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Coaxial vias in an electronic substrate

  • US 5,541,567 A
  • Filed: 10/17/1994
  • Issued: 07/30/1996
  • Est. Priority Date: 10/17/1994
  • Status: Expired due to Fees
First Claim
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1. A structure comprising:

  • a layer of material having a first surface and a second surface;

    said layer of material has a through-hole therein extending from said first surface to said second surface;

    said through-hole has a sidewall;

    said sidewall has a layer of electrically conducting material disposed thereon;

    said layer of electrically conducting material has a dielectric layer disposed thereon defining an opening;

    said opening is substantially filled with a solid electrical conductor which terminates at said first surface and at said second surface.

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