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Wafer scribe technique using laser by forming polysilicon

  • US 5,543,365 A
  • Filed: 12/02/1994
  • Issued: 08/06/1996
  • Est. Priority Date: 12/02/1994
  • Status: Expired due to Term
First Claim
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1. A method for preventing cracks as a result of a scribing operation, comprising the steps of:

  • forming a channel in a wafer to provide descrite die;

    heating a first portion of said wafer under the channelcooling a second portion of said first portion to form a polysilicon structure that eliminates the uniform structures of said wafer of silicon within the second portion;

    scribing said second portion in order to separate said die.

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