Method for making piezoelectric composites

• US 5,539,965 A
• Filed: 06/22/1994
• Issued: 07/30/1996
• Est. Priority Date: 06/22/1994
• Status: Expired due to Fees

• Current Assignee: Rutgers University
• Original Assignee: Rutgers University
• Inventors: Safari, Ahmad, Janas, Victor F.
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US08/263,564
• Time in Patent Office: 769 Days
• Field of Search: 29/25.35, 310/334, 310/357, 310/358
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/06 operating with piezoelectric effect or with electrostriction piezoelectric or electrostrictive devices per se H10N30/00
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/852 Composite materials, e.g. having 1-3 or 2-2 type connectivity
• CPC Class Codes: H10N 30/8548 Lead-based oxides
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A process for forming piezoelectric composites allows for novel composite designs, including composites with different polarizable material regions and composites with a gradient in volume fraction of polarizable material. Composites with fine-scale microstructures may be formed. The new forming method is an improvement to the traditional "dice and fill" technique currently being utilized to form piezoelectric composites.

Claims

1. A process for making a piezoelectric composite, comprising the following steps:

a) forming a stack of a plurality of polarizable sheets using spacers to provide said sheets in a spaced relationship and to provide unfilled spaces between said sheets;

b) filling the spaces separating said sheets with a filler material, said filler material having an acoustic impedance which is substantially different from the acoustic impedance of the material of said sheets;

c) cutting said composite in a direction transverse to said sheets to provide parallel slots and to the extent to leave an uncut portion of said composite to form a supporting base for the thereby formed parallel composite structures;

d) filling said slots with either said filler material or another material having an acoustic impedance which is substantially different from the acoustic impedance of both said filler material and said sheets; and

e) removing said supporting base to provide a composite.

2. The process of claim 1 wherein the sheets are selected from the group consisting of Pb(ZrTi)O₃, Pb(NbO₃)₂, BaTiO₃, PbZrO₃, PbTiO₃, PbNb₂ O₆, (Pb,Ca)TiO₃, (Pb,Sm)TiO₃, (1-x)Pb(Mg.sub. 1/3 Nb.sub. 2/3)O₃ --xPbTiO₃, Pb(Zn.sub. 1/3 Nb.sub. 2/3)O₃ --PbTiO₃ /BaTiO₃, Pb(Zn.sub. 1/3 Nb.sub. 2/3)O₃ BaTiO₃ --PbTiO₃, or Pb(NbO₂)₂ /PbTiO₃.

3. The process of claim 1 wherein the sheets used consist of at least two different compositions.

4. The process of claim 1 wherein the sheets are equispaced apart from one another.

5. The process of claim 1 wherein the sheets are unevenly spaced apart from one another.

6. The process of claim 1 wherein the sheets used within the composite are between 1 and 10,000 microns in thickness.

7. The process of claim 1 wherein the sheets used within the composite are between 1 and 100 microns in thickness.

8. The process of claim 1 wherein the spacers have a composition with an impedance which is substantially different from the impedance of the filler material and would not substantially interfere with the functioning of the composite.

9. The process of claim 1 wherein the spacers have a composition with an impedance which is not substantially different from the impedance of the filler material and would not substantially interfere with the functioning of the composite.

10. A process of claim 1 wherein the cutting step is accomplished utilizing any combination of mechanical abrasive sawing, laser ablation, ultrasonic cutting, electrodischarge machining and wet or dry etching.

11. The process of claim 1 wherein the filling material used in step (b) is substantially different from the material used in filling step (e).

12. The process of claim 1 wherein after step b and before step c, the spacers are removed.