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Copper-clad laminate and printed wiring board

  • US 5,545,466 A
  • Filed: 07/11/1995
  • Issued: 08/13/1996
  • Est. Priority Date: 03/19/1993
  • Status: Expired due to Term
First Claim
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1. In a copper clad laminate which consists essentially of an electrolytic copper foil (1) and a substrate (3), said substrate (3) having two sides, said electrolytic copper foil (1) having a glossy surface side (1a) and a matte surface side (1b), a granular copper layer (2) being electrodeposited on said glossy surface side (1a), said glossy surface side (ia) being bonded through said granular copper layer (2) to at least one side of said substrate (3), the improvement comprising using an electrolytic copper foil (1) having a matte surface roughness Rz as made of about 2.0 to 7.5 μ

  • m.

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