Composite substrates for preparation of printed circuits
First Claim
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1. A printed circuit board comprising:
- (a) a substrate comprising;
a substrate base layer; and
at least one adherent layer fixedly attached to the substrate base layer, said at least one adherent layer comprising a thermosetting material capable of B-stage curing, said at least one adherent layer serving to provide a surface; and
(b) conductive traces, comprising an electrically conductive adhesive composition, that form an electrical interconnect pattern bonded onto said surface of said at least one adherent layer wherein the electrically conductive adhesive composition comprises (1) a high melting point metal, (2) a low melting point metal, (3) a cross-linking agent mixture comprising a protected curing agent and (4) at least one of (i) a resin or (ii) a reactive monomer or polymer which can be cross-linked by the curing agent.
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Abstract
Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180° and about 245° C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.
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Citations
18 Claims
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1. A printed circuit board comprising:
(a) a substrate comprising; a substrate base layer; and at least one adherent layer fixedly attached to the substrate base layer, said at least one adherent layer comprising a thermosetting material capable of B-stage curing, said at least one adherent layer serving to provide a surface; and (b) conductive traces, comprising an electrically conductive adhesive composition, that form an electrical interconnect pattern bonded onto said surface of said at least one adherent layer wherein the electrically conductive adhesive composition comprises (1) a high melting point metal, (2) a low melting point metal, (3) a cross-linking agent mixture comprising a protected curing agent and (4) at least one of (i) a resin or (ii) a reactive monomer or polymer which can be cross-linked by the curing agent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
Specification