Semiconductor architecture and application thereof

• US 5,546,417 A
• Filed: 10/27/1994
• Issued: 08/13/1996
• Est. Priority Date: 09/18/1992
• Status: Expired due to Fees

• Current Assignee: Integrated Data Systems Inc (ACI Worldwide Incorporated)
• Original Assignee: Stephen Krissman Integrated Data Systems Incorporated
• Inventors: Gorelik, Vladimir
• Primary Examiner(s): Davie, James W.
• Application Number:
  US08/330,309
• Time in Patent Office: 656 Days
• Field of Search: 372/36, 372/109, 372/703, 372/75, 257/80, 257/81, 257/82
• US Class Current: 372/36
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/4025 Array arrangements, e.g. constituted by discrete laser diodes or laser bar H01S5/42 takes precedence
• CPC Class Codes: H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof

Abstract

A new technology in semiconductor electronics is provided wherein basic semiconductor elements (BSEs) are fabricated on the surfaces of hollow, cone-shaped and/or other planar or non-planar substrata. Photosensitive and photoemitting elements are included within each BSE capable of transmitting and receiving signals to and from external sources in a direction that is non-parallel (oblique) to the silicon surface and circuitry plane. Inter-BSE communication are also achieved via fiber optic connectors. In one embodiment, the BSEs may be assembled in an efficient arrangement whereby some number of BSEs (for example, six (6)) are located adjacent and surrounding another "polar" BSE, thereby providing for short opto-electronic connections between the polar BSE and its neighbors. In additional embodiments, a power supply may reside within the internal space of the BSE, and the interior and exterior of the BSEs are designed as opposite electrical poles, thereby providing power to the BSEs. A highly effective method of cooling may also be provided by transferring coolant within conduits into the interior of each BSE, through the power supply and between the exterior of the internal power supply and the substrata. The present invention may also be applied, in one embodiment, to accept visual information in much the same way as the eye of an animal.

Claims

1. A semiconductor element assembly comprising:

(a) a non-planar substrate including a plurality of substrata, wherein said plurality of substrata are interconnected to form a cavity;

(b) a semiconductor material coupled to said non-planar substrate, said semiconductor material including a plurality of integrated circuits interconnected for communication; and

(c) an operation supporting means for supporting the operation of the semiconductor element assembly, wherein said operation supporting means is disposed within said cavity.

2. The semiconductor element assembly of claim 1, wherein said non-planar substrate is substantially curved.

3. The semiconductor element assembly of claim 1, wherein said non-planar substrate is substantially conical.

4. The semiconductor element assembly of claim 1, wherein the said non-planar substrate is substantially frustoconical.

5. The semiconductor element assembly of claim 1, wherein said non-planar substrate is substantially spherical.

6. The semiconductor element assembly of claim 1, wherein said non-planar substrate includes a three-dimensional surface connecting two circles residing in different parallel planes.

7. The semiconductor element assembly of claim 1, wherein said operation supporting means comprises a cooling means for cooling the semiconductor element assembly.

8. The semiconductor element assembly of claim 1, wherein said operation supporting means comprises a power supply means for providing power to the semiconductor element assembly.

9. The semiconductor element assembly of claim 1, wherein said operation supporting means comprises a coolant conduit means travelling through a power supply means and abutting said non-planar substrate, wherein said coolant conduit means contains a fluid coolant for cooling the semiconductor element assembly.

10. The semiconductor element assembly of claim 1, further comprising:

(d) at least one electronic circuit fabricated on said semiconductor material.

11. The semiconductor element assembly of claim 1, wherein said non-planar substrate comprises a material selected from the group consisting of a ceramic material, a pure carbon, and a silicon dioxide.

12. The semiconductor element assembly of claim 11, wherein said non-planar substrate comprises silicon dioxide which is doped to match the lattice structure of said semiconductor material.

13. The semiconductor element assembly of claim 1, wherein said semiconductor material comprises a first semiconductor layer composed of GaAs.

14. The semiconductor element assembly of claim 13, wherein the thickness of said GaAs layer is in the range of 50-200 Angstroms.

15. The semiconductor element assembly of claim 13, wherein said semiconductor material further comprises a second semiconductor layer composed of materials selected from the group consisting of Si and GaAs.

16. The semiconductor element assembly of claim 1, further comprising:

(d) transmitting means coupled to said semiconductor material for transmitting signals from said semiconductor material to a destination external to said semiconductor material.

17. The semiconductor element assembly of claim 16, wherein said transmitting means transmits light signals.

18. The semiconductor element assembly of claim 16, wherein said transmitting means comprises an edge-emitting laser.

19. The semiconductor element assembly of claim 16, wherein said transmitting means comprises a surface-emitting laser.

20. The semiconductor element assembly of claim 19, wherein said surface-emitting laser includes a cone-shaped beam splitter.

21. The semiconductor element assembly of claim 16, wherein said transmitting means further comprises a mirror for reflecting the signals from said transmitting means.

22. The semiconductor element assembly of claim 1, further comprising:

(d) receiving means coupled to said semiconductor material for receiving signals from a source external to said semiconductor material and providing the signals to said semiconductor material.

23. The semiconductor element assembly of claim 22, wherein said receiving means receives light signals.

24. The semiconductor element assembly of claim 22, wherein said receiving means comprises a photo-sensitive element.