Testing and exercising individual, unsingulated dies on a wafer
First Claim
1. A method of applying an electronic signal from an external source to individual, unsingulated dies on a semiconductor wafer, comprising the steps of:
- (a) providing an electronic switching mechanism, on an area of the wafer external of the dies, for selectively switching said electronic signal to said dies;
(b) providing a plurality of conductive lines between the electronic switching mechanism and the dies respectively;
(c) applying said electronic signal to the electronic switching mechanism; and
(d) applying a selection signal to the electronic switching mechanism for switching said electronic signal to a selected die designated by said selection signal;
in which step (d) comprises applying said selection signal to the electronic switching mechanism using an e-beam probe.
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Abstract
Signals (including probes) from an external system are selectively connected to a plurality of unsingulated dies on a semiconductor wafer with a minimum number of connections and an electronic selection mechanism resident on the wafer. The electronic selection mechanism is connected to the individual dies by conductive lines on the wafer. The electronic selection mechanism is capable of providing the external signals (or connecting the external probe) to a single die or groups of the dies, and electronically "walking through" the entire plurality of unsingulated dies. Redundant conductive lines may be provided. Diodes and/or fuses may be provided in conjunction with the conductive lines, to protect against various faults which may occur in the conductive lines. Redundant electronic selection mechanisms may also be provided to ensure the ability to selectively provide signals to the unsingulated dies.
96 Citations
20 Claims
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1. A method of applying an electronic signal from an external source to individual, unsingulated dies on a semiconductor wafer, comprising the steps of:
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(a) providing an electronic switching mechanism, on an area of the wafer external of the dies, for selectively switching said electronic signal to said dies; (b) providing a plurality of conductive lines between the electronic switching mechanism and the dies respectively; (c) applying said electronic signal to the electronic switching mechanism; and (d) applying a selection signal to the electronic switching mechanism for switching said electronic signal to a selected die designated by said selection signal; in which step (d) comprises applying said selection signal to the electronic switching mechanism using an e-beam probe. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of performing dynamic burn-in of individual, unsingulated dies on a semiconductor wafer, comprising the steps of:
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(a) providing an electronic switching mechanism, on an area of the wafer external of the dies, for selectively switching an electronic burn-in signal to said dies; (b) providing a plurality of conductive lines between the electronic switching mechanism and the dies respectively; (c) applying said electronic burn-in signal to the electronic switching mechanism; and (d) applying a selection signal to the electronic switching mechanism for switching said electronic burn-in signal to a selected die designated by said selection signal; in which step (d) comprises applying said selection signal to the electronic switching mechanism using an e-beam probe. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of applying an electronic signal from an external source to individual, unsingulated dies on a semiconductor wafer, comprising the steps of:
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(a) providing an electronic switching mechanism, on an area of the wafer external of the dies, for selectively switching said electronic signal to said dies; (b) providing a plurality of conductive lines between the electronic switching mechanism and the dies respectively; (c) applying said electronic signal to the electronic switching mechanism; and (d) applying a selection signal to the electronic switching mechanism for switching said electronic signal to a selected die designated by said selection signal; in which; step (d) comprises applying said selection signal to the electronic switching mechanism using an e-beam probe; step (a) comprises providing the electronic switching mechanism as including a flip-flop; and the method further comprises the steps of; (e) providing a touch pad on an area of the wafer external of said dies; and (f) connecting said touch pad, with a second conductive line on the wafer, to a signal input of the flip-flop; and step (d) comprises applying said selection signal to said touch pad using said e-beam probe. - View Dependent Claims (16, 17)
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18. A method of performing dynamic burn-in of individual, unsingulated dies on a semiconductor wafer, comprising the steps of:
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(a) providing an electronic switching mechanism, on an area of the wafer external of the dies, for selectively switching an electronic burn-in signal to said dies; (b) providing a plurality of conductive lines between the electronic switching mechanism and the dies respectively; (c) applying said electronic burn-in signal to the electronic switching mechanism; and (d) applying a selection signal to the electronic switching mechanism for switching said electronic burn-in signal to a selected die designated by said selection signal; in which; step (d) comprises applying said selection signal to the electronic switching mechanism using an e-beam probe; step (a) comprises providing the electronic switching mechanism as including a flip-flop; and the method further comprises the steps of; (e) providing a touch pad on an area of the wafer external of said dies; and (f) connecting said touch pad, with a second conductive line on the wafer, to a signal input of the flip-flop; and step (d) comprises applying said selection signal to said touch pad using said e-beam probe. - View Dependent Claims (19, 20)
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Specification