Coaxial vias in an electronic substrate

• US 5,541,567 A
• Filed: 10/17/1994
• Issued: 07/30/1996
• Est. Priority Date: 10/17/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Whitehair, Stanley J., Fogel, Keith E., Hedrick, Jeffrey C., Simonyi, Eva E., Viehbeck, Alfred, Lewis, David A.
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US08/323,554
• Time in Patent Office: 652 Days
• Field of Search: 336/200, 336/232, 174/260, 174/261, 174/262, 174/264, 174/265, 174/266
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09636 Details of adjacent, not connected vias
• CPC Class Codes: H05K 2201/09881 Coating only between conductors, i.e. flush with the conductors
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core

Abstract

Structures are described having vias with more than one electrical conductor at least one of which is a solid conductor which is formed by inserting the wire into the via in a substrate wherein the wire is attached to an electrically conductive plate which is spaced apart from the substrate by a spacer which leave a space between the substrate and plate. The space is filled with a dielectric material. The space with via between the conductor and via sidewall is filled with a dielectric material. The via is used for making transformers and inductors wherein one of the via conductors is used for inner windings and another of the via conductors is used for outer windings.

Claims

1. A structure comprising:

a layer of material having a first surface and a second surface;

said layer of material has a through-hole therein extending from said first surface to said second surface;

said through-hole has a sidewall;

said sidewall has a layer of electrically conducting material disposed thereon;

said layer of electrically conducting material has a dielectric layer disposed thereon defining an opening;

said opening is substantially filled with a solid electrical conductor which terminates at said first surface and at said second surface.

2. A structure according to claim 1 wherein said layer of material is formed from a magnetic material.

3. A structure according to claim 1 wherein said layer of material has a first dielectric coating on said first surface and a second dielectric coating on said second surface.

4. A structure according to claim 3, wherein said first dielectric coating has a first layer of electrically conductive material disposed thereon and said second dielectric coating has a second layer of electrically conductive material disposed therein, wherein said electrically conducting material disposed about said sidewall electrically connects said first electrical conductor with said second electrical conductor.

5. A structure according to claim 3, further including a region of a second dielectric material embedded within said first and second dielectric coatings.

6. A structure according to claim 4 further including a third dielectric coating disposed over said first electrical conductor and a fourth dielectric coating dispersed over said second electrical conductor, a third electrical conductor disposed over said third dielectric coating, a fourth electrical conductor disposed over said fourth dielectric coating, said solid electrical conductor electrically connects said third electrical conductor and said fourth electrical conductor.

7. A structure according to claim 6, further including, within at least one of said third dielectric coating and said fourth dielectric coating, a region of an embedded, substantially nonconducting material.

8. A structure according to claim 7, further including a second region of a substantially electrically nonconducting material embedded within said dielectric coating.

9. A structure according to claim 4, further including at least one additional through-hole;

at least one termination means for surface mounting to second surface of said layer of material and electrically connecting to said first layer of electrically conductive material in at least one of said through-holes; and

at least one termination means for surface mounting to said layer of material and electrically connecting to said solid electrical conductor in said at least one additional through hole.

10. A structure according to claim 1 wherein said layer of material is of a substantially noncurrent conducting flux permeable material.

11. A structure according to claim 10 wherein said substantially noncurrent conducting flux permeable material is a ferrite.

12. A structure according to claim 1 wherein said dielectric layer is a polymer.

13. A structure according to claim 1, wherein said structure is a plug having a first and second conductive element adapted for insertion into a socket.

14. A structure according to claim 1, wherein said layer of material has a first and a second surface, further including a first pattern of electrically conductive material disposed on said first surface and a second pattern of electrically conductive material disposed on said second surface, said solid electrical conductor electrically interconnecting said first pattern to said second pattern;

a first dielectric layer disposed on said first pattern and a third pattern of electrical conductor disposed on said first dielectric layer, said solid electrical conductor electrically interconnecting said third pattern to said fourth pattern.

15. A structure comprising:

a plate of material, said plate has a plurality of through-holes extending therethrough;

said through-holes have sidewalls;

a first layer of electrically conductive material covering said sidewalls and electrically connecting said first layer of electrically conductive material in at least one of said through-holes to another said through-hole;

an electrically insulating layer of a first dielectric material covering said first layer of electrically conductive material in said through hole, said first dielectric layer defines an opening which is substantially filled with a solid electrical conductor;

a second layer of electrically conductive material electrically connecting at least one of said solid electrically conductive material in said through-hole to one other.

16. A structure according to claim 15, wherein said structure is a plug having a first and second conductive element adapted for insertion into a socket.

17. A plate of material having a plurality of through-holes extending therethrough;

a first substrate having a first surface with a first pattern of electrical conductor thereon and a second surface with a second pattern of electrical conductor thereon;

a second substrate having a third surface with a third pattern of electrically conductive material thereon and a fourth surface having a fourth pattern of electrically conductive material thereon;

said plate is disposed between said first substrate and said second substrate;

a plurality of solid electrical conductors extending through and substantially filling said through holes, providing electrical interconnection between, and terminating at, said first and second patterns, and between and at said third and said fourth patterns of electrical conductors.

18. A structure according to claim 17, wherein said first and said second substrates are dielectric substrates.

19. A structure according to claim 17, wherein a dielectric material is disposed between said plate and said first substrate and a dielectric material is disposed between said plate and said second substrate.

20. A structure according to claim 17, wherein said plate is a magnetic material.

21. A structure according to claim 17, wherein said first and second patterns, and said third and fourth patterns are concentric coils.

22. A structure comprising:

a substrate having a first side and a second side;

a first dielectric layer disposed on said first side;

a second dielectric layer disposed on said second side;

an embedded region of electrically insulating material embedded within at least one of said first dielectric layer and said second dielectric layer;

a first pattern of electrical conductors disposed on said first side; and

a second pattern of electrical conductors disposed on said second side.

23. A structure according to claim 22, further including:

a first electrical conductor extending through said substrate electrically interconnecting a part of said first pattern of electrical conductors to a part of said second pattern of electrical conductors.

24. A structure according to claim 23, further including:

a third dielectric layer disposed on said first pattern of electrical conductors; and

a fourth dielectric layer disposed on said second pattern of electrical conductors.

25. A structure according to claim 24, further including:

a third electrical conductor pattern on said first dielectric layer;

a fourth electrical conductor pattern on said third dielectric layer; and

a second electrical conductor extending through said substrate electrically interconnecting a part of said third and said fourth electrical conductor pattern.

26. A structure according to claim 25, wherein said structure is an electrical transformer.

27. A structure according to claim 25, wherein said structure is an inductor.

28. A structure according to claim 22, wherein said embedded region of electrically insulating material extends between a first side and a second side of said at least one of said first dielectric layer and said second dielectric layer.

29. A structure according to claim 22, wherein said dielectric region is selected from the group consisting of a sphere and a cylinder and functions as a spacer.

30. A structure according to claim 22, wherein said structure is a plug having a first and second conductive element adapted for insertion into a socket.

31. A structure comprising:

a plate of material having a through-hole therethrough;

said plate of material has a first surface and a second surface;

said first surface has a first pattern of electrical conductors disposed thereon;

said second surface has a second pattern of electrical conductors disposed thereon;

said through-hole has a plurality of solid electrical conductors disposed therein electrically interconnecting said first and second patterns of electrical conductors and terminating thereat.

32. A structure according to claim 31 wherein said solid electrical conductors are selected from the group consisting of pins, posts, wires, rods and whiskers.

33. A structure comprising:

a substrate having a first surface and a second surface;

a first dielectric layer being disposed on said first surface and a second dielectric layer being disposed on said second surface;

a region of electrically insulating material embedded within at least one of said dielectric layers;

a first pattern of electrically conductive material disposed on said first dielectric layer; and

a second pattern of electrically conductive material disposed on said second dielectric layer.

34. A structure according to claim 33, further including:

a first solid electrical conductor extending through said substrate electrically interconnecting a part of said first pattern of electrical conductors to a part of said second pattern of electrical conductors and terminating at each.

35. A structure comprising:

a plate of substantially electrically nonconducting material having a through-hole;

said plate has a first surface with a first pattern of electrically conductive material disposed thereon;

said plate has a second surface with a second pattern of electrically conductive material disposed thereon;

a solid electrical connector substantially filling said through-hole and extending between said first and second patterns;

said solid electrical conductor has a first and a second end;

said first end has a protuberance thereat wherein said protuberance is an enlargement of said solid electrical conductor;

said protuberance is electrically connected to said first pattern of electrically conductive material; and

said enlargement is selected from the group consisting of a ball bond and an ultrasonic bond.

36. A structure comprising:

a plate of substantially electrically nonconducting material having a through-hole;

said plate has a first surface with a first pattern of electrically conductive material disposed thereon;

said plate has a second surface with a second pattern of electrically conductive material disposed thereon;

a solid electrical connector substantially filling said through-hole and extending between said first and said second patterns;

said solid electrical conductor has a first and a second end;

said first end has a protuberance thereat;

said protuberance is electrically connected to said first pattern of electrically conductive material; and

said protuberance is an electrically conductive bonding material.

37. A structure comprising:

a layer of magnetic material;

said layer of magnetic material has a first surface with a first dielectric coating thereon and a second surface with a second dielectric coating thereon;

said coated layer of magnetic material has a through-hole therethrough;

said through-hole has a sidewall;

said sidewall has a layer of nonmagnetic electrically conductive material disposed thereon;

said layer of nonmagnetic electrically conductive material has a dielectric layer disposed thereon defining an opening;

said opening is substantially filled with a solid nonmagnetic electrical conductor;

said first dielectric coating has a first pattern of nonmagnetic electrically conductive material disposed thereon; and

said second dielectric coating has a second pattern of nonmagnetic electrically conductive material disposed thereon;

said nonmagnetic electrically conductive material disposed on said sidewall connects said first and said second patterns;

said first pattern of nonmagnetic electrically conductive material has a third dielectric coating disposed thereon; and

said second pattern of nonmagnetic electrically conductive material has a fourth dielectric coating disposed thereon;

a third pattern of nonmagnetic electrically conductive material is disposed over said third dielectric coating; and

a fourth pattern of nonmagnetic electrically conductive material is disposed over said fourth dielectric coating;

said solid electrical conductor electrically connects said third and said fourth patterns and terminates thereat;

at least one of said third and said fourth patterns further including an additional dielectric coating disposed thereon.

38. A structure comprising:

a plate of material having a through hole;

said plate has a first side with a first layer of conductive material disposed thereon;

said plate has a second side with a second layer of conductive material disposed thereon;

a solid electrical conductor is disposed in and substantially fills said through hole;

said solid electrical conductor has a first end and a second end;

said first end has a protuberance thereat selected from the group consisting of a ball bond and an ultrasonic bond;

said protuberance is an enlargement of said solid electrical conductor;

said protuberance is embedded in and electrically connected to said first layer of electrically conductive material.