Metal oxide semiconductor transistors having a polysilicon gate electrode with nonuniform doping in source-drain direction

• US 5,550,397 A
• Filed: 09/01/1994
• Issued: 08/27/1996
• Est. Priority Date: 02/16/1993
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Luryi, Serge, Lifshitz, Nadia
• Primary Examiner(s): LOKE, STEVEN HO YIN
• Application Number:
  US08/299,855
• Time in Patent Office: 726 Days
• Field of Search: 257/57, 257/59, 257/66, 257/72, 257/347, 257/348, 257/349, 257/350, 257/351, 257/352, 257/353, 257/354, 257/412
• US Class Current: 257/412
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/4983 with a lateral structure, e.g. a Polysilicon gate with a lateral doping variation or with a lateral composition variation or characterised by the sidewalls being composed of conductive, resistive or dielectric material

Abstract

The gate electrode of a polysilicon gate MOS transistor--the transistor having either a thin film polysilicon substrate or a bulk monocrystalline substrate--has a pair of contiguous regions: a heavily doped gate electrode region near the source, and a lightly doped gate electrode region near the drain. The gate electrode region near the drain is thus doped significantly more lightly, in order to reduce electric fields in the channel region in the neighborhood of the drain (and hence reduce field induced leakage currents) when voltages are applied to turn transistor OFF. At the same time, sufficient impurity doping is introduced into the gate electrode region near the source in order to enable the transistor to turn ON when other suitable voltages are applied.

Claims

1. A metal insulator thin-film-polysilicon semiconductor transistor structure comprising:

(a) source and drain regions located in the thin-film-polysilicon semiconductor and spaced apart by an intermediate region, located in the thin-film-polysilicon semiconductor, of length L, the intermediate region and the source and drain regions forming a thin-film polysilicon structure,

(b) the insulator located on the intermediate region,

(c) a polycrystalline semiconductor gate electrode layer located on the insulator and consisting essentially of first and second contiguous gate electrode regions,

(d) an insulating substrate having a top major surface contiguous with a bottom major surface of the intermediate region and with the source and drain regions,

the first gate electrode region, having a first average impurity doping concentration, extending from a first location overlying an edge of the source region to an edge of the second gate electrode region,

the second gate electrode region, having a second average impurity doping concentration, extending from the edge of the second gate electrode region to a second location overlying an edge of the drain region,

the ratio of the first to the second average impurity doping concentration being equal to at least 10, and the first gate electrode region having a conductivity type opposite to that of the source drain.

2. The structure of claim 1 further including an utilization means coupled to the drain region.

3. The structure of claim 1 further comprising a gate contact layer directly physically contacting the first gate electrode region,

whereby, when a first voltage is applied to the gate contact layer, both the first and second gate electrode regions go into states of electronic charge accumulation, while a conducting channel is formed in the semiconductor at an interface with the insulator extending from the edge of the source region to the edge of the drain region, and

whereby, when a second voltage is applied to the gate contact layer, the first gate electrode region goes into an electrically conductive state and the second gate electrode region remains in a state of depletion, while the conducting channel is extinguished and the electric field in the semiconductor, underlying the second gate electrode region, in a neighborhood of the edge of the drain region is reduced by virtue of a depletion of the second gate electrode region.

4. The structure of claim 3 further including an utilization means coupled to the drain region.

5. The structure of claim 3 in which the gate electrode layer is substantially aligned with the edges of the source and the drain regions, whereby, the gate electrode layer has a length approximately equal to L.

6. The structure of claim 5 further including an utilization means coupled to the drain region.

7. The structure of claim 5 in which the ratio is greater than approximately 100.

8. The structure of claim 7 further including an utilization means coupled to the drain region.

9. The structure of claim 1 in which the second average impurity doping concentration of the second gate electrode region is equal to or less than approximately 10¹⁷ per cubic centimeter.

10. The structure of claim 9 further including an utilization means coupled to the drain region.

11. The structure of claim 9 in which the first average impurity doping concentration of the first gate electrode region is approximately at least 10¹⁹ per cubic centimeter.

12. The structure of claim 11 further including an utilization means coupled to the drain region.

13. The structure of claim 1, 3, 5, 7, 9 or 11 in which the insulator comprises silicon dioxide.

14. The structure of claim 2, 4, 6, 8, 10 or 12 in which the insulator comprises silicon dioxide.