Method and structure for attaching a semiconductor die to a lead frame

• US 5,548,160 A
• Filed: 11/14/1994
• Issued: 08/20/1996
• Est. Priority Date: 11/14/1994
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moden, Walter L., Corbett, Tim J.
• Primary Examiner(s): Limanek, Robert P.
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/337,912
• Time in Patent Office: 645 Days
• Field of Search: 257/666, 257/676, 257/730
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A structure for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.

Claims

1. A semiconductor device comprising:

a) a semiconductor wafer section;

b) a lead frame;

c) a carrier having a generally circular cross section and an outside surface;

d) an adhesive coating said outside surface of said carrier,

wherein said carrier and said adhesive are interposed between said wafer section and said lead frame.

2. The semiconductor device of claim 1 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.

3. The semiconductor device of claim 1 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.

4. The semiconductor device of claim 1 wherein said wafer section comprises a circuit side and a back side, and wherein said circuit side of said wafer section is attached to said lead frame with said adhesive-coated carrier.

5. The semiconductor device of claim 1 wherein said carrier is a cord having a length and a width, said length being substantially greater than said width.

6. A structure for attaching a semiconductor wafer section to a lead frame comprising:

a) a carrier having a generally circular cross section and an outside surface; and

b) an adhesive coating said outside surface of said carrier.

7. The structure of claim 6 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.

8. The structure of claim 6 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.

9. The structure of claim 6 wherein said carrier is a cord having a length and a width, said length being substantially greater than said width.

10. The structure of claim 6 wherein said carrier has a diameter of between about 0.05 mils and about 10 mils.

11. A semiconductor device comprising:

a) a semiconductor wafer section;

b) a support for receiving said wafer section;

c) a carrier having an outside surface and a generally circular cross section;

d) an adhesive coating said outside surface of said carrier,

wherein said carrier and said adhesive are interposed between said wafer section and said support.

12. The semiconductor device of claim 11 wherein a bond line between said wafer section and said support is determined by said carrier.

13. The semiconductor device of claim 11 wherein said carrier has a diameter of between about 0.05 mils and 10 mils.

14. The semiconductor device of claim 11 wherein said semiconductor device is a leads over chip (LOC) device.

15. The semiconductor device of claim 11 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.

16. The semiconductor device of claim 11 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.

17. The semiconductor device of claim 11 wherein a plurality of strands of carrier attach said wafer section to said support.

18. The structure of claim 11 wherein said carrier has a length and a width, said length being substantially greater than said width.

19. A structure for attaching a semiconductor wafer section to a support comprising:

a) a carrier having a generally circular cross section and an outside surface; and

b) an adhesive coating said outside surface of said carrier.

20. The structure of claim 19 wherein said adhesive is a material selected from the group consisting of polymer, thermoplastic, and thermoset.

21. The structure of claim 19 wherein said carrier is a material selected from the group consisting of plastic, polyimide, polymer, and metal.

22. The structure of claim 19 wherein said carrier has a diameter of between about 0.05 mils and about 10 mils.

23. The structure of claim 19 wherein said carrier is generally oval in cross section.

24. The structure of claim 19 wherein said carrier is generally elliptical in cross section.

25. The structure of claim 19 wherein said carrier has a length and a width, said length being substantially greater than said width.

26. A semiconductor device comprising:

a) a semiconductor wafer section;

b) a support for receiving said wafer section;

c) a carrier having a generally elliptical cross section and an outside surface;

d) an adhesive coating said outside surface of said carrier,

wherein said carrier and said adhesive are interposed between said wafer section and said support.

27. The semiconductor device of claim 26 wherein said carrier has a length and a width, said length being substantially greater than said width.

28. The structure of claim 26 wherein said carrier is generally oval in cross section.