Visible light laser diode and manufacturing method of visible light laser diode

• US 5,544,185 A
• Filed: 12/12/1994
• Issued: 08/06/1996
• Est. Priority Date: 12/13/1993
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kato, Manabu, Kadoiwa, Kaoru
• Primary Examiner(s): Lee, John D.
• Application Number:
  US08/355,349
• Time in Patent Office: 603 Days
• Field of Search: 372/43-50
• US Class Current: 372/44.01
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: H01S 2302/00 Amplification / lasing wavelength
• CPC Class Codes: H01S 5/209 special etch stop layers
• CPC Class Codes: H01S 5/2231 with inner confining structure only between the active layer and the upper electrode
• CPC Class Codes: H01S 5/3201 incorporating bulkstrain effects, e.g. strain compensation, strain related to polarisation
• CPC Class Codes: H01S 5/34326 with a well layer based on InGa(Al)P, e.g. red laser

Abstract

A visible light laser diode includes an etching stopping layer having a lower etching rate in an etching solution than a cladding layer, having a larger band gap energy in bulk than the band gap energy of the active layer, including a layer that stops etching, and having a band gap energy exceeding an energy corresponding to the oscillation wavelength of the visible light laser diode. Therefore, the cladding layer can be selectively etched with satisfactory controllability to a predetermined shape. After the etching process, even with a laminated etching stopping layer partly remaining in the cladding layer, the etching stopping layer does not absorb light emitted from the active layer.

Claims

1. A visible light laser diode comprising:

an active layer having a band gap energy;

a cladding layer disposed on said active layer; and

an etching stopping layer for forming said cladding layer, having a shape, and located at a position within said cladding layer, said etching stopping layer comprising at least one crystalline film of Ga_x In_1-x P (0.53≦

x≦

0.57) having a lower etching rate in an etching solution than said cladding layer, having a larger band gap energy in bulk than the band gap energy of said active layer, and that produces a quantum well structure within the cladding layer having a quantum energy level exceeding an energy corresponding to the wavelength of light produced by the visible light laser diode.

2. The visible light laser diode according to claim 1 wherein said etching stopping layer has an etching rate less than one-fiftieth of that of said cladding layer in a sulfuric acid series etching solution.

3. The visible light laser diode according to claim 2 comprising:

a GaAs substrate having a lattice constant; and

a plurality of semiconductor layers grown on said GaAs substrate wherein said active layer is a multiple quantum well structure employing GaInP, said cladding layer is crystalline AlGaInP, and said etching stopping layer has a lattice constant smaller than the lattice constant of said GaAs substrate.

4. The visible light laser diode according to claim 3 wherein said visible light laser diode produces 633 nm band visible light, said active layer comprises Ga₀.5 In₀.5 P, said cladding layer has a band gap energy in bulk of 2.34 eV, and said etching stopping layer has a band gap energy in bulk of 2.00 eV and forms a single quantum well.

5. The visible light laser diode according to claim 4 wherein the single quantum well has a width of about 5 nm.

6. The visible light laser diode according to claim 3 wherein said visible light laser diode produces 633 nm band visible light and said active layer comprises Ga₀.5 In₀.5 P, said cladding layer comprises (Al₀.7 Ga₀.3)₀.5 In₀.5 P, and said etching stopping layer comprises a multiple quantum well structure including alternating crystalline films of Ga_x In_1-x P (0.53≦

x≦

0.57) having respective thicknesses and (Al₀.7 Ga₀.3)₀.5 In₀.5 P.

7. The visible light laser diode according to claim 6 wherein the sum of thicknesses of said Ga_x In_1-x P crystalline films is about 5 nm.

8. The visible light laser diode according to claim 3 wherein said etching stopping layer is disposed at a position at which stress from a lattice mismatch between said etching stopping layer and said GaAs substrate is transferred to said active layer.

9. The visible light laser diode according to claim 3 wherein said visible light laser diode produces 633 nm band visible light, said active layer comprises Ga₀.5 In₀.5 P, and said etching stopping layer has a multiple quantum well structure including alternating crystalline films of Ga_x In_1-x P (0.53≦

x≦

0.57) having respective thicknesses and (Al_y Ga_1-y)_1-x In_x P (0.7≦

y≦

1, 0.53≦

x≦

0.57).

10. The visible light laser diode according to claim 9 wherein the sum of the thicknesses of said Ga_x In_1-x P crystalline layers is about 5 nm.

11. A method for manufacturing a visible light laser diode including processing a cladding layer formed on an active layer into a shape comprising:

employing a material having a lower etching rate in an etching solution than a material forming a cladding layer and having a larger band gap energy in bulk than the band gap energy of said active layer as an etching stopping layer, forming an etching stopping layer including at least one crystalline film of Ga_x In_1-x P (0.53≦

x≦

0.57) within said cladding layer and has a thickness that forms a quantum well structure with said cladding layer that has a quantum energy level exceeding an energy corresponding to the oscillation wavelength of the visible light laser diode.

12. The method for manufacturing a visible light laser diode according to claim 11 comprising:

forming said active layer to have a multiple quantum well structure and including GaInP on a GaAs substrate;

forming a first part of said cladding layer employing AlGaInP on said active layer;

forming on the first part of said first cladding layer said etching stopping layer having a smaller lattice constant than the lattice constant of said GaAs substrate;

forming a second part Of said cladding layer employing AlGaInP on said etching stopping layer; and

etching and removing part of the second part of said cladding layer.

13. The method for manufacturing a visible light laser diode according to claim 12 wherein the second part of said cladding layer is etched with a sulfuric acid etching solution and the ratio of the etching rates of said cladding layer and of said etching stopping layer is about 50:

1.

14. The method for manufacturing a visible light laser diode according to claim 13 wherein said visible light laser diode produces 633 nm band visible light, said active layer comprises Ga₀.5 In₀.5 P, said cladding layer comprises AlGaInP having a band gap energy in bulk of 2.34 eV, and said etching stopping layer has a band gap energy in bulk of 2.00 eV.

15. The method for manufacturing a visible light laser diode according to claim 13 wherein said visible light laser diode produces 633 nm band visible light, said active layer is Ga₀.5 In₀.5 P, said cladding layer comprises (Al₀.7 Ga₀.3)₀.5 In₀.5 P, and said etching stopping layer comprises alternating crystalline films of Ga_x In_1-x P (0.53≦

x≦

0.57) having respective thicknesses and (Al₀.7 Ga₀.3)₀.5 In₀.5 P.

16. The method for manufacturing a visible light laser diode according to claim 15 wherein the sum of thicknesses of said Ga_x In_1-x P crystalline films is about 5 nm.

17. The method for manufacturing a visible light laser diode according to claim 13 comprising forming the first part of said cladding layer in a thickness so that a stress from lattice mismatching between said etching stopping layer and said GaAs substrate is applied to said active layer.

18. The method for manufacturing a visible light laser diode according to claim 13 wherein said visible light laser diode produces 633 nm band visible light, said active layer comprises Ga₀.5 In₀.5 P, said cladding layer comprises (Al₀.7 Ga₀.3)₀.5 In₀.5 P, and said etching stopping layer comprises alternating crystalline films of Ga_x In_1-x P (0.53≦

x≦

0.57) having respective thicknesses and (Al_y Ga_1-y)_1-x In_x P (0.7≦

y≦

1, 0.53≦

x≦

0.57), including etching and partially removing part of the second part of said (Al₀.7 Ga₀.3)₀.5 In₀.5 P cladding layer.

19. The method for manufacturing a visible light laser diode according to claim 18 wherein the sum of thicknesses of said Ga_x In_1-x P crystalline films is about 5 nm.