Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
First Claim
1. A Chemical-Mechanical Polishing machine comprising:
- a. a polishing pad;
b. a conditioning head comprising a semiconductor substrate having a non-planar semiconductor surface; and
c. a conditioning head arm for positioning said conditioning head over a surface of said polishing pad.
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Accused Products
Abstract
A pad conditioning method and apparatus for chemical-mechanical polishing. A polishing pad (114) is attached to a platen (112) and used to polish a wafer (116). Rotating arm (118) positions the wafer (116) over the pad (114) and applies pressure. During wafer polishing particles build up on the polishing pad (114) reducing its effectiveness. Either during or in between wafer polishing (or both), conditioning head (122) is applied to pad (114) to remove the particles from pad (114) into the slurry (120). Conditioning head (122) comprises a semiconductor substrate (126) that is patterned and etched to form a plurality of geometries (128) having a feature size on the order of polishing pad (114) cell size.
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Citations
20 Claims
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1. A Chemical-Mechanical Polishing machine comprising:
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a. a polishing pad; b. a conditioning head comprising a semiconductor substrate having a non-planar semiconductor surface; and c. a conditioning head arm for positioning said conditioning head over a surface of said polishing pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A chemical-mechanical polishing (CMP) machine comprising:
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a polishing pad comprising a plurality of cells; and a conditioning head comprising a semiconductor substrate having a non-planar semiconductor surface, wherein said non-planar semiconductor surface is shaped into a plurality of geometries, each of said plurality of geometries having a width on an order of magnitude of a width of one of said cells. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification