Method and apparatus for mapping the edge and other characteristics of a workpiece

• US 5,546,179 A
• Filed: 10/07/1994
• Issued: 08/13/1996
• Est. Priority Date: 10/07/1994
• Status: Expired due to Fees

• Current Assignee: David Cheng
• Original Assignee: David Cheng
• Inventors: Cheng, David
• Primary Examiner(s): Evans, F. L.
• Application Number:
  US08/319,531
• Time in Patent Office: 676 Days
• Field of Search: 356/73, 356/371, 356/375, 356/376, 356/425, 250/559.22, 250/559.27, 250/559.29, 250/559.35, 250/559.36
• US Class Current: 356/73
• CPC Class Codes: G01B 11/255 for measuring radius of curvature measuring diameter G01B11/08
• CPC Class Codes: G01B 11/306 for measuring evenness

Abstract

A method and apparatus for mapping the edge and other characteristics of a wafer. A method for mapping the edge of a wafer includes steps of providing a sensor device over a surface of a wafer on a testing chuck. A beam of electromagnetic energy emitted by the sensor device is reflected from the surface of the wafer and its intensity is measured by the sensor device. The sensor device is focussed and is then positioned at the edge of the wafer by measuring the intensity of the reflected beam as the sensor device is moved. A changed intensity signifies that the sensor device is located at the edge of the wafer. The wafer is incrementally rotated and the intensity of the reflected beam is measured at multiple locations on the edge of the wafer to provide datapoints used in the edge mapping. The height of the wafer is mapped by moving the sensor device in a z direction perpendicular to the surface of the wafer. A focal distance is found where the reflected beam is at a maximum intensity. Multiple focal distances taken from different locations on the wafer are compared to map the height of the wafer. The reflectivity of the wafer is also detected at the focal distance.

Claims

1. A method for mapping the edge of a wafer, the method comprising:

(a) positioning a wafer on a platform, said wafer having a surface and an edge;

(b) providing a sensor device over said surface of said wafer such that a beam of electromagnetic energy emitted by said sensor device is reflected from said surface of said wafer, wherein an intensity of said reflected beam is measured;

(c) providing relative movement between said sensor device and said wafer such that said sensor device is positioned at said edge of said wafer, wherein said intensity of said reflected beam is measured during said relative movement and is utilized to position said sensor device at said edge; and

(d) providing relative rotational movement between said wafer and said sensor device and measuring said intensity of said reflected beam at a plurality of locations on the edge of said wafer as datapoints, said datapoints being utilized in mapping said edge of said wafer.

2. A method as recited in claim 1 wherein said intensity of said reflected beam is measured by said sensor device.

3. A method as recited in claim 2 wherein said rotatable platform is a chuck that has a larger diameter than a diameter of said wafer.

4. A method as recited in claim 2 wherein step (c) includes providing relative linear movement between said sensor device and said wafer until said intensity of said reflected beam is changed, where said changed intensity indicates that said beam emitted by said sensor device is being reflected at said edge of said wafer.

5. A method ms recited in claim 2 wherein step (c) includes the steps of:

focussing said sensor device by providing relative movement between said sensor device and said wafer in a z-direction perpendicular to said surface of said wafer and positioning said sensor device at a distance where said reflected beam detected by said sensor device is near a maximum intensity;

providing relative movement between said sensor device and said wafer in an x-y plane parallel to said surface of said wafer until said intensity of said detected beam is significantly reduced, where said reduced intensity indicates that said emitted beam is being reflected at said edge of said wafer.

6. A method as recited in claim 5 wherein step (d) includes providing relative movement between said sensor device and said wafer in said x-y plane to maintain said sensor device at said edge of said wafer as said wafer is rotated.

7. A method as recited in claim 6 wherein said step of providing relative movement between said sensor device and said wafer in said x-y plane to maintain said sensor device at said edge includes checking if said intensity of said reflected beam has changed after a portion of said relative rotational movement has occurred.

8. A method as recited in claim 7 further comprising a step of storing a plurality of intensity levels of said reflected beam as said relative x-y plane movement occurs, and wherein a derivative of said intensity levels is calculated to accurately determine said position of said edge of said wafer.

9. A method as recited in claim 8 wherein said step of calculating said derivative includes calculating a least square line fit between calculated points of said derivative.

10. A method as recited in claim 5 wherein said relative movement in said x-y plane between said sensor device and said wafer includes moving said sensor device along an x-axis.

11. A method as recited in claim 5 wherein said relative rotational movement includes rotating said platform.

12. A method as recited in claim 5 further comprising a step of mapping a height of said wafer by measuring said maximum intensity of said reflected beam at a plurality of points on said surface of said wafer.

13. A method as recited in claim 12 further comprising a step of measuring the reflectivity of said surface of said wafer using said measured maximum intensity of said reflected beam.

14. A method as recited in claim 13 further comprising a step of reading encoded information marked on said surface of said wafer.

15. A method for mapping the height of a wafer, the method comprising:

(a) positioning a wafer on a rotatable platform, said wafer having a surface positioned in an x-y plane;

(b) providing a sensor device over said surface of said wafer such that a beam of electromagnetic energy emitted by said sensor device is reflected from said surface of said wafer, wherein an intensity of said reflected beam is measured by said sensor device;

(c) focussing said sensor device by providing relative movement between said sensor device and said wafer in a z direction perpendicular to said surface of said wafer and positioning said sensor device at a first focal distance where said reflected beam has near a maximum intensity, wherein said providing relative movement includes moving said sensor device in said z-direction; and

(d) Repeating step (c) for a different location on said surface of said wafer to obtain a second focal distance, where said first focal distance and said second focal distance are utilized in mapping said height of said wafer;

(e) measuring the reflectivity of said surface of said wafer using said measured maximum intensity of said reflected beam; and

(f) mapping said edge of said wafer by moving said sensor device in an x-y plane parallel to said surface of said wafer until said intensity of said detected beam is significantly reduced, where said reduced intensity indicates that said emitted beam is being reflected at said edge of said wafer.

16. A method as recited in claim 15 wherein said step of mapping an edge of said wafer includes the steps of:

rotating said wafer; and

providing relative movement between said sensor device and said wafer in said x-y plane to maintain said emitted beam at said edge of said wafer as said wafer is rotated.

17. A method for mapping the height of a wafer, the method comprising:

(a) positioning a wafer on a rotatable platform, said wafer having a surface positioned in an x-y plane;

(b) providing a sensor device over said surface of said wafer such that a beam of electromagnetic energy emitted by said sensor device is reflected from said surface of said wafer, wherein an intensity of said reflected beam is measured by said sensor device;

(c) focussing said sensor device by providing relative movement between said sensor device and said wafer in a z direction perpendicular to said surface of said wafer and positioning said sensor device at a first focal distance where said reflected beam has near a maximum intensity, wherein said providing relative movement includes moving said sensor device in said z-direction; and

(d) Repeating step (c) for a different location on said surface of said wafer to obtain a second focal distance, where said first focal distance and said second focal distance are utilized in mapping said height of said wafer;

(e) measuring the reflectivity of said surface of said wafer using said measured maximum intensity of said reflected beam; and

(f) reading encoded information marked on said surface of said wafer.