applied to the carrier by means of compressible structure connected to the carrier which compresses to shift tank load to other support structure beyond said weight portion.

44. An apparatus for applying megasonic energy into a fluid for cleaning an article, comprising:

a tank;

a frame fixed to a wall of the tank without penetrating the wall;

a frame cover attached to the frame;

a piezoelectric transducer which converts electrical energy into megasonic energy; and

a flexible support held in position by said frame and cover, and supporting said transducer in a manner to permit the transducer to be pressed into acoustically coupled relation with a portion of said tank wall outlined by said frame to propagate megasonic energy into the fluid in said tank, said frame cover and said support being readily removable from said frame to enable said transducer to be withdrawn from said tank for repair or replacement.

45. The apparatus of claim 44, including a coolant chamber formed within an area between said tank, frame, and cover for receiving a coolant in heat transfer relation with said transducer.

46. The apparatus of claim 45, including a carrier supported by said flexible support, with said carrier supporting said transducer.

47. The apparatus of claim 46, wherein said carrier is made of a good heat conductive material and is in position to be in heat transfer relation with the coolant.

48. The apparatus of claim 44, including a carrier supported by said flexible support, with said carrier supporting said transducer.

49. The apparatus of claim 44, including an interface layer in contact with said tank wall portion to improve the propagation of said megasonic energy into said tank fluid.