Surface-mounted fuse device
First Claim
Patent Images
1. A thin film surface-mount fuse, said fuse comprising two material subassemblies:
- a. the first subassembly comprising a fusible link, a supporting substrate and terminal pads with a plurality of conductive terminal pad layers, the supporting substrate having an upper surface, lower surface and opposing side surfaces, a first of the plurality of conductive terminal pad layers and the fusible link formed as a single-continuous layer and extending across the upper surface of transporting substrate, the first of the conductive terminal pad layers further extending over at least a part of the opposing side surfaces and terminating on the lower surface of the substrate; and
,b. the second subassembly comprising a single protective layer which overlies the fusible link so as to provide protection from impacts and oxidation.
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Abstract
A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
80 Citations
17 Claims
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1. A thin film surface-mount fuse, said fuse comprising two material subassemblies:
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a. the first subassembly comprising a fusible link, a supporting substrate and terminal pads with a plurality of conductive terminal pad layers, the supporting substrate having an upper surface, lower surface and opposing side surfaces, a first of the plurality of conductive terminal pad layers and the fusible link formed as a single-continuous layer and extending across the upper surface of transporting substrate, the first of the conductive terminal pad layers further extending over at least a part of the opposing side surfaces and terminating on the lower surface of the substrate; and
,b. the second subassembly comprising a single protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A thin film surface mount fuse comprising:
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a. a substrate; b. a fusible link and a first terminal pad layer formed as a single continuous layer disposed on the substrate, wherein the fusible link and the first terminal pad layer are made of a metal selected from a group consisting of copper, silver, nickel, titanium, aluminum and alloys thereof; c. a second terminal pad layer disposed on the first terminal pad layer, wherein the second terminal pad is made of the same metal as the first layer; d. a third terminal pad layer disposed on the second terminal pad layer, wherein the third terminal pad layer is made of nickel; and
,e. a fourth terminal pad layer disposed on the third terminal pad layer, wherein the fourth terminal pad layer is made of tin. - View Dependent Claims (8, 9, 10)
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11. A thin film surface-mount fuse, said fuse comprising:
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a. a substrate; b. a fusible link made of a first conductive metal deposited on the substrate; c. a second conductive metal, other than the first conductive metal, deposited on the surface of the fusible link; and
,d. terminal pads electrically connected to the fusible link, the terminal Dads having a plurality of conductive layers, wherein a first of the plurality of conductive layers and the fusible link form a single continuous film and wherein a second of the plurality of conductive layers is deposited on the first of the plurality of conductive layers and consists of the same metal as the first conductive metal. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification