Thermal detection elements with heater

• US 5,550,526 A
• Filed: 12/27/1994
• Issued: 08/27/1996
• Est. Priority Date: 12/27/1994
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Mottahed, Behzad D.
• Primary Examiner(s): Hoang, Tu
• Assistant Examiner(s): EASTHOM, KARL D
• Application Number:
  US08/364,626
• Time in Patent Office: 609 Days
• Field of Search: 338/22 R, 338/25, 361/103, 257/467
• US Class Current: 338/22.00R
• CPC Class Codes: G01R 21/02 by thermal methods , e.g. calorimetric

Abstract

The present invention provides thermal detection elements having a controlled relationship between a thermal radiating and thermal sensing element. The thermal detection element includes an insulating substrate having a plurality of conductive interconnection elements formed on the substrate to permit electrical connection of the substrate with other electrical components. A thermal radiating element is at least partially embedded within the substrate and mounted such it electrically communicates with at least one of the conductive interconnection elements. A thermal sensing element is mounted adjacent the thermal radiating element such that a substantial portion of the thermal energy radiated by the thermal radiating element is channeled to the thermal sensing element. The thermal sensing element is also mounted such that it electrically communicates with at least one of the conductive interconnection elements.

Claims

1. A thermal detection element comprising:

an insulating substrate including an aperture formed therein;

a plurality of conductive interconnection elements formed on the substrate, the conductive interconnection elements configured for electrical connection of the thermal detection element with other electrical components;

a resistor positioned within the substrate aperture such that its upper surface is substantially flush with the

upper surface of the substrate, the resistor electrically communicating with at least one of the conductive interconnection elements; and

a resistor mounted adjacent the thermal radiating element such that a substantial portion of the thermal energy radiated by the resistor is channeled to the thermal sensing element, the thermal sensing element electrically communicating with at least one of the conductive interconnection elements.

2. A thermal detection element according to claim 1 wherein the thermal sensing element is selected from thermistors, thermocouples, temperature-sensing integrated circuits, and semiconductor diodes.

3. A thermal detection element according to claim 1 wherein the thermal sensing element is a thermistor.

4. A thermal detection element according to claim 1 wherein the thermal sensing element is positioned such that it substantially covers the upper surface of the thermal radiator element.

5. A power detection circuit incorporating the thermal sensing element of claim 1.

6. A thermal detection element comprising:

an insulating substrate, the substrate including an aperture, substantially planar upper and lower surfaces, and substantially vertical edge surfaces;

a first pair of lower conductive regions disposed on the lower substrate surface;

a first pair of upper conductive regions disposed on the upper substrate surface

a first pair of edge conductive regions for interconnecting the first pair of upper conductive regions with the first pair of lower conductive regions;

a resistor positioned within the substrate aperture such that its upper surface is substantially flush with the upper surface of the substrate, the resistor electrically communicating with at least the first pair of upper conductive regions;

a second pair of upper conductive regions disposed on the upper substrate surface, the second pair of upper conductive regions separated from the first pair of upper conductive regions by insulating substrate regions;

a second pair of lower conductive regions disposed on the lower substrate surface, the second pair of lower conductive regions being separated from the first pair of lower conductive regions by insulating substrate regions;

a second pair of edge conductive regions for interconnecting the second pair of upper conductive regions with the second pair of lower conductive regions, the second pair of edge conductive regions being separated from the first pair of edge conductive regions by substrate insulating regions;

a thermal sensing elements mounted adjacent the upper surface of the substrate such that the thermal sensing element is positioned adjacent the resistor and contacts at least a portion of the substrate region which is at least partially surrounding the resistor, the thermal sensing element electrically communicating with the second pair of upper conductive regions.

7. A thermal detection according to claim 6 wherein the resistor is selected from thermistors, thermocouples, temperature-sensing integrated circuits, and semiconductor diodes.

8. A thermal detection element according to claim 6 wherein the thermal sensing element is a thermistor.

9. A thermal detection element according to claim 6 wherein the thermal sensing element is positioned such that it substantially covers the upper surface of the thermal radiator element.

10. A power detection circuit incorporating the thermal sensing element of claim 6.