Package for power semiconductor device with snubber circuit

• US 5,543,659 A
• Filed: 10/21/1994
• Issued: 08/06/1996
• Est. Priority Date: 10/28/1993
• Status: Expired due to Term

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: FULI ELECTRIC CO., LTD.
• Inventors: Hosen, Toru
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US08/327,479
• Time in Patent Office: 655 Days
• Field of Search: 257/666, 257/692, 257/678, 257/685, 257/686, 257/691, 257/693, 257/730, 257/731, 257/732, 257/733
• US Class Current: 257/692
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/10659 Different types of terminals for the same component, e.g. solder balls combined with leads
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/306 Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

A power semiconductor device package of the invention is used for a power conversion equipment. The package is formed of a casing containing a power chip therein, external main circuit terminals for direct-current input and alternating-current output, and pin terminals for connection to an external control circuit. The main circuit terminals and pin terminals are arranged in two rows on the upper surface of the casing. In the invention, at least one of the connecting terminals for a snubber circuit and the support terminals is situated on the upper surface of the casing. The connecting terminals are connected inside the casing to the main circuit terminals for the direct-current input to have the same electric potential. The supporting terminals are arranged adjacent to the pin terminals so that a printed circuit board for the external control circuit can be securely fixed to the casing.

Claims

1. A combination of a printed circuit board for an external control circuit and a power semiconductor device package for a power conversion equipment, said power semiconductor device package comprising,

a casing containing power chips therein,

external main circuit terminals for direct-current input and alternating-current output, and pin terminals for connection to the external control circuit, said main circuit terminals and said pin terminals being arranged separately in two rows on an upper surface of the casing, and

support terminals situated on the upper surface of the casing adjacent to the pin terminals, said printed circuit board for the external control circuit being firmly and securely fixed to the casing through the support terminals, said support terminals forming means for preventing breakage of the pin terminals due to load applied thereto.

2. A combination of a power semiconductor device package for a power conversion equipment and a snubber circuit, said power semiconductor device package comprising,

a casing containing power chips therein,

external main circuit terminals for direct-current input and alternating-current output, and pin terminals for connection to an external control circuit, said main circuit terminals and said pin terminals being arranged separately in two rows on an upper surface of the casing, and

connecting terminals for the snubber circuit situated on the upper surface of the casing and directly connected to the snubber circuit, said connecting terminals being connected inside the casing to the main circuit terminals for the direct-current input and having a same electric potential as in the main circuit terminals.

3. A combination including said external control circuit according to claim 2, wherein said power semiconductor device package further includes support terminals situated on the upper surface of the casing adjacent to the pin terminals, said printed circuit board for the external control circuit being firmly and securely fixed to the casing through the support terminals, said support terminals forming means for preventing breakage of the pin terminals due to load applied thereto.

4. A combination according to claim 3, wherein the external main circuit terminals and the pin terminals are arranged on both sides of the upper surface of the casing parallel to each other, said support terminals are installed on both ends of the row of the pin terminals, and the connecting terminals are installed near the direct-current input terminals.

5. A combination according to claim 4, wherein said direct-current input terminals are located on both ends of the row of the external main circuit terminals.

6. A combination according to claim 2, wherein said connecting terminals are arranged between said two rows to install said snubber circuit therebetween.