Antenna feed and beamforming network

• US 5,539,415 A
• Filed: 09/15/1994
• Issued: 07/23/1996
• Est. Priority Date: 09/15/1994
• Status: Expired due to Term

• Current Assignee: Globalstar Incorporated
• Original Assignee: Space Systems/Loral Incorporated (Loral Space and Communications Incorporated)
• Inventors: LeMassena, Richard W., Bruno, Richmond D., Metzen, Phillip L.
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US08/306,820
• Time in Patent Office: 677 Days
• Field of Search: 343/700 MS, 343/850, 343/853, 343/858, 343/864, 342/368
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 25/00 Antennas or antenna systems providing at least two radiating patterns arrangements for changing or varying the orientation or the shape of the directional pattern H01Q3/00

Abstract

This invention is a small, inexpensive lightweight, easy to assemble multibeam or phased array device which may be used as a feed for a reflector or lens antenna. The device employs an array of planar radiators coupled to stripline hybrids to form individual feed or antenna elements. The feed or antenna elements are then coupled into a filter in order to pass the desired band or frequencies and reject undesirable bands or frequencies.

Claims

1. A multibeam phased array which is integrated into a compact package that comprises:

a bonded stripline array package that includes a plurality of planar radiating elements that are etched on said array package and are capable of providing either linear or circular polarization;

a supplemental array of amplifier modules for respective ones of said radiating elements wherein each of said modules contains a MMIC isolator and a bandpass filter;

a multilevel bonded stripline beam-forming network providing multiple beam outputs; and

an interface interconnected between said supplemental array of amplifier modules and said beamforming network;

wherein said beamforming network comprises a plurality of adjacent circuit boards that have M input ports and N output ports, wherein M and N are integers, in which interconnections take place between said adjacent circuit boards by plated through holes, wherein adjacent pairs of said circuit boards are stacked and bonded, and wherein electrical coupling between adjacent pairs of said circuit boards is by quarter-wavelength overlaps separated by bonding film.

2. The phased array claimed in claim 1, further including a heat-sink coupled to said array of amplifier modules for removing heat.

3. A multibeam phased array which is integrated into a compact package that comprises:

a bonded stripline array package that includes a plurality of planar radiating elements that are etched on said array package and are capable of providing either linear or circular polarization;

a supplemental array of amplifier modules for respective ones of said radiating elements wherein each of said modules contains a MMIC isolator and a bandpass filter;

a multilevel bonded stripline beam-forming network providing multiple beam outputs;

an interface interconnected between said supplemental array of amplifier modules and said beamforming network; and

wherein said beamforming network comprises a plurality of wilkinson power dividers within isolation resistors which can be coupled by quarter-wavelength overlaps to facilitate resistor testing.

4. An M-beam phased array antenna assembly, comprising:

a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization;

N amplifiers having outputs coupled to said N RF couplers;

a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein

said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein

adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by tuned RF coupling means.

5. An M-beam phased array antenna assembly as set forth in claim 4, wherein at least a stripline length of said M, N-way power dividers determines a shape and spatial location of said M beams.

6. An M-beam phased array antenna assembly as set forth in claim 4, wherein M is equal to 16 and N is equal to 91.

7. An. M-beam phased array antenna assembly as set forth in claim 4, wherein said M-beam phased array antenna assembly is carried aboard a communications satellite.

8. An M-beam phased array antenna assembly, comprising:

a first multilevel stripline package comprising N annular planar radiating elements, all of which are formed on a surface of said stripline package, and N RF couplers, said N radiating elements providing one of linear and circular polarization;

N amplifiers having outputs coupled to said N RF couplers;

a second multilevel stripline package comprising N, M-way power dividers each of which has an output coupled to one of said N amplifiers and M inputs, wherein M and N are integers, individual ones of said M inputs being coupled to an output of M, N-way power dividers having N outputs and one input, wherein

said second multilevel stripline package is comprised of a plurality of stacked circuit boards in which individual ones of pairs of circuit boards are disposed back-to-back and are electrically coupled together by feedthroughs, and wherein

adjacent circuit boards of adjacent pairs of circuit boards are electrically coupled together by RF coupling means comprised of quarter-wavelength overlapping lines that are separated one from another by a film.