Copper-clad laminate and printed wiring board
First Claim
1. In a copper clad laminate which consists essentially of an electrolytic copper foil (1) and a substrate (3), said substrate (3) having two sides, said electrolytic copper foil (1) having a glossy surface side (1a) and a matte surface side (1b), a granular copper layer (2) being electrodeposited on said glossy surface side (1a), said glossy surface side (ia) being bonded through said granular copper layer (2) to at least one side of said substrate (3), the improvement comprising using an electrolytic copper foil (1) having a matte surface roughness Rz as made of about 2.0 to 7.5 μ
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Abstract
The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil on the glossy (shiny) surface side of which a copper electrodeposit is formed, is bonded at its glossy surface side to one side or each of both sides of a substrate, which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board.
31 Citations
4 Claims
- 1. In a copper clad laminate which consists essentially of an electrolytic copper foil (1) and a substrate (3), said substrate (3) having two sides, said electrolytic copper foil (1) having a glossy surface side (1a) and a matte surface side (1b), a granular copper layer (2) being electrodeposited on said glossy surface side (1a), said glossy surface side (ia) being bonded through said granular copper layer (2) to at least one side of said substrate (3), the improvement comprising using an electrolytic copper foil (1) having a matte surface roughness Rz as made of about 2.0 to 7.5 μ
Specification