MOS composite type semiconductor device

• US 5,539,232 A
• Filed: 05/30/1995
• Issued: 07/23/1996
• Est. Priority Date: 05/31/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yanagisawa, Satoshi, Nakanishi, Hidetoshi
• Primary Examiner(s): Limanek, Robert P.
• Assistant Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/453,823
• Time in Patent Office: 420 Days
• Field of Search: 257/785, 257/341-343, 257/327, 257/328, 257/329, 257/773, 257/765, 257/727, 257/150, 257/151, 257/177, 257/178, 257/180, 257/181, 257/574, 257/401, 257/378, 257/370
• US Class Current: 257/341
• CPC Class Codes: H01L 23/4824 Pads with extended contours, e.g. grid structure, branch structure, finger structure
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A plurality of segments of small-sized IGBT devices are arranged concentrically in a plurality of rows in a pellet substrate. Each segment has an independent polysilicon gate electrode layer. A gate electrode terminal lead-out portion is provided at a central portion of the pellet substrate. A metal gate electrode layer electrically connects the polysilicon gate electrode layer of at least one of the segments of a unit, which unit is constituted by at least one of the segments arranged radially from the central portion of the pellet substrate towards a peripheral portion of the pellet substrate, to the gate electrode terminal lead-out portion. The metal gate electrode layer includes a trunk wiring portion extending radially from the gate electrode terminal lead-out portion, and a branch wiring portion extending from the trunk wiring portion in a circumferential direction of the pellet substrate and electrically connected to the polysilicon gate electrode layer of each segment. The polysilicon gate electrode layer is rectangular, and the branch wiring portion is connected to the polysilicon gate electrode layer along three peripheral sides of the polysilicon gate electrode layer. The pellet substrate is clamped under pressure between an emitter pressure-contact plate and a collector pressure-contact plate.

Claims

1. A semiconductor device comprising:

a pellet substrate;

a plurality of segments each constituted by at least one MOS composite type semiconductor cell, said segments being arranged concentrically in a plurality of rows in the pellet substrate, each of said segments having an independent polysilicon gate electrode layer;

a gate electrode terminal lead-out portion provided at a central portion of the pellet substrate;

a metal gate electrode layer for electrically connecting to said polysilicon gate electrode layer of at least one of said segments of a unit, said unit having at least one of said segments arranged radially from the central portion of the pellet substrate towards a peripheral portion of the pellet substrate, said metal gate electrode layer including a trunk wiring portion extending radially from said gate electrode terminal lead-out portion and a branch wiring portion extending from the trunk wiring portion in a circumferential direction of the pellet substrate and being electrically connected to said polysilicon gate electrode layer of each of said segments, wherein said polysilicon gate electrode layer is rectangular, and said branch wiring portion is connected to said polysilicon gate electrode layer along three peripheral sides of the polysilicon gate electrode layer; and

a pressure-contact plate for exerting a clamping force on said pellet substrate.

2. The semiconductor device according to claim 1, wherein said MOS composite type semiconductor cell is one of an insulated gate bipolar transistor cell, a MOS controlled thyristor cell, a MOS advanced gate turn off thyristor cell and a power MOSFET cell.

3. The semiconductor device according to claim 1, wherein said metal gate electrode layer includes an A1 layer.

4. The semiconductor device according to claim 1, wherein said metal gate electrode layer includes an A1 layer and a refractory metal layer laminated on said A1 layer.

7. The semiconductor device according to claim 1, further comprising a heat buffer plate interposed between said pressure-contact plate and said pellet substrate.

5. A semiconductor device comprising:

a pellet substrate;

a plurality of segments each constituted by at least one MOS composite type semiconductor cell, said segments being arranged concentrically in a plurality of rows in the pellet substrate, each of said segments having an independent polysilicon gate electrode layer;

a gate electrode terminal lead-out portion provided at a central portion of the pellet substrate;

a metal gate electrode layer for electrically connecting to said polysilicon gate electrode layer of at least one of said segments of a unit, said unit having least one of said segments arranged radially from the central portion of the pellet substrate towards a peripheral portion of the pellet substrate, said metal gate electrode layer including a trunk wiring portion extending radially from said gate electrode terminal lead-out portion and a branch wiring portion extending from the trunk wiring portion in a circumferential direction of the pellet substrate and being electrically connected to said polysilicon gate electrode layer of each of said segments, wherein a defective segment of said plurality of segments is separated by cutting off said branch wiring portion from said trunk wiring portion;

a conductor member for connecting said cut-off branch wiring portion to an emitter electrode, thereby rendering said defective segment non-operable; and

a pressure-contact plate for exerting a clamping force on said pellet substrate.

6. The semiconductor device according to claim 5, wherein said branch wiring portion is cut off from the trunk wiring portion by dropping an etching liquid.

8. A semiconductor device comprising:

a pellet substrate;

a plurality of segments each constituted by at least one MOS composite type semiconductor cell, said segments being arranged concentrically in a plurality of rows in the pellet substrate, each of said segments having an independent polysilicon gate electrode layer;

a gate electrode terminal lead-out portion provided at a central portion of the pellet substrate;

a metal gate electrode layer for electrically connecting to said polysilicon gate electrode layer of at least one of said segments of a unit, said unit having at least one of said segments arranged radially from the central portion of the pellet substrate towards a peripheral portion of the pellet substrate, said metal gate electrode layer including a trunk wiring portion extending radially from said gate electrode terminal lead-out portion and a branch wiring portion extending from the trunk wiring portion in a circumferential direction of the pellet substrate and being electrically connected to said polysilicon gate electrode layer of each of said segments, wherein said polysilicon gate electrode layer is rectangular, and said branch wiring portion is connected to said polysilicon gate electrode layer along three peripheral sides of the polysilicon gate electrode layer.

9. The semiconductor device according to claim 8, wherein said MOS composite type semiconductor cell is one of an insulated gate bipolar transistor cell, a MOS controlled thyristor cell, a MOS advanced gate turn off thyristor cell and a power MOSFET cell.

10. The semiconductor device according to claim 8, wherein said metal gate electrode layer includes an A1 layer.

11. The semiconductor device according to claim 8, wherein said metal gate electrode layer includes an A1 layer and a refractory metal layer laminated on said A1 layer.

12. The semiconductor device according to claim 8, wherein a defective segment of said plurality of segments is separated by cutting off said branch wiring portion from said trunk wiring portion.

13. The semiconductor device according to claim 12, further comprising a conductor member for connecting said cut-off branch wiring portion to an emitter electrode, thereby rendering said defective segment non-operable.

14. The semiconductor device according to claim 12, wherein said branch wiring portion is cut off from the trunk wiring portion by dropping an etching liquid.