Pressure sensor and chip therefor

• US 5,544,529 A
• Filed: 10/11/1994
• Issued: 08/13/1996
• Est. Priority Date: 10/08/1993
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Mitani, Tateki, Ichihashi, Motomi, Bessho, Mikio
• Primary Examiner(s): Chilcot, Richard
• Assistant Examiner(s): AMROZOWICZ, PAUL DOUGLAS
• Application Number:
  US08/320,741
• Time in Patent Office: 672 Days
• Field of Search: 73/716, 73/754, 73/721, 73/727
• US Class Current: 73/716
• CPC Class Codes: G01L 15/00 Devices or apparatus for measuring two or more fluid pressure values simultaneously
• CPC Class Codes: G01L 19/003 using a detachable interface or adapter between the process medium and the pressure gauge
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: G01L 9/065 with temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A pressure sensor is capable of detecting a certain pressure and an atmospheric pressure individually and independently in real time, with miniaturization and light weight. This is attained by providing a pressure sensor comprising a first pressure sensor; and an atmospheric pressure sensor. Each sensor includes a pressure-sensitive element and a circuit for amplifying an output signal from the pressure-sensitive element. The amplifying circuit for the first pressure sensor, and the pressure-sensitive element and the amplifying circuit for the atmospheric pressure sensor are provided on the same chip. The amplifying circuit compensates for nonuniformity in characteristics of the pressure-sensitive element due to temperatures.

Claims

1. A pressure sensor comprising:

a first pressure sensor; and

an atmospheric pressure sensor;

wherein each sensor has a respective pressure-sensitive element, and a respective amplifying circuit for amplifying a respective output signal from the respective pressure-sensitive element;

wherein the respective amplifying circuit for the first pressure sensor, and the respective pressure-sensitive element and the respective amplifying circuit for the atmospheric pressure sensor are provided on a single chip; and

wherein the single chip is free of the respective pressure-sensitive element for the first pressure sensor.

2. A pressure sensor according to claim 1, wherein:

each respective amplifying circuit compensates for nonuniformity in characteristics of the respective pressure-sensitive element; and

the nonuniformity in the characteristics is due to temperatures.

3. A pressure sensor according to claim 1, further comprising:

a substrate having a temperature compensating adjustment element for compensating for temperature-caused nonuniformities in characteristics of the respective pressure-sensitive element, the single chip being free of the temperature compensating adjustment element;

wherein the substrate is separated from the single chip by an interposed member that diminishes the influence of heat transfer on the single chip.

4. A pressure sensor according to claim 2, further comprising:

a substrate having a temperature compensating adjustment element for compensating for temperature-caused nonuniformities in characteristics of the respective pressure-sensitive element, the single chip being free of the temperature compensating adjustment element;

wherein the substrate is separated from the single chip by an interposed member that diminishes the influence of heat transfer on the single chip.

5. A chip for a pressure sensor, comprising:

a first circuit for amplifying an output signal corresponding to a certain detected pressure;

only one pressure-sensitive element; and

a second circuit for amplifying an output signal from the pressure-sensitive element;

wherein the pressure-sensitive element detects an atmospheric pressure.