Collapsible cooling apparatus for portable computer
First Claim
1. A computer system, comprising:
- a base casing;
a heat source in said base casing;
a bottom cover coupled to said base casing such that an open space exists between said base casing and said bottom cover in a first position of said computer system, wherein a minimal space exists between said base casing and said bottom cover in a second position of said computer system, wherein said minimal space is smaller than said open space; and
a heat sink thermally coupled to said heat source, said heat sink having an open extended position and a collapsed position, wherein movement of said computer system from said first position to said second position causes said heat sink to move from said open extended position to said collapsed position and movement of said computer system from said second position to said first position causes said heat sink to move from said collapsed position to said open extended position.
1 Assignment
0 Petitions
Accused Products
Abstract
A collapsible heat sink for cooling heat generated by components in a computer system. The heat sink is positioned in an open space formed between a base casing and a bottom cover of the computer system. The heat sink comprises folding fins and cold plates made of conductive surfaces. When the heat sink is in an open position, the folding fins are in an extended position. In the open position, the heat sink exposes the conductive surfaces including the cold plates and the folding fins in the extended position, thereby dissipating the heat generated by the components of the computer system. In a collapsed position of the heat sink, the folding fins are folded. In the collapsed position, the heat sink fits in a minimal space formed between the bottom cover and the base casing of the computer system. As a result, the heat sink consumes minimal additional space.
-
Citations
52 Claims
-
1. A computer system, comprising:
-
a base casing; a heat source in said base casing; a bottom cover coupled to said base casing such that an open space exists between said base casing and said bottom cover in a first position of said computer system, wherein a minimal space exists between said base casing and said bottom cover in a second position of said computer system, wherein said minimal space is smaller than said open space; and a heat sink thermally coupled to said heat source, said heat sink having an open extended position and a collapsed position, wherein movement of said computer system from said first position to said second position causes said heat sink to move from said open extended position to said collapsed position and movement of said computer system from said second position to said first position causes said heat sink to move from said collapsed position to said open extended position. - View Dependent Claims (2, 3)
-
-
4. A heat sink for dissipating heat generated by a heat source, comprising:
-
a top cold plate thermally coupled to said heat source; and a first folding fin having at least one fold thermally coupled to said top cold plate, said folding fin having an extended position and a folded position. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A computer system, comprising:
-
a base casing; a heat source in said base casing; a bottom cover pivotally coupled to said base casing such that an open space exists between said base casing and said bottom cover in a first position of said computer system; and a heat sink thermally coupled to said heat source, said heat sink positioned in said open space, wherein said heat sink has an open position and a collapsed position, said heat sink in said open position when said computer system is in said first position, said heat sink capable of dissipating heat generated by said heat source in said open position, and wherein a minimal space exists between said bottom cover and said base casing in a second position of said computer system, when said computer system is in said second position and said heat sink is in said collapsed position. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
-
-
36. A cooling apparatus for cooling a heat source, said cooling apparatus comprising:
-
a heat sink with a thermal conductive interface to said heat source, said heat sink having an open position and a collapsed position, said heat sink exposing a substantial thermal conductive area in said open position so as to dissipate heat generated by said heat source, said heat sink occupying minimal space in said collapsed position, wherein said heat sink comprises a folding fin having an extended position and a folded position, said folding fin in said extended position when said heat sink is in said open position, said folding fin in said folded position when said heat sink is in said collapsed position, and wherein said heat sink further comprises a first plate and a second plate, said first plate conductively coupled to a first side of said folding fin, said first plate conductively coupled to said heat source to form said thermal conductive interface, said second plate coupled to a second side of said folding fin, wherein said second plate is coupled to said first plate by a pivot; and a thermally non-conductive surface coupled to said second plate.
-
-
37. A cooling apparatus for cooling a heat source, said cooling apparatus comprising:
a heat sink with a thermal conductive interface to said heat source, said heat sink having an open position and a collapsed position, said heat sink exposing a substantial thermal conductive area in said open position so as to dissipate heat generated by said heat source, said heat sink occupying minimal space in said collapsed position, wherein said heat sink comprises a folding fin having an extended position and a folded position, said folding fin in said extended position when said heat sink is in said open position, said folding fin in said folded position when said heat sink is in said collapsed position, wherein said folding fin is a folded foil, wherein said folded foil comprises a thermally conductive material which is selected from the group comprising of aluminum or copper, and wherein said heat sink further comprises a cold plate and a thermally non-conductive surface, said cold plate thermally coupled to a first side of said folding fin and said thermal conductive interface, said thermally non-conductive surface coupled to a second side of said folding fin. - View Dependent Claims (38, 39)
-
40. A computer system, comprising:
-
a base casing having a first edge; a heat source in said base casing; a thermally non-conductive surface member coupled to said base casing, said thermally non-conductive surface member having a first edge such that an open space exists between said first edge of said thermally non-conductive surface member and said first edge of said base casing in a first position of said computer system; and a heat sink thermally coupled to said heat source and said thermally non-conductive surface member, said heat sink is in an open extended position when said computer system is in said first position. - View Dependent Claims (41)
-
-
42. A cooling apparatus for cooling a heat source, said cooling apparatus comprising:
-
a heat sink with a thermal conductive interface to said heat source, said heat sink having an open position and a collapsed position, said heat sink exposing a substantial thermal conductive area in said open position so as to dissipate heat generated by said heat source, said heat sink occupying minimal space in said collapsed position, and wherein said heat sink includes a folding fin having at least one fold, wherein said folding fin having an extended position and a folded position, said folding fin in said extended position when said heat sink is in said open position, and said folding fin in said folded position when said heat sink is in said collapsed position. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
-
Specification