Electronic unit

• US 5,552,961 A
• Filed: 05/18/1995
• Issued: 09/03/1996
• Est. Priority Date: 05/18/1995
• Status: Expired due to Term

• Current Assignee: RPX Clearinghouse LLC (RPX Corporation)
• Original Assignee: Northern Telecom Limited (Nortel Networks Corporation)
• Inventors: Van Gaal, Adrianus P., Humphreys, Richard J., Atkinson, John C., Chawla, Amit, Chan, Yee-Ning
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/443,515
• Time in Patent Office: 474 Days
• Field of Search: 165/80.5, 165/104.11, 165/104.19, 165/104.21, 165/104.33, 174/15.2, 174/16.3, 257/718-719, 257/712, 257/714, 257/726-727, 257/795, 257/796, 361/689, 361/698-699, 361/700, 361/704, 361/707-710, 361/714-715, 361/730, 361/752
• US Class Current: 361/700
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs

Abstract

Electronic unit in which a printed circuit board is located within a housing which includes a heat sink. The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship. Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases. Preferably the heat conductive efficiency of the compressible member increases as compression increases.

Claims

1. An electronic unit comprising a housing including a heat sink, an electronic circuitry member within the housing, biasing means normally operable to urge the heat sink and the circuitry member away from relative positions in which the circuitry member is in heat conductive relationship with the heat sink, and means heat conductively connected to the circuitry member and operable as temperature increases through specific temperature conditions to urge the circuitry member towards the heat sink to bring the circuitry member into heat conductive relationship with the heat sink and remove heat from the circuitry member, the means heat conductively connected to the circuitry member then being operable as the temperature decreases through the specific temperature conditions to allow the biasing means to urge the circuitry member away from the heat sink and out of heat conductive relationship with the heat sink, the electronic unit also including a heat conduction means disposed intermediate the heat sink and the circuitry member, the heat conduction means being compressible and increasing in heat conductive efficiency as compression increases, the heat conduction means being compressed between the heat sink and the circuitry member as the circuitry member moves towards the heat sink.

2. An electronic unit according to claim 1 wherein the heat conduction means comprises at least one member of compressible cellular material.

3. An electronic unit comprising a housing including a heat sink, an electronic circuitry member within the housing, biasing means normally operable to urge the heat sink and the circuitry member away from relative positions in which the circuitry member is in heat conductive relationship with the heat sink, and means heat conductively connected to the circuitry member and operable as temperature increases through specific temperature conditions to urge the circuitry member towards the heat sink to bring the circuitry member into heat conductive relationship with the heat sink and remove heat from the circuitry member, the means heat conductively connected to the circuitry member then being operable as the temperature decreases through the specific temperature conditions to allow the biasing means to urge the heat sink and the circuitry member away from the heat sink and out of heat conductive relationship with the heat sink, and wherein the means operational through specific high temperature conditions comprises a cylinder, piston means movable within the cylinder and extending outwardly from the cylinder, and a phase change material within a chamber of the cylinder, the biasing means urging the piston means inwardly of the cylinder into a position dictated by the volume of the phase change material, the phase change material being in a solid phase at temperatures below the specific high temperature conditions and in a liquid phase at temperatures above the specific high temperature conditions, expansion of the material accompanying change to the liquid phase to urge the circuitry member towards the heat sink.

4. An electronic unit according to claim 3 wherein the piston is spaced from the walls of the cylinder and is surrounded by a liquid impermeable barrier which seals the cylinder chamber from ambient conditions, and the phase change material occupies the whole of the volume of the cylinder chamber which is unoccupied by the piston and by the liquid impermeable barrier.

5. An electronic unit according to claim 3 including a heat conduction means disposed intermediate the heat sink and the circuitry member, the heat conduction means being compressible and increasing in heat conductive efficiency as compression increases, the heat conductive means being compressed between the heat sink and the circuitry member as the circuitry member moves towards the heat sink.

6. An electronic unit comprising a housing including a heat sink, an electronic circuitry member within the housing, the electronic circuitry member comprising a planar base element and at least one electronic component carried by the planar base element, heat insulating means disposed between the circuitry member and the heat sink, biasing means normally operable to urge the heat sink and the circuitry member away from relative positions in which the circuitry member is in heat conductive relationship with the heat sink, and means heat conductively connected to the circuitry member and operable as temperature increases through specific temperature conditions to urge the circuitry member towards the heat sink to bring the circuitry member into heat conductive relationship with the heat sink and remove heat from the circuitry member, the means heat conductively connected to the circuitry member then being operable as the temperature decreases through the specific temperature conditions to allow the biasing means to urge the heat sink and the circuitry member away from the heat sink and out of heat conductive relationship with the heat sink.

7. An electronic unit according to claim 6 including heat conduction means disposed intermediate the heat sink and the planar base element, the heat conduction means comprising at least one compressible member extending through the insulating means to provide a heat conductive path between the heat sink and the planar base element as the circuitry member is urged towards the heat sink, the compressible member increasing in heat conductive efficiency as compression increases, and the compressible member being compressed between the heat sink and the circuitry member as the circuitry member moves towards the heat sink.

8. An electronic unit according to claim 7 wherein the at least one compressible member is made from a compressible cellular material.

9. An electronic unit according to claim 8 wherein the at least one compressible member is formed from silicon.

10. An electronic unit according to claim 7 wherein the heat insulating means comprises a substantially planar heat insulating element facing one side of the planar base element.

11. An electronic unit according to claim 10 wherein the biasing means is disposed between one side of the planar base element and the heat insulating element and a resilient means, stronger than the biasing means is located in a position spaced from the other side of the planar base element, stop means being provided to limit movement of the resilient means towards the base element, and the means operable at the specific high temperature conditions is disposed between the resilient means and the planar base element to urge the planar base element away from the resilient means as it is being urged towards the heat sink.

12. An electronic unit according to claim 11 wherein the means operable as the temperature increases through specific high temperature conditions comprises at least one cylinder and piston means in each of which the piston means is movable within the cylinder and extend outwardly from the cylinder, and a phase change material is disposed within a chamber of the cylinder, the biasing means normally urging the planar base element towards the resilient means and to urge the piston inwardly of the cylinder into a position dictated by the phase change material which is in a solid phase at temperatures below the specific high temperature conditions and the liquid phase at temperatures above the specific high temperature conditions, expansion of the phase change material accompanying change to the liquid phase to urge the piston means outwards thereby urging the planar base element away from the resilient means and towards the heat sink.

13. An electronic unit according to claim 12 wherein in the at least one cylinder and piston means, the piston is spaced from walls of the cylinder and is surrounded by a liquid impermeable barrier which seals the cylinder chamber from ambient conditions, and the phase change material occupies the whole of the volume of the cylinder chamber which is unoccupied by the piston and by the liquid impermeable barrier.

14. An electronic unit according to claim 12 wherein the heat conduction means comprises at least one compressible member extending through the insulating means to provide a heat conductive path between the heat sink and the planar base element as the circuitry member is urged towards the heat sink, the compressible member increasing in heat conductivity efficiency as compression increases, the compressible member being compressed between the heat sink and the circuitry member as the circuitry member moves towards the heat sink.

15. An electronic unit according to claim 14 wherein the at least one compressible member is made from a compressible cellular material.

16. An electronic unit according to claim 15 wherein the at least one compressible member is formed from silicon.

17. An electronic unit according to claim 12 wherein a plurality of cylinder and piston means are included and the biasing means includes a plurality of biasing springs, the plurality of cylinder and piston means and the plurality of biasing springs positioned to insure movement of the planar base element towards and away from the heat sink while maintaining the element in any one of an infinite number of parallel planes.

18. An electronic unit according to claim 17 wherein in each piston and cylinder means, the cylinder acts against said other side of the planar base element and extends through the planar base element to slidably move within a chamber defined by the heat insulating element, the heat insulating element insulating the cylinder from the heat sink, and the piston extends outwards from the cylinder to act against the resilient means which comprises a leaf spring.

19. An electronic unit according to claim 18 wherein the heat insulating means also includes mounting means for the planar base element, the mounting means extending from the heat insulating means with the planar base element slidable upon the mounting means for movement towards and away from the heat insulating element, the heat insulating means also including insulating wall means which extends downwardly around edges of the planar base element to heat insulate it from the housing and heat sink and the resilient means is mounted upon the free end of the mounting means with the stop means for the resilient spring provided by surface means of the insulating wall means.

20. An electronic unit comprising a housing having at one side a heat sink comprising a planar wall with heat exchange projections extending exteriorly of the housing;

an electronic circuitry member comprising a planar base element within the housing and disposed parallel to the planar wall, the circuitry member including electronic components mounted upon the planar base element;

a heat insulating means comprising a planar heat insulating element extending between the planar base element and the planar wall of the heat sink;

biasing means to urge the circuitry member away from the heat sink and into a position of minimal heat conductive relationship with the heat sink;

heat conduction means extending through the planar heat insulating element and disposed between the planar base element and the planar wall of the heat sink, the heat conduction means being resiliently compressible and increasing in heat conductivity efficiency as compression increases;

and means heat conductively connected to the circuitry member and operable as temperature increases through specific temperature conditions to urge the circuitry member against the force of the biasing means and towards the heat sink so as to progressively compress the heat conduction means and thereby progressively increase heat conduction from the planar base element into the heat sink, said means conductively connected to the heat sink subsequently being operable as temperature decreases through the specific temperature conditions to allow the biasing means to urge the circuitry member away from the heat sink so as progressively to release compression upon the heat conductivity means and thereby progressively decrease heat conduction into the heat sink, the means heat conductively connected comprising a plurality of piston and cylinder means, each of which comprises a cylinder, piston means movable within the cylinder and extending outwardly from the cylinder, and a phase change material within a chamber of the cylinder, the biasing means urging the piston means inwardly of the cylinder into a position dictated by the volume of the phase change material, the phase change material being in a solid phase at temperatures below the specific high temperature conditions and in a liquid phase at temperatures above the specific high temperature conditions, expansion of the phase change material accompanying change to the liquid phase so as to urge the circuitry member towards the heat sink.