Electronic device enclosure including a conductive cap and substrate
First Claim
1. An enclosure for an electronic device comprising:
- a conductive semiconductor substrate underlying said electronic device;
a dielectric layer on said substrate;
a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; and
a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap.
18 Assignments
0 Petitions
Accused Products
Abstract
An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27, 29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate ( 12 ) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).
97 Citations
16 Claims
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1. An enclosure for an electronic device comprising:
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a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; and a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An enclosure for an electronic device comprising:
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a conductive semiconductor substrate underlying said electronic device; a conductive cap overlying said electronic device; a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap; and a bonding pad disposed on said conductive semiconductor substrate, wherein said bonding pad is electrically connected to said power supply output. - View Dependent Claims (15)
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16. An enclosure for an electronic device comprising:
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a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; a first power supply output having a substantially fixed potential, wherein said first power supply output is electrically coupled to said conductive semiconductor substrate; and a second power supply output having a substantially fixed potential, wherein said second power supply output is electrically coupled to said conductive cap.
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Specification