Multi-layer composite ultrasonic transducer arrays
First Claim
1. A piezoelectric transducer chip comprising:
- a plurality of transducer elements, at least one of said transducer elements being a multilayer element comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; and
wherein each of said piezoelectric layers of said multilayer element is a piezoelectric composite material comprising a plurality of piezoelectric members formed between adjacent electrodes of said plurality of electrode layers each of said members being spaced apart from adjacent members to thereby form a gap between each of said plurality of piezoelectric members.
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Abstract
A piezoelectric transducer chip comprising a plurality of transducer elements. At least one of the transducer elements is a multi-layer element which comprises a plurality of piezoelectric layers, each of which is separated from the adjacent piezoelectric layers by an electrode layer so that a plurality of capacitive elements is electrically connected in parallel. The plurality of piezoelectric layers are comprised of a plurality of piezoelectric members separated from adjacent members by a gap to form a composite piezoelectric layer. Also disclosed is a method of making a multilayer transducer of a composite piezoelectric material. Alternate embodiments include two-dimensional ultrasonic transducer arrays having multilayer elements formed of a composite piezoelectric material.
146 Citations
25 Claims
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1. A piezoelectric transducer chip comprising:
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a plurality of transducer elements, at least one of said transducer elements being a multilayer element comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitative elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; and wherein each of said piezoelectric layers of said multilayer element is a piezoelectric composite material comprising a plurality of piezoelectric members formed between adjacent electrodes of said plurality of electrode layers each of said members being spaced apart from adjacent members to thereby form a gap between each of said plurality of piezoelectric members. - View Dependent Claims (2, 3, 4, 5, 20)
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6. A piezoelectric transducer chip comprising:
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a plurality of transducer elements arranged in a two-dimensional array, at least one of said transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitive elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers; wherein each of said piezoelectric layers of said multilayer element is a piezoelectric composite comprising a plurality of piezoelectric members formed between adjacent electrodes of said plurality of electrode layers each of said members being spaced apart from adjacent members to thereby form a gap between each of said plurality of piezoelectric members; a first via electrically connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and a second via electrically connecting said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. An ultrasonic transducer array comprising:
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(a) a connector having an upper surface, a lower surface, and an array of connector pads formed in said connector for electrically connecting said upper surface to said lower surface; (b) a piezoelectric transducer chip having a plurality of transducer elements arranged in a two-dimensional array, at least one of said transducer elements being a multilayer element having an internal edge portion and comprising a plurality of piezoelectric layers and a plurality of electrode layers forming a plurality of capacitive elements electrically connected in parallel, each of said plurality of piezoelectric layers being separated from the adjacent piezoelectric layers by one of said plurality of electrode layers, and said piezoelectric layers consisting of a first set of alternating electrode layers and a second set of alternating electrode layers interposed between said first set of alternating electrode layers and wherein each of said piezoelectric layers of said multilayer element is a piezoelectric composite material comprising a plurality of piezoelectric members formed between adjacent electrodes of said plurality of electrode layers each of said members being spaced apart from adjacent members to thereby form a gap between each of said plurality of piezoelectric members; (c) a first via connecting said first set of alternating electrode layers, said first via being electrically insulated from said second set of alternating electrode layers; and (d) a second via connecting in parallel said second set of alternating electrode layers, said second via being electrically insulated from said first set of alternating electrode layers; wherein at least one of said vias is an internal via; (e) means for electrically connecting said first set of alternating electrodes to ground; and (f) means for electrically connecting said second set of alternating electrodes to a corresponding one of said connector pads. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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21. A method of making a two-dimensional transducer chip having at least one multilayer transducer element of a piezoelectric composite material, said method comprising:
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forming a first piezoelectric layer comprising a plurality of members of piezoelectric material wherein each member of said plurality of members is spaced apart from adjacent members to thereby form a gap between said piezoelectric members; forming a second piezoelectric layer comprising a plurality of members of piezoelectric material wherein each member of said plurality of members is spaced apart from adjacent members to thereby form a gap between said piezoelectric members and wherein said piezoelectric members are positioned to form said pattern; forming a first electrode layer on said first piezoelectric layer to electrically connect each of said piezoelectric members to the remainder of said piezoelectric members of said first piezoelectric layer; and attaching said second piezoelectric layer to said first electrode layer such that the piezoelectric members of said first piezoelectric layer are aligned with the piezoelectric members of said second piezoelectric layer and so that each of said piezoelectric members of said second piezoelectric layer are electrically connected to the remainder of said piezoelectric members of said second piezoelectric layer and so that said first piezoelectric layer is electrically connected to said second piezoelectric layer. - View Dependent Claims (22, 23, 24, 25)
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Specification