IC card having image information

• US 5,534,372 A
• Filed: 07/25/1994
• Issued: 07/09/1996
• Est. Priority Date: 07/28/1993
• Status: Expired due to Term

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Konica Corporation (Konica Minolta Inc.)
• Inventors: Takimoto, Masataka, Kitamura, Shigehiro, Kawamura, Tomonori, Koshizuka, Kunihiro
• Primary Examiner(s): Bowers, Jr., Charles L.
• Assistant Examiner(s): Young, Christopher G.
• Application Number:
  US08/279,997
• Time in Patent Office: 715 Days
• Field of Search: 430/10, 430/11, 430/14, 430/17, 361/737, 235/380, 264/272.17
• US Class Current: 430/10
• CPC Class Codes: B41M 5/42 Intermediate, backcoat, or covering layers B41M5/405 takes precedence; multilayer thermal transfer systems in general B41M5/38214
• CPC Class Codes: B41M 5/426 characterised by inorganic compounds, e.g. metals, metal salts, metal complexes
• CPC Class Codes: B41M 5/44 characterised by the macromolecular compounds
• CPC Class Codes: G06K 19/083 Constructional details

Abstract

An IC card in which an IC chip is incorporated between a first and second base boards, comprises an image receiving layer on which an ink image is transferred by a thermal transfer method and a cushion layer provided between the IC chip and the image receiving layer so that the cushion layer smooths irregularity caused by the IC chip and improves a flatness of the image receiving layer.

Claims

1. A card in which an IC (integrated circuit) chip is incorporated, said card comprising:

a first base board and second base board constructed to form said card, said first base board having a Vicat Softening Point (°

C.);

an IC chip incorporated between said first base board and said second base board;

an image receiving layer onto which an ink image is transferred from an ink supply sheet by a thermal transfer method, said image receiving layer being disposed on an outside of said first base board; and

a cushion layer provided between said IC chip and said image receiving layer whereby said cushion layer smooths irregularities caused by said IC chip and improves a flatness of said image receiving layer, a softening point of said cushion layer being at least 10°

C. lower than that of said first base board, whereby said cushion layer is softer than said first base board.

2. The card of claim 1, wherein the cushion layer is disposed between the first base board and the image receiving layer.

3. The card of claim 1, wherein the cushion layer is disposed between the IC chip and the first base board.

4. The card of claim 1, wherein the cushion layer is polyolefine.

5. The card of claim 1, wherein the cushion layer has a thickness of 2 to 200 μ

m.

6. The card of claim 1, wherein the cushion layer has a thickness of 5 to 50 μ

m.

7. The card of claim 1, wherein the base board is made of biaxial orientation polyester film.

8. The card of claim 1, wherein the IC chip is located on one section of the card and the ink image is transferred on the other section of the card.

9. The card of claim 1, wherein the ink image is a halftone image.

10. The card of claim 1, wherein a writing layer on which information is written is provided on an outside of the second base board.

11. The card of claim 1, wherein a hard overlay layer to smooth irregularity caused by the IC chip is provided between the base board and the IC chip.

12. The card of claim 1, wherein, after the ink image is transferred on the image receiving layer, an intermediate protective layer is provided on the ink layer and an ultraviolet ray hardening layer is provided on the protective layer.

13. The card of claim 1, wherein the base boards and the cushion layer contain a white pigment.

14. A card in which an IC (integrated circuit) chip is incorporated, said card comprising:

a first base board and a second base board constructed to form said card, said first base board and said second base board having a tensile elastic modulus (ASTM D790) of 210 kgf mm^-2 to 1020 kgm mm^-2 ;

an IC chip incorporated between said first base board and said second base board;

an image receiving layer onto which an ink image is transferred from an ink supply sheet by a thermal transfer method, said image receiving layer being disposed on an outside of said first base board; and

a cushion layer provided between said IC chip and said image receiving layer, said cushion layer having a tensile elastic modulus of 20 kgf mm^-2 to 200 kgf mm^-2, whereby said cushion layer is softer than said first base board, thereby smoothing irregularities caused by said IC chip and improving a flatness of said image receiving layer.