Improved laminate package for an integrated circuit and integrated circuit having such a package

• US 5,550,403 A
• Filed: 06/02/1994
• Issued: 08/27/1996
• Est. Priority Date: 06/02/1994
• Status: Expired due to Term

• Current Assignee: LSI Corporation (Broadcom, Inc.)
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Carichner, Karla
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/252,692
• Time in Patent Office: 817 Days
• Field of Search: 257/666, 257/702, 257/746, 257/747, 257/789, 257/793, 257/795, 257/787, 257/794, 257/737, 257/738, 257/697
• US Class Current: 257/702
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]

Abstract

An integrated circuit package, and integrated circuit assembly having such a package, includes a base portion and a cover portion which cooperatively enclose an integrated circuit chip. The base and cover portions are formed of composite material and have matching coefficients of thermal expansion. Because the base and cover portions each match the other'"'"'s thermal expansions and contractions, no stresses are generated in the package from heating and cooling during and following operation of the integrated circuit chip, and no such thermally produced physical stresses are transferred to the circuit chip to shorten its life. A version of the package includes plural lamina, and may include facial metallic coating layers on the lamina for shielding, electromagnetic shielding, and electrical interconnection of the integrated circuit chip. Another version of the package utilizes the facial metallic coating layers to join portions of the package by soldering.

Claims

1. An integrated circuit assembly having an integrated circuit die, and a package enclosing said die and providing for electrical interconnection of said die to external electrical circuitry, said package comprising:

a first package portion providing a recess into which said integrated circuit die is received;

a second package portion sealingly cooperating with said first package portion to enclose said integrated circuit die within said recess;

means for effecting corresponding individual electrical interconnection between plural electrical contact pads of said integrated circuit die and plural electrical connection features defined on said package for connection with said external electrical circuitry;

wherein;

said package portions are materially uniform and matched in thermal coefficient of expansion to one another;

said package portions are each formed of the same composite material including a matrix of a fibrous material in a resinous material;

said fibrous material includes glass fibers;

said resinous material includes an epoxy resin; and

said package portions are sealingly secured together by a scrim formed of said epoxy resin carried in a fibrous material.

2. The integrated circuit assembly of claim 1 wherein said fibrous material of said scrim includes glass fibers.

3. The integrated circuit assembly of claim 1 wherein said means for effecting electrical interconnection includes a facial metallic coating layer carried on a portion of said package.

4. The integrated circuit assembly of claim 1 wherein said electrical interconnection with said external electrical circuitry is effected by means of configuring said package to define an external electrical interconnection structure selected from the following group:

a pin grid array, or a solder ball array.

5. The integrated circuit assembly of claim 3 wherein one of said package portions includes plural laminae each formed of said composite material, and said laminae are secured together by interposed scrim of said epoxy resin carried in said fibrous material.

6. The integrated circuit assembly of claim 5 wherein one of said plural laminae carries said facial metallic coating layer.

7. A package for an integrated circuit die, said package comprising:

a first and a second package portion each configured to sealingly cooperate with the other to sealingly enclose said integrated circuit die and to effect electrical interconnection of said die with external electrical circuitry, each of said first and second package portions being formed of composite material including woven fibrous material in a resinous or polymeric matrix;

wherein;

said package further includes one of said package portions being formed of plural laminae each of woven fibrous material in a resinous or polymeric matrix, and each of said laminae being joined to an adjacent laminae by a scrim of woven fibrous material in a resinous or polymeric matrix, and said fibrous material and said matrix material of said package portions and laminae being alike to one another so that said package portions including said laminae are matched to one another in thermal coefficient of expansion.

8. The integrated circuit package of claim 7 wherein said package portions are further sealingly secured to one another by a scrim of woven fibrous material in a resinous or polymeric matrix.

9. The integrated circuit package of claim 7 wherein at least one of said plural laminae carries a facial metallic coating layer, said facial metallic coating layer being electrically conductive, and said coating layer further providing one of electrical interconnection, electrostatic shielding, or electromagnetic shielding for said integrated circuit die.

10. The integrated circuit package of claim 8 wherein said scrim sealingly securing said package portions together is also alike to said package portions, being formed of the same fibrous material and the same resinous or polymeric material.

11. An integrated circuit assembly comprising:

an integrated circuit die;

a package structure for said integrated circuit die, which package structure provides environmental and physical protection, and electrical interconnection to external electrical circuitry for said integrated circuit die, said package structure including;

a first and a second package portions which are each formed of woven fibrous material in a matrix of resinous or polymeric material, and which sealingly cooperate with one another to enclose said circuit die,

internal interconnection means for electrically interconnecting plural contact pads of said integrated circuit die with corresponding electrical conductors of said package structure,

external interconnection means for electrically interconnecting said electrical conductors of said package structure with external electrical circuitry; and

a scrim formed of said woven fibrous material in said matrix of resinous or polymeric material for sealingly securing said package portions together.

12. The integrated circuit assembly of claim 11 wherein said package portions are each formed of woven glass fiber in an epoxy matrix.

13. The integrated circuit assembly of claim 12 wherein one of said package portions includes plural laminae each of woven glass fiber in an epoxy matrix, and at least one of said plural laminae carrying a facial metallic coating layer.