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Dielectric ceramic composition and package made of the same composition for packaging semiconductor

  • US 5,547,908 A
  • Filed: 07/20/1994
  • Issued: 08/20/1996
  • Est. Priority Date: 07/30/1993
  • Status: Expired due to Term
First Claim
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1. A dielectric ceramic composition which contains manganese in an amount of from 0.1 to 0.6 parts by weight calculated as an oxide per 100 parts by weight of chief components which are represented in mole percent by the following formula


  • space="preserve" listing-type="equation">xTiO.sub.2 •

    yMgO•

    zSrO
wherein x, y and z are numbers in a region surrounded by the following four points A, B, C and D in a ternary composition,


space="preserve" listing-type="tabular">______________________________________ x y z ______________________________________ A 100 0 0 B 72 0 28 C 57 15 28 D 66.7 33.3 0 ______________________________________ wherein x+y+z=100, andwherein the dielectric ceramic composition has a coefficient of thermal expansion not larger than 9.5×

10-6

C. at a temperature ranging from 0°

to 400°

C.

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