Microelectromechanical signal processors
First Claim
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1. A micromechanical signal processor comprising:
- a substrate;
a first rigid mass;
a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate;
a second rigid mass; and
a second flexible structure mechanically movably connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, whereby said first and second rigid masses are mechanically coupled but able to move independently.
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Abstract
A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.
117 Citations
23 Claims
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1. A micromechanical signal processor comprising:
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a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; and a second flexible structure mechanically movably connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, whereby said first and second rigid masses are mechanically coupled but able to move independently. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A micromechanical signal processor comprising:
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a substrate; a first rigid mass; a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate; a second rigid mass; a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate; a third flexible structure mechanically connecting said first mass to said second mass, coupling motions of said first and second masses while allowing said first mass to move relative to said second mass; and a first electrode electrostatically coupled to said first mass. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for fabricating a tunable micromechanical signal processor on a substrate, comprising the steps of:
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fabricating a mass; fabricating a flexible structure mechanically connecting said mass to said substrate and allowing said mass to move relative to said substrate; fabricating a first electrode electrostatically coupled to said mass; fabricating a plurality of trim weights attached by a plurality of microbridges to said mass; and destroying a first group of said microbridges so as to detach a second group of said trim weights from said mass, leaving a remaining third group of said trim weights attached to said mass, whereby a resonance characteristic of said mass is altered.
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Specification